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News from IceMOS

News from IceMOS. Alessandro Mapelli CERN PH-DT. frame. baseline. Schedule update December 3 rd. today. Done.. First wafers sent to CERN. Bulk Si vs SOI flows. Silicon Etching. Etch measurements from the first 9 bulk silicon wafers. Channels etch 70um +/- 7um.

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News from IceMOS

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  1. News from IceMOS Alessandro Mapelli CERN PH-DT frame baseline GTK Collaboration meeting

  2. Schedule update December 3rd today Done.. First wafers sent to CERN GTK Collaboration meeting

  3. Bulk Si vs SOI flows GTK Collaboration meeting

  4. Silicon Etching • Etch measurements from the first 9 bulk silicon wafers Channels etch 70um +/- 7um Manifolds etch – total depth 285um +/- 25um IceMOS CONFIDENTIAL GTK Collaboration meeting

  5. Silicon Etching IceMOS CONFIDENTIAL GTK Collaboration meeting

  6. First wafers have been shipped.. • 3 bulk silicon wafers have been shipped on December 10th from IceMOS to CERN. • These wafers will be used to validate the last step of the fabrication process at EPFL with wafers from IceMOS. • It consists of the silicon etching with KOH to thin the acceptance area of the cooling plate. GTK Collaboration meeting

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