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Conductive glue in HF solution

This article discusses a method for using conductive glue in an HF solution to bead on polypropylene panels. It provides step-by-step instructions and details the changes observed in resistance. The conclusion highlights the effectiveness of the HF solution in removing epoxy between silver grains.

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Conductive glue in HF solution

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  1. Conductive glue in HF solution • Method: • Glue beads on polypropylene panels • ~10 mm x .5 mm diameter beads • (R ~ 4W before immersion) • Immerse in 50% HF, rinse, allow to dry • Measure resistance

  2. Results: • 1 min: R increases to ~10 MW • 5 min: glue falls off polypropylene panel, R >>10 MW • >1 hour: glue softens, but eventually becomes brittle again • 4 hours: slight brown color, surface rougher No HF 4 hours in 50% HF

  3. HF – 4 hours NO HF

  4. HF – 4 hours NO HF

  5. Conclusion: • HF solution removing epoxy between silver grains

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