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Materials. R. Bates et al. K of PocoFoam under shear strength. PocoFoam conductivity ~10% of total sandwich Sample broke at 0.88 MPa Increase in Poco (plus glue joints) of 38% ANSYS implies max stress in foam of 0.47 MPa.
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Materials R. Bates et al.
K of PocoFoam under shear strength • PocoFoam conductivity ~10% of total sandwich • Sample broke at 0.88 MPa • Increase in Poco (plus glue joints) of 38% • ANSYS implies max stress in foam of 0.47 MPa New tests of samples with higher sensitivity (Poco~30%) gave similar results
Hysol with BN • Samples made with BN + vacuum + Degassing agent • Arrived at Glasgow today from RAL • Need to order more BN to continue these studies, including wetting agents • BN from Momentive not arrived • Need to chase SSC – groan! • Poco to S/S glue joint • Glasgow making simple flat samples – measure joint conductivity at QMU • Pipe to poco samples – understand if possible to measure contact with a transient technique.
Poco Modelling • Matlab code to generate a bubble material • Imported into Solidworks to generate a CAD item • Imported into Ansys for thermal/mechanical modelling • However, Poco informed us that they have discontinued production! • Should concentrate efforts on Allcomp materials – have some models from Ryan Page
Glue Module to bus/stave • Creep tests modules to Bus/Stave • Initial tests performed with DMA • Input required to understand shear force that might occur • Modelling work from Richard Bennett for this • Alternative glue? • Need to be able to remove a module from a stave • Need to make a test procedure to quantify ability to remove module from stave • Thermal conductivity of Intertronics IRS 2125 soon
Other Mechanical measurements • CFPR stress/strain relationship under tension • Measure with strain gauges to yield • New CFPR sample from Tim arrived at RAL • Bend tests of corrugated samples • New samples from Georg tested. • Results to be presented at Monday meeting
Radiation studies • Tim put in mechanical parts before Easter • Testing over summer? • Should irradiated any new glue or glue additive