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Analysis of Correlated Functional Process Variables for Nanomanufacturing Process Control. Xi Zhang Dept. of Industrial and Management Systems Engineering USF April 23, 2007. FPVs in CMP and Uniformity of wafer surface finish. Correlated FPVs and uniformity
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Analysis of Correlated Functional Process Variables for Nanomanufacturing Process Control Xi Zhang Dept. of Industrial and Management Systems Engineering USF April 23, 2007
FPVs in CMP and Uniformity of wafer surface finish • Correlated FPVs and uniformity • Mechanical variable: coefficient of friction (COF) • Chemical variable: slurry temperature on pad • The interaction between COF and slurry temperature may indicate process condition change and provide an opportunity for online detection. FPVs Uniformity defects Delamination Dishing COF (200Hz, 240s)
Research challenges and objectives Challenges of studying interaction in FPVs • Complex temporal & spatial variation patterns in correlated FPVs • Timing correlation • Magnitude correlation • Both • Interaction may occur in two or more multiple FPVs Objectives • Understand the complex interaction among FPVs • Model the timing correlation or synchrony among multiple FPVs • Detect change of synchrony for process condition monitoring
Detection of Synchrony Change Proposed procedure Correlated FPVs Filter phase extraction (Gabor method) phase dynamics modeling Synchrony change detection
Carriage Force sensor Wafer carrier Water feed pump Slurry feed pump Polishing pad Current & future work • Improve phase dynamics model by considering temporal patterns. • Study the timing correlation between slurry temperature and COF based on the new model. • Detect and diagnose uniformity problems in the bench-top CMP machine.
Integration of cyberinfrastructure tools • Two key measurement tools • Input:IR camera • Response:SEM • Success measurement: • Efficiency in data storage and analysis