2x2 module & stave layouts

1. 2x2 module & stave layouts

2. 2 options • “Small chip” • “Big chip” • Boundary between “small” and “big” is determined by the 6” sensor wafer layout that must be compatible with bump bonding (will become clear later) • “Small” chip has also a more natural number of rows & columns, but this is probably a minor issue for chip design.

3. Parameters Normal col. width x row height = 250um x 50um

4. “Small” 4-chip module 34.8 37.5 Flex down to chip w-bonds 0.2 Active 32.8 x 32.8 34.8 Pixel orientation 15.0 Flex pigtail (connector plugs into page) 10.0 (vertical inter-chip gap 0.1mm)

5. “Big” 4-chip module 37.1 39.9 Flex down to chip w-bonds 0.2 Active 35.8 x 35.1 37.8 Pixel orientation 15.0 Flex pigtail (connector plugs into page) 10.0 (vertical inter-chip gap 0.1mm)

6. Loaded module stiffener flex 1.0 mm connector sensor chips glue Reduced scale 20 position connector would be used. Replace 10.22 dimension by 6.52

7. “Small” module outer stave Module on back 38.4 26.8 34.8 … 986mm End of stave card serving 8 modules (half a stave) along Z Can serve one face only (top or bottom) => 4 cards per stave Or can be a wrap-around end of stave card and serve both faces => 2 cards per stave. This way identical staves (including bus cable) design can be used over a wide radial range: 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius

8. “Big” module outer stave Module on back 39.9 29.8 37.8 … 946mm End of stave card serving 7 modules (half a stave) along Z (or 8 modules for 1082mm active length) Can serve one face only (top or bottom) => 4 cards per stave Or can be a wrap-around end of stave card and serve both faces => 2 cards per stave. This way identical staves (including bus cable) design can be used over a wide radial range: 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius

9. “Small” sensor 6 inch wafer • Active area = 7508 mm^2 • Sensor tiles shown with darker line • Wafer scale flip chip compatible. Chips shown with lighter line. • The name “small” 2x2 tile comes from the wafer layout. • A slightly larger chip and therefore larger 2x2 tile is possible, but only 6 such “large” 2x2 tiles will fit on a 6” wafer.

10. “Big” sensor 6 inch wafer • Active area = 7539 mm^2 • Sensor tiles shown with darker line • Wafer scale flip chip compatible. Chips shown with lighter line. • OPTION to make 4 6-chip modules per wafer instead of 6 4-chip modules.

11. “Small” single chip module • Using same chip as 4-chip module (hence “small”) • Active edge sensor • 2-side abuttable format active 16.4 16.2 18.7 16.2

12. “Big” single chip module • Using same chip as 4-chip module (hence “small”) • Active edge sensor • 2-side abuttable format active 17.9 17.4 19.9 17.7