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What is the Chip Power?. Brian Maynard SU HEP GROUP 2-17-2010. Assumed Material Properties. 3. 13. 15. 45. 2. 15. Cooling Scheme.
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What is the Chip Power? Brian Maynard SU HEP GROUP 2-17-2010
3 13 15 45 2 15
Cooling Scheme For right now the cooling is applied in the model on top of a 5 mm thick layer of glue with k =1 W/mK at the outer perimeter of the diamond layer (~4 cm from edge of silicon)
Including Digital Section of Chip 0.5 W/chip Analog +1/R section of chip (RDP) Constant digital section of chip (DPB) The orange part of the chip is situated such that it is farthest away from the beam center
SummaryCooling at -35C Cooling applied from sides at 1.0cm from Silicon and from back at 1.5cm