Thin Wafer Market

1. Thin Wafer Market Share, Size, Trends & Growth Drivers – 2026 The thin wafer market is projected to grow from USD 11.4 billion in 2022 to reach USD 20.6 billion by 2027; it is expected to grow at a Compound Annual Growth Rate (CAGR) of 12.5% from 2022 to 2027. Rising adoption of MEMS technology in portable health monitoring devices, reducing sizes of electronic devices, growing smartphone and consumer electronics markets and high amount of material saving is expected to fuel the growth of the thin wafer industry. Thin wafer market for CIS applications is expected to grow at a significant CAGR during the forecast period.” The thin wafer market for CIS application is expected to grow at a significant CAGR during the forecast period. CIS is used in mobile phones and other consumer electronic devices. The miniaturization of these electronic devices generates the need for thick and thin CMOS chips. Hence, to develop thin CIS chips, thin wafers are used during their fabrication. This has led to an increased demand for CIS thereby paving way for the growth of thin wafer market. Wafer dicing equipment to hold the largest market share of the thin wafer market during the forecast period” Wafer dicing dominated the thin wafer market in 2021 and is expected to follow the trend during forecast period. An increase in memory capacity and continuous package miniaturization require ultra-thin wafer dicing. In recent years, there has been an increasing adoption of RFID tags and SIP (system in package) for smartphones and other compact electronic devices. This has resulted in the rapid growth of finished semiconductor die with thickness less than or equal to 100 µm. This growing demand has made the processing of thin wafers an essential competence for many integrated device manufacturers. The increasing demand for high-speed dicing combined with superior breakage strength has paved way for an increased demand for the wafer dicing equipment. Download PDF Brochure: https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=255706993 Thin wafer market in Asia Pacific estimated to grow at the fastest rate during the forecast period Asia Pacific plays a pivotal role in the development of the electrical and electronics industry. A few of the leading thin wafer manufacturing companies such as Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), DISCO Corporation (Japan) are based in Asia Pacific. The high growth of Asia Pacific can be attributed to the surging adoption of high-end consumer electronics, such as wearables and smart home devices in China and Japan. The global semiconductor market is expected to unveil substantial development in the Asia Pacific region due to favorable economic conditions and increasing demand for consumer electronics. As Asia Pacific has low labor cost most of the thin wafers and wafer thinning equipment are manufactured in Asia Pacific and are exported to various regions. The significant growth toward manufacturing and the potential of China, Japan, and Taiwan are largely contributing to this growth trend. About MarketsandMarkets™ MarketsandMarkets™ is a blue ocean alternative in growth consulting and program management, leveraging a man-machine offering to drive supernormal growth for progressive organizations in the B2B space. We have the widest lens on emerging technologies, making us proficient in co-creating supernormal growth for clients. The B2B economy is witnessing the emergence of $25 trillion of new revenue streams that are substituting existing revenue streams in this decade alone. We work with clients on growth programs, helping them monetize this $25

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