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Chips stave - PowerPoint PPT Presentation

Modules assembly plan

Modules assembly plan. 19/09/2013. Detector layout. Layout -TDR-5 Baseline for TDR. Inner Barrel (IB) The Inner Barrel consists of the three innermost layers: Inner Layers layer 0, layer 1 and layer 2. Stave. Flexible Printed Circuit (FPC) or Flex. Inner Barrel (IB): 3 layers pixels

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Chips stave - PowerPoint PPT Presentation

Modules assembly plan