FYS4260 –FYS9260 Chapter 1 Introduction: Electronic products, technologies and packaging

1. FYS4260 –FYS9260 Chapter 1 Introduction:Electronic products, technologies and packaging The course material was developed in INSIGTH II, a project sponsored by the Leonardo da Vinci program of the European Union Electronic Pack….. Chapter 1

2. Chapter 1 Introduction • FYS4260: Master level course • FYS9260: Ph.D. level course with additional syllabus and laboratory project • Lecturers: Per Ohlckers, Johan Tresvig, etc. • Laboratory supervisors: Johan Tresvig • Please find on Fronter the course web site and on the web site: http://www.fys.uio.no/studier/kurs/fys4260 . Vortex pages stinks! • Updated schedule. NB! Please check regularly – subject to changes! • Lecturing notes (ppt files and sometimes pdf files) • Guide for laboratory project(s) • Earlier exam tests and guides • Miscellaneous information (elektronic version of the textbook, etc) • Textbook: Leif Halbo and Per Ohlckers: “Electronic Components, Packaging and Production” Textbook, ISBN 82-992193-2-9, 330 pages, Un of Oslo, December 1995 • Mandatory reading: • The textbook, project work, lecturing viewgraphs, and tentatively some web pages for latest technology news. The download documentation from the StimesiII course, tentatively to be given on March 17th, 2011 at Sintef MiNaLab • The laboratory project work is mandatory. FYS9260 students have a second project • The company visits are strongly recommended, but participation is not mandatory • Exam training by answering earlier exam tests is very important in order do understand what is expected at the final exam test. Earlier tests and guides on the course web page. Electronic Pack….. Chapter 1

3. Chapter 1 Introduction • Detailed mandatory reading: • The complete textbook • The book could be more updated, but basic content is still valid. First of all get the overview understanding, then dive into the details, which sometimes are too much, for instance tables on material properties. • Laboratory project 1 (FYS4260 and FYS9260 students): • Design, assembly and testing of a surface mount printed circuit board. Graded with 20% weight based upon written report and oral presentation. • Project 2 (only FYS9260 Ph.D students): • Design of a microsystem flowmeter. Approved/not approved based upon written report. • Lecturing viewgraphs • NB! Please observe that the lecturing viewgraphs are better updated than the textbook and contains additional obligatory reading.(This is especially true for Chapter 9: ”Micro Structure Technology and Micromachined Devices” for instance the basic principles of Silicon Micromachining • Additional web-sites and downloadable journal articles, covering latest technology developments and trends: • Links and download instructions will be given on the course web site. • Download material from the microBUILDER course. • Oral information in the lectures: Mostly covering mandatory reading, but some additional issues will be covered as illustrations of important matters. Electronic Pack….. Chapter 1

4. FYS4260-9260 students 2013 • Total: 16 or 15 registered students FYS4260: • Afsharian, Mohammad Bagher ??? • Bechmann, Halfdan Solberg • Butt, Hussain Javaid  • Ghahramani, Maziar A • Grutle, Øyvind Kallevik • Johnsen, Andreas Leret • Mohamud, Cabdiwahab Omar A • Nygaard, Tønnes Frostad • Pedersen, Lars AndreaTrømborg, Jon Øyvind • Rabiee, Shirin • Spilling, Torjus • Stastad, Ole  • Surbehan, Fatih A • Søvegjarto, Bendik Sørensen • Waarum, Henrik FYS9260: • Mughal, Umair Najeeb On the next slide we will start with the first chapter. Electronic Pack….. Chapter 1

5. Definition ofELECTRONIC PACKAGING AND INTERCONNECTION TECHNOLOGY • "The realization of the physical, electronic system, starting with block-/circuit diagram” • Involves choice of technology for implementation, choice of materials, detailed design in chosen technology, analysis of electrical and thermal properties, reliability. • This definition is one among many, and may shift as the field is further developed. Electronic Pack….. Chapter 1

6. Multidisciplinarity of Electronic Packaging and Interconnection Technology • Requires combination of many disciplines: • Electronics • Materials properties and materials compatibility • Mechanics • Chemistry • Metallurgy • Production technology • Reliability, etc. • Product development should involve experts from the various fields, and the interdependence of the fields may be the most important to make a good product. Electronic Pack….. Chapter 1

7. TYPES OF ELECTRONICS AND DEMANDS ON THEM - EXAMPLES • Satellite electronics • Production volume: one unit, 20 years life required, no repair, very low weight and power, very high development cost acceptable • Life saving medical electronics • Similar reliability/power demand, may be in harsh environment (body fluids), medium production volume. Electronic Pack….. Chapter 1

8. Examples, cont • Telephone main switchboard • 10 year life, benign environment, very high complexity, low and high production volume, high price pressure • Military electronics • Very high reliability demands, in very rough environments. High development cost (and production cost) acceptable Electronic Pack….. Chapter 1

9. Examples, cont • Computers • High performance and reliability required. Very short product life, high production volume for some, small volume for some products • Consumer products (watches, calculators...) • Extreme price pressure, very short product life, low weight, power, very big market. No repair. Electronic Pack….. Chapter 1

10. There's Plenty of Room at the Bottom • “There's Plenty of Room at the Bottom”is a lecture given by physicist Richard Feynman at an American Physical Society meeting at Caltech on December 29, 1959.[1] Feynman considered the possibility of direct manipulation of individual atoms as a more powerful form of synthetic chemistry than those used at the time. The talk is considered to be a seminal event in the history of nanotechnology, as it inspired the conceptual beginnings of the field decades later. • The lecture is in the same way famous for foreseeing the broader developments of micro- and nanotechnologies from then to now and most probably for future years! Electronic Pack….. Chapter 1

11. Moore’s “Law”: Continuous evolution creating a revolution! Impact comment: See: www.youtube.com/watch?v=AWcV-eoJqT8 Electronic Pack….. Chapter 1 Exponential increase of transistor count on IC chips – doubling every 18th month, and decrease of feature sizes with time.

13. Development Phases • Market research • Gives product idea Electronic Pack….. Chapter 1

14. DEVELOPMENT PHASES, continued • Pre-study • Gives product suggestion • Defining overall specifications • Gives definition of product, simulation/lab model of critical parts • Prototype A • Main principles analyzed, important parts implemented, technology chosen Electronic Pack….. Chapter 1

15. DEVELOPMENT PHASES, continued • Prototype B • Detailed design, correct form and components. Ready for industrialization. • Industrialization • Prototype adapted to producability in available production equipment. New production line built if needed, pilot series made. • Marketing started, service planned • Full scale production • Product sale, maintenance, service Electronic Pack….. Chapter 1

16. LEVELS OF INTERCONNECTION Fig 1.2 Levels of interconnections in large electronic systems Electronic Pack….. Chapter 1

17. End of presentation of Chapter 1 Introduction:Electronic products, technologies and packaging • Important issues: • Definitions • Multidisciplinarity • Different types of applications with different requirements • Hierarchy for Levels of Interconnections • Questions and discussions? Electronic Pack….. Chapter 1