1 / 7

CCPD/HVCMOS status

CCPD/HVCMOS status. Mathieu Benoit, Dominik Dannheim. Summary. CCPD ASIC. Timepix ASIC. CCPD PCB was produced by Ivan Peric and assembled here at CERN Card digital and analog part have been tested and work correctly

thea
Download Presentation

CCPD/HVCMOS status

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. CCPD/HVCMOS status Mathieu Benoit, DominikDannheim

  2. Summary CCPD ASIC Timepix ASIC • CCPD PCB wasproduced by Ivan Peric and assembledhereat CERN • Card digital and analog part have been tested and workcorrectly • One cardgotbrokenafter a repair, we plan to cable one more to fit with the twoassemblieswe have • Special Timepix card to couple to the CCPD cardisbeing design and shouldsoon go into production

  3. Detector Assembly HV-CMOS WireBonding CCPD Card Timepix Card CCPD_TimepixCard SideView Timepix

  4. Pad connectedtoInjection Timepix Pads

  5. Detector Assembly

  6. CCPD Coupling to Timepix Chip

  7. Issue encountered 2 Chip glued to Timepix wereprovided by Ivan Peric • First chip presentedweird power consumption and has shown to beunprogrammable • Second chip worked as expected, Pulse injection and stimulation by Sr90 source couldbeseen in the Timepix • Wasworking fine beforeourdeparture for DESY , wire-bonds weredamagedatour return • Chip wasrebonded but acording to Ian, the bonding pad on chip are not suitable for rebonding • Afterrebonding , a shortcutseems to existwithin the chip • Next plan is to procure more chip fromIvan’sotherpartner (ATLAS) to glue on the same Timepix assemblies • Mechanicalstability and length of the bondingseems to be an issue, wecouldmodify a bit the single chip card design to get the boardcloser to the chip • Grounding in between the boardcouldshared in the next version

More Related