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Wire bonding machine in KEK

Wire bonding machine in KEK. 8 Dec 2011 T. Tsuboyama (KEK). Ladder assembly in Japan. In order to perform ladder assembly in Japan, we need an automatic wire bonding machine. Tsuboyama and Onuki found only one company who produce wire bonding machine in Japan.

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Wire bonding machine in KEK

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  1. Wire bonding machine in KEK 8 Dec 2011 T. Tsuboyama (KEK)

  2. Ladder assembly in Japan • In order to perform ladder assembly in Japan, we need an automatic wire bonding machine. • Tsuboyama and Onuki found only one company who produce wire bonding machine in Japan. • “Cho-on-pa Kogyo”, east side of Tokyo. • http://www.cho-onpa.co.jp/english/ • Rotary head, thin-wire, wedge bonding is possible. • Controlled with Japanese is our preference. • Bonding area: 300 mm x 160 mm. We can bond wires to 2 DSSD sensors at once.

  3. As long as we (Japan group) buy a new wire bonding machine, we would like to build 2 layers, for example, L5 and L6. • Onuki will prepare a prototype ladder-assembly jig assuming this wire bonder. • Comments by Christian in the meeting. • An important function is automatic bonding parameter decision. You should confirm if this machine have such a function. • He prefers PA0 of ORIGAMI to be a single layer one, compared with the 2 layer one from TAIYO. This is because, 2 layer PA0 makes the wire bonding higher and raises the probability of interfere with PA1 and PA2 bending, gluing.

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