WELCOME TO M&P TC Meeting

1. Materials & Processes Technical Committee Meeting May 27, 2015, Wednesday 7:00 - 8:00 AM Room 511, Sheraton San Diego Hotel & Marinna WELCOME TO M&P TC Meeting

2. Agenda • Introduction All • CPMT M&P TC Chair/vice-chair M J Yim • TC Activities 2015-2016 & Monthly newsletters M J Yim • ECTC M&P Subcommittee Diptarka Majumdar/Bing Dang • IEEE CPMT Advanced Packaging Materials (APM) Symp. 2016 • Other Conferences and activities • Open for anything else Attendees (in random order): Eric Perfecto, Diptarka Majumdar, Bing Dang, Kwang-Lung Lin, C.R. Kao, Tanja Braun, Yoichi Taira, M. J. Yim (chair), Jim Morris, Bill Chen, Chin C. Lee (past Chair), Rama & Kimberly (visit from Brewer Science).

3. 2015-16 CPMT TC Chair/Vice Chair Chair MJ Yim (Intel) Vice-chair Dongwook Kim (Qualcomm) Past Chair CC Lee (UC Irvine) Past Vice-chair Daniel Lu (Henkel China) http://cpmt.ieee.org/technology/105-tc-materials-a-processes-.html TC – M&P chair/vice-chair webpage updated by Marsha

4. 2015-16 CPMT M&P Committee • CPMT M&P TC Member list (as of 2015) USA: 25 Taiwan: 3 China: 3 Japan: 3 Germany:1 Korea: 1 Singapore: 1 Total: 37 Increase committee member By 2015: >45 By 2016: >50 Increase more Asia/Europe member

5. 2015-16 M&P TC Committee Activities • Communications: • A newsletter that covers all the news related to Materials. • The Chair, Vice Chair, and Executive Committee members routinely communicate through e-mail and telephone. • General membership receives announcements for conferences, workshops and symposia. • The highlights of the Materials Conference are summarized in the CPMT newsletter. • Meetings: • TC-5  Committee meets every year during the ECTC Annual Meeting. • TC-5  Committee will try to meet once a year outside of US. • The committee chair communicates with the Board of Governor. • The TC chair attends special meetings called by the TC Vice President to determine the future roadmap of the society. • A teleconference call or material webinar will be conducted when warranted. • Web Assets: • http://sites.ieee.org/cpmt-tc5/The site is primarily used for general announcements, committee newsletters and conference details. • Conferences: • Materials-related sessions during ECTC (TC-5 sponsors) • International Materials Conference (IEEE-CPMT (TC-5) co-sponsors) held every alternate year • International conferences on specific Materials (from time to time) (TC-5 sponsors) • International Conference on Electronic Materials and Packaging – every year in Asia (rotates between Singapore, South Korea, Japan) • Publications: • The Proceedings of Electronic Components and Technology Conference • The Proceedings of  Materials Conference (TC-5 co-sponsors) • The Transactions of CPMT – TC-5 contributes the technical papers, reviews potential papers for publication and acts as associate editors • The proceedings of Electronic Materials and Packaging (TC-5 co-sponsors) • Collaborative Efforts: • Actively collaborating with IMAPS, American Ceramic Society, American Society of Metals, Society of Plastic Engineers and Materials Research Society • There is a new push to start new collaborative international events. • Volunteers: • TC-5 has approximately 50 volunteers each year (37 as of 2015 list), consisting of the Executive Committee, the conference officers, the session chairs, paper reviewers and associate editors. TC-5 will try to reach out to international members by holding the technical committee meeting once outside of US. Current activities/formats written in TC-5 webpage

6. CPMT-M&P News Letter Status MJ Yim CPMT-M&P TC Web Administrator

7. Uploaded Newsletter and Contributors • 2015 • --- (To be uploaded from Ning Cheng Lee @Indium) • 2014 • October 2014 News Letter • Microstructure variation – electric current(Kwang-Lung Lin @ National Cheng Kung Univ.) • Sept 2014 News Letter • CPMT MP TC Newsletter Sept 2014-Micro pillar compression 2014(C. R. Kao @ National Taiwan Univ.) • May 2014 News Letter • CPMT MP TC Newsletter May 2014 DW KIM – Final(DW Kim @ Qualcomm) • 2013 • December 2013 News Letter • Silver flip-chip technology poster(CC Lee @UC Irvine) • November 2013 News Letter • 2013_Saint-Venant_CPMT_Materials_TC_120613(E. Suhr @Portland State Univ.) • October 2013 News Letter • IEEE CPMT-TC5 Materials and Process-MJ Yim-Oct-Newsletter-2013(MJ Yim @Intel) • August 2013 News Letter • CMPT MP TC Newsletter Aug 2013 (Paik)(KW Paik@KAIST) • Need more contribution from M&P members on monthly newsletter to facilitate networking and sharing. => Bimonthly or Quarterly newsletter • Need volunteer for web administrator from members.

8. 2015 ECTC: M&P Subcommittee • Chair Diptarka Majumdar/Bing Dang • Number of abstract submissions received Primary 89 • Secondary 82 • Number of abstracts accepted for presentation Oral 35 • Poster 15 • Sessions Chair Date Time • Adhesives, Underfills, TIMs Lejun Wang May 27 8:00 AM • Tieyu Zheng • Novel Materials & Processes Ivan Shubin May 29 1:30 PM • Mikel Miller • 3D Materials & Processing Myung Jin Yim May 28 1:30 PM • Bing Dang • Solders & Bonding Kwang-Lung Lin May 29 8:00 AM • Dwayne Shirley • Substrates Dong Wook Kim May 27 1:30 PM • Frank Wei

9. IEEE CPMT Advanced Packaging Materials (APM) Symp. 2016 • Conflict in 2015 with major packaging events in China • Decided to push out to 2016. • Time/date is TBD, but Shenzhen or Suzhou is recommended for hosting place. • Tim Chen will be general chair. 17th Int’l Conference on Electronic Materials and Packaging (EMAP) 2015 • Sept 1, Sept. 4, 2015 • Portland State Univ., Portland, OR, USA. • Prof. Sung Yi is general chair.