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Company Profile. XIAMEN G&P ELECTRONICS CO., LTD. Jiayi Industrial Park, Huli District Xiamen, Fujian province, China 361006 TEL:+86-592-6110703 FAX:+86-592-5700318 E-mail: xmfpc@globalsources.com http://www.globalsources.com/xmgp.co. Content of Profile. Company Information
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CompanyProfile XIAMEN G&P ELECTRONICS CO., LTD. Jiayi Industrial Park, Huli District Xiamen, Fujian province, China 361006 TEL:+86-592-6110703 FAX:+86-592-5700318 E-mail: xmfpc@globalsources.com http://www.globalsources.com/xmgp.co
Content of Profile • Company Information • Major Customer • MFG Process • MFG Capability • MFG & Test Equipment
Company Information • Xiamen G & P Electronics Co. Ltd specializing in the developing, manufacturing and marketing of flexible PCB. With advanced equipments and skilled workers, we produce 30,000 m2 FPC monthly at our ISO 9001-certificated factory in Xiamen. Each of our products is made of top-grade materials and compliant with the RoHS directives. Some well-known buyers such as Amoi Mobile and AOC source FPC from us because of our competitive price, reliable quality and prompt delivery. • Our greatest advantage over our competitors is our engineers. All of them is well trained and experienced. Currently they are focusing on improving technology, reducing cost and defect rate to meet a higher market standard. Just let our professional engineers work on your OEM/ODM orders.
Company Information • Factory area • Employees • R & D engineers • Capacity : 5000 Square Meter : 375 : 20 : 20,000-30,000 m2/month
Product Introduction • Advantage • Small Size • Light Weight • Flex-for-Installation • Dynamic Flexibility • Application • Note-Book • Digital Camera • DVD / CD-ROM • HDD • Printer • Scanner • PDA • Cellular Phone • LCD • Auto-Mobile
Mobile LCD OR LCM Our Customers
Major Equipment(1) NC Drilling Exposuring Room
Major Equipment(2) D.E.S.
Major Equipment(3) Hole-Punching CVL Lamination
Major Equipment(4) Elec.-test &Visual Inspection Screen Printing
Major Equipment(5) Blanking
Quality Assurance System • Incoming QC • Strict quality control and inspection are done at each stage of producing • 100% of In-process QC and Final inspection • Testing is carried out within three lab: chemical, physical and electric-test • Weekly quality report with statistical information • Prompt responses and feasible solution to customer‘s quality complaint.
MFG & Test Equipment(1) Peel Strength Testing Machine • 2-D MeasuremenSystem
MFG & Test Equipment(2) Micro Scope Swaying Test Machine
MFG & Test Equipment(3) X-ray Thickness Measurement Slice up Muller
Process Capability • General • Tolerance • Number of layer: 1-6 • Copper Foil: 1/3, 1/2, 1.0, 2.0 oz • Material: Polyimide (Kapton), PET, FR4 • Min. conductor width/spacing: 0.075 mm • Min. hold diameter: Drilling:0.20 mm Punching: 0.50 mm • Special Material Available: Halogen Free 2 mil PI • Conductor width: + / - 0.03mm • Hole diameter: + / - 0.05mm • Accumulated pitch: + / - 0.05mm • Outline dimension: + / - 0.05mm • Surface Treatment • Electrolytic Tin ( Lead free) Plating • Hot Air Leveling • Electrolytic Nickel and Gold Plating • Eelectroless Nickel and Immersion Gold Plating
2002 passedISO9001:2000 RoHS Approval by SGS report 2002 passed UL Honor Certificate (UL:E230743)