370 likes | 506 Views
Instrumented Molding Cell - Part 1) Interpretation - Part 2) Optimization. Priamus Users’ Meeting October 5 th , 2005 David Kazmer. Motivation. Optimize molding processes Faster set-up Faster cycle times Higher quality & fewer rejects Automatic quality assurance
E N D
Instrumented Molding Cell- Part 1) Interpretation- Part 2) Optimization Priamus Users’ MeetingOctober 5th, 2005 David Kazmer
Motivation • Optimize molding processes • Faster set-up • Faster cycle times • Higher quality & fewer rejects • Automatic quality assurance • 100% fully automatic cycles • Huge labor savings
Part 1 Part 2 Frequently Asked Questions • How do I interpret a cavity pressure trace? • How do I interpret a cavity temperature trace? • Which is better for detecting melt at end of flow? • Can temperature sensors detect changes in melt temperature? • Can these sensors detect an underfill condition? • Can these sensors detect underpack condition? • Can these sensors detect an overfill or overpack condition? • How should we setup our molding machine (w.r.t ram velocity, transfer, etc.)? • If only one sensor is used, what/where should it be? • What does the future look like?
Test Cell • 50 ton Electra injection molding machine • Instrumented mold • 2 temperature sensorsat end of flow • 4 pressure transducersnear gates • Priamus eDAQ data acquisition system
Sensor Locations • Also adding: • Ram position transducer • Nozzle pressure transducer • Digital input for switchover Temperature Sensors: • Temperature 1 – Tensile Test Bar, End of Fill • Temperature 2 – Flexural Test Bar, End of Fill Pressure Sensors: • Pressure 5 – Flexural Test Bar, Near Gate • Pressure 6 – Primary/Secondary Runner Intersection • Pressure 7 – Rectangular Stepped Plaque, Near Gate • Pressure 8 – Tensile Test Bar, Near Gate
Mold closed Filling Packing Cooling Gate freeze-off Process Data – Full Cycle
How do I interpret a cavity pressure trace? • Filling • Packing
How do I interpret a cavity temperature trace? • Heat Transfer • Q high during filling • k low during packing
Which is better for detecting melt at end of flow? • Pressure sensors may detect possible short shot if: • Cavity pressures are low at ‘fill’ • Cavity pressuresdecay quicklyat end of pack
Which is better for detecting melt at end of flow? • Temperature sensors will indicate short shot if: • Melt doesn’t reachtransducer • Impact specimen was short
Which is better for detecting melt at end of flow? • Pressure transducer signal to noise ratio • Ramp rate: 5000 psi/s • Variation: 19 psi • Signal level: 100 psi • S/N ratio: ~5:1 • Response time: 0.02 s • With noise
Which is better for detecting melt at end of flow? • Temperature sensor signal to noise ratio • Ramp rate: 465 C/s • Variation: 0.024 C • Signal level: 0.2 C • S/N ratio: 8.33 • Response time: .001 s
Can temperature sensors detect changes in melt temperature ? • Heat Transfer • Fast injection meanshigh Q & low dt • Slow injection meanslow Q & high dt • Max temperature isvery meaningful • S/N=625!
Can pressure sensors detect an overfill condition? • Peak cavity pressure indicates over-fill
Can temperature sensors detect an overfill condition? • Not really, peak temp indicates melt temp ? Hypothesis: Slope is indicative of rate of heat transfer, and possible thickness/flashing?
Can pressure sensors detect over or under packing? • Usually indicated by pressure at end of pack • Traces for tensile& impact specimensdecay prior to end ofpack • Gate is frozen off • Trace for steppedpart follows sprue • Gate not frozen off
Can temperature sensors detect under packing? • Not usually • Heat Transfer • Q,k≠f(P) • In this extreme case, parts shrinkfrom wall so low Q
Part 1 FAQ Answers • How do I interpret a cavity pressure trace? • Carefully, confounding of temperature, gate freeze, full cavity • How do I interpret a cavity temperature trace? • Readily • Which is better for detecting melt at end of flow? • Temperature, higher signal to noise ratio & response time • Can temperature sensors detect changes in melt temperature? • Yes, by looking at the peak temperature sensed • This result is not 1:1, more modeling being done… • Can these sensors detect an underfill condition? • Temperature: definitely, by no increase in local mold temperature • Pressure: sometimes, by looking at slopes after switchover • Can these sensors detect an underpack condition? • Temperature: not usually, sometimes in extreme cases • Pressure: usually, by looking at cavity pressure decay • Can these sensors detect an overfill or overpack condition? • Pressure: usually, by looking at peak cavity pressure • Temperature: not easily, but maybe
How should we setup our molding machine? • Scientific molding is: • Necessary but not sufficient • We can and need to do better • Integrated product, mold, and process design • Developing mold designs that are fit for purpose, and • Relating quality requirements to control strategies • Formal procedures for instrumentation & setup Lights out is only achieved in small minorityof vertical applications of captive molders!
If only one sensor is used, what/where should it be? • One sensor is not sufficient • Lack of observability • Recommend: • Screw position • Nozzle/hydraulic pressure • Cavity pressure sensor near gate • Temperature sensor at end of fill • Together, a single control strategy may be able to satisfy many molding applications • Family molds & multi-gated/cavity molds?
Setup of molding machine • Short shot study at constant ram velocity • Find required shot size • Start with single stage, no packing • Adjust VP transfer point for melt to reach key junction • Optimize one velocity step, similar to “scientific molding” • Add additional stages for each juncture (position vs. velocity) • Find required pack pressure to satisfy tolerances, using long pack times • Find the minimum packing time for gate freeze-off • Perform a packing pressure vs. cooling time study to find minimum cooling time • Adjust mold/melt temperatures to verify long term stability • Collect parts & identify process fingerprints • Implement centered molding process, relying on human validation until process fingerprints & QA system are validated • Implement fully automatic quality assurance
1. Short shot study at constant ram velocity • Find required shot size • 90 mm plastication • 20 mm switchover point • 10 mm cushion • Cushion could be reduced, but shot size is OK
2. 1st Stage Optimization • Adjust VP transfer point for melt to reach key junction • 2 mm stroke • All pressures about the same • Small length • Large diameter • 50 mm/sec selected
2. 2nd Stage Optimization • Adjust VP transfer point for melt to reach next key junction • 2 mm first stage • Next 28 mm stroke • Optimize velocity • 12 mm/sec • 25 mm/sec • 50 mm/sec • 100 mm/sec
Optimization Criterion:Integral of pressure (energy) • Pressure varies with velocity 50 mm/sec is best.
2. 3rd Stage Optimization • Adjust VP transfer point for melt to reach next key junction • 2 mm first stage • Next 28 mm stroke • Optimize velocity • 12 mm/sec • 25 mm/sec • 50 mm/sec • 100 mm/sec
Optimization Criterion:Integral of pressure (energy) • Pressure varies with velocity 100 mm/sec is best.
Setup of molding machine • Short shot study at constant ram velocity • Find required shot size • Start with single stage, no packing • Adjust VP transfer point for melt to reach key junction • Optimize one velocity step, similar to “scientific molding” • Add additional stages for each juncture (position vs. velocity) • Find required pack pressure to satisfy tolerances, using long pack times • Find the minimum packing time for gate freeze-off • Perform a packing pressure vs. cooling time study to find minimum cooling time • Adjust mold/melt temperatures to verify long term stability • Collect parts & identify process fingerprints • Implement centered molding process, relying on human validation until process fingerprints & QA system are validated • Implement fully automatic quality assurance Further development warranted & on-going.
What does the future look like? • Technology trends • Better, smaller, and cheaper sensors • Higher precision and faster data acquisition • Cheaper & faster computers/storage • Application trends • More applications will use sensors & DAQ • Automated control will improve, providing • More capability & lower barrier to entry • Outsourcing will plateau, limited by • Capability, infrastructure, shipping & other costs
Acknowledgements • We wish to thank Priamus System Technologies for their generous support and excellent capabilities