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Wire Bonding of Single-layer PA

Wire Bonding of Single-layer PA. SVD meeting. Test PA Dimensions. Pitch adaptor APV side Pad size: 35µm x 112 µm Line width: 18µm Spacing: 19µm Pitch pad to pad: 44µm line to line: 88µm APV25 Pad size: 58µm x 136µm Bond pads are smaller than that of the APV chip!. 2. Bond Test.

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Wire Bonding of Single-layer PA

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  1. Wire Bonding of Single-layer PA Christian Irmler (HEPHY Vienna) SVD meeting

  2. Test PA Dimensions Pitch adaptor APV side • Pad size: 35µm x 112 µm • Line width: 18µm • Spacing: 19µm • Pitch • pad to pad: 44µm • line to line: 88µm APV25 • Pad size: 58µm x 136µm Bond pads are smaller than that of the APV chip! Christian Irmler (HEPHY Vienna) 2

  3. Bond Test • Bonder: Delvotec 6400 • Wire:  25µm (our standard) • Wedge: Gaiser 2145-1520-1.0 • small wedge • intended for 17µm wire • but can be used for 25µm wire, too  smaller bond feet • Made around 20 bonds with different bonding parameters (US power, bond force) Christian Irmler (HEPHY Vienna)

  4. Bond pads are small, but wire bonding is possible without shorts • Single bond per pad  no second attempt • Can we make 2 pads per connection?  Enough Space? Christian Irmler (HEPHY Vienna)

  5. Bond foot dimensions Bond foot length: ~52 µm Bond foot width: 28 µm to 50 µm depending on bond force Christian Irmler (HEPHY Vienna)

  6. Pull Test • Good results, independently from used parameters • Result: 7 to 11.5g • Avg: ~10g  very good bondability Christian Irmler (HEPHY Vienna)

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