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Report from Module Bonding Working Group

Report from Module Bonding Working Group. Salvatore Costa Universit à di Catania and INFN – Sezione di Catania. Outline. Global info on production bonding of the Modules Global review of Module bonding quality indicators Recent WG-wide activity

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Report from Module Bonding Working Group

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  1. Report fromModule BondingWorking Group Salvatore Costa Università di Catania and INFN – Sezione di Catania

  2. Outline • Global info on production bonding of the Modules • Global review of Module bonding quality indicators • Recent WG-wide activity • Selected highlights from individual Center reports

  3. Globalinfo on production bonding

  4. Production Summary

  5. Globalreview of Module bonding quality

  6. # Modules Pull Tested

  7. Pull Test Results NOT Angle-corrected 5g BA CT FI PD PI TO FL FL SB SB AC AC HH KA ST ST VI ZH .ss ss ss ss

  8. Pull Test Results Angle-corrected! [except *] * * 5g * BA CT FI PD PI TO FL FL SB SB AC AC HH KA ST ST VI ZH .ss ss ss ss

  9. RecentWG-wide activity

  10. Jigs for TEC module bonding We are continuing to monitor the effort going on in the TEC community to fabricate additional jigs in order to allow each given TEC module type to be bondable in at least 2 Centers. This is a table I showed at last Meeting, with updates added yesterday

  11. TID bonding jigs Made fot the TIB/TID Community by the Torino CMSTK group S.Brasolin, F.Dumitrache F.Benotto, M.Costa, L.Demaria, E.Migliore, P.Trapani, D.Gerbaudo, 3 rings 7 module geometries  3bonding jigs  3 HV back.repair jigs

  12. R1 3 position for alignmet pins (stereo L, Rphi, Stereo Right) Holes for mec.fixing and/or antivibration foam if needed Teflon height as First TIB bonding jig 3 sets ready + 1 protot.

  13. R2

  14. R3

  15. All 3 together

  16. Follow-up to Tracker MPR • There was a request from the Review Committee that each Bonding Center provide a detailed document on the Bonding Operation at that center, similar to the one provided by the US Centers (UCSB & FNAL):rolandi.home.cern.ch/rolandi/MPR/Module_production/K-S-reliability.pdf • Request fulfilled: • 12 needed documents collected Dec 20 – Jan 28 AM • Thanks to effort from all Bonding L3 Responsibles • Assembled into single doc  sent to Gian Mario on Jan 28, PM • Posted on bonding web site cms.ct.infn.it/bonding under the “Center Facilities” header • Snapshot of our current bonding facilities and experience worldwide

  17. DB I/F v. 5.0

  18. Hyb Pos from Gantry

  19. Mechanical Grading !!!

  20. VIEW Selection options

  21. Selected highlights fromindividual Center Reports

  22. TEC centers • Aachen:Provided loop documentation of the readout bonds(not of test bonds on PA Test Areas). • Strasbourg:Bonded 36 R7 modules from Lyon Gantry: no problems. • Vienna:Provided loop doc of the test bonds on PA Test Areas. • After setting up their "new" Delvotec 6400 (140 kHz) they have bonded 2 R2s modules until now and seen no problems. Old bonder still available. One operator trained w/ new machine; a second one will be soon. • Have new pull tester Dage BT22 well calibrated. Reads ~twice old one. • Zűrich: has been asked whether they could act as backup Center for TEC modules. Zűrich has bonded up to now R4 (regular), R6 and R7. The request is being discussed internally in Zűrich.

  23. TIB centers • Catania: Machine works well (compatibly with its age) after mechanical and electronics repair in Nov 2004 [already reported]. We have now matched in 2 modules the ~16 g of pull force usually reported by Zurich. This feature may be correlated to the U/S frequency of 60 kHz [native in our Hughes, modified down from 100kHz in Zurich Delvotec’s] • Second operator is now fully trained and has already bonded ~15 modules on his own • Firenze:In the post-bonding ARC test, 4 modules had Hyb ch #1 damaged. It corresponds to the first pad touched by the bonding machine…possible electrostatic discharge? • Pointed out that distribution of the glue under ground pad on back of sensor varies from one module to the other, making difficult to make those bonds in automatic way. Also reported that by changing machine par’s it is now easier to bond to the filter C pad even as its gold metallization is poor and variable as well. • Pisa: jigs have now been validated for all TID rings’ modules [at last Mtg only for R1]

  24. TOB centers • Santa Barbara: • Both machines are running smoothly. Had some intermittent errors on the 8060 machine, resolved after 2 days. • 2 People took a weeklong training course at K&S on machine maintenance and repair. • Trained another technician to deal with the increased production rates. • Recently have seen an increase in padlifts on the PA during PA to sensor bonding (in 6 modules out of a batch of 30). Alan Honma was informed, Gabriella was going to check on whether all PA's came from the same batch.

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