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More than Moore. ITRS Summer Meeting 2008 July 14, 2008 San Francisco, CA. Functional Diversification (More than Moore). Scaling (More Moore). Continuing SoC and SIP: Higher Value Systems. Source: 2005 ITRS Document online at: http://www.itrs.net/Links/2005ITRS/Home2005.htm. Baseline
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More than Moore ITRS Summer Meeting 2008 July 14, 2008 San Francisco, CA
Functional Diversification (More than Moore) Scaling (More Moore) Continuing SoC and SIP: Higher Value Systems Source: 2005 ITRS Document online at: http://www.itrs.net/Links/2005ITRS/Home2005.htm
Baseline CMOS HV Power Sensors, Actuators Bio-chips, Fluidics Memory RF Passives “More Moore” “More than Moore” Computing & Data Storage Sense, interact, Empower Heterogeneous Integration System on Chip (SOC) and System In Package (SIP) Source: ITRS, European Nanoelectronics Initiative Advisory Council (ENIAC) 2007 ITRS “Moore’s Law and More” Definition Graphic Proposal
“More Moore” and “More than Moore” • “More Moore”: ScalingContinued shrinking of physical feature sizes of the digital functionalities (logic and memory storage) in order to improve density (cost per function reduction) and performance (speed, power). • “More than Moore”: Functional DiversificationIncorporation into devices of functionalities that do not necessarily scale according to "Moore's Law“, but provide additional value in different ways. The "More-than-Moore" approach allows for the non-digital functionalities to migrate from the system board-level into the package (SiP) or onto the chip (SoC). • The Challenge: Integration of MM with MtMCreation of intelligent compact systems.
Following Moore’s Law is one approach: Monolithic CMOS logic System-on-Chip Processor Radio • Advantage: • Smallest footprint • Disadvantage: • Limited functionality Storage Power Sensor Actuator More Moore
Adding More-than-Moore is another:System-on-Chip and System-in-Package Processor Radio • Advantage: • Full functionality • Disadvantage: • Complex supply chain Storage Power Sensor Actuator More Moore More than Moore
Proposal for MtM Study Group • Objective:Define and quantify value-adding parameters for functional diversification • Identify/elaborate Technical Parameters • Added Value to the target application • Usual ITRS goals: Grand Challenges, Potential Solutions, narrowing over time • Pitfall (Design): line item doesn’t “fit” • May need to “tweak” to “fit” the MtM taxonomy • Key parameters for MtM examples in marketplace • Involve IRC/ITWGs • A&P, Design, RF/AMS, Test, Interconnect, but open to other TWGs • Key Categories to address: Sensors, Actuators (MEMS, Optical) • Key Issue differentiating “MtM”: Integration • Next Meeting will be called by Mart Graef • TWGs notify Mart of their participant at the April ITRS meeting
MtM WG Basic Questions • What are the key parameters? • Quantitative • Development over time • What are the key drivers? • Functionality • Applications, business carriers