Wurth Plating Report Complaints Description Magic- 8D Report Hongye-Abnormal plating

1. Wurth Plating Report Complaints Description Magic- 8D Report Hongye-Abnormal plating Magic-Improvements Wurth-Analysis Magic-Overview analysis Magic-Conclusion

2. Wurth has highlighted 2 complaints as following: First complaint : PCAR NO:CAR_RMA12QS10843 Date:2012/3/3 Magic Part NO:SIHH1075-R25M-R47-R WE Part No:S08100040 Lot NO:248240011137000 Defect Description: Our Customer complained solderability problem. No solder fillet was formed after the SMT reflow process. Complaint Description

3. Second complaint : PCAR NO:CAR_RMA12QS11488 Date:2012/4/4 Magic Part NO:SIHH1075-R20L-R47-R WE Part No:S08100012 Lot NO:248240011133000 Defect Description: Our customer claimed a bad solderability which caused an open circuit between the component and the pcb-board after the soldering process at the ICTTester. Complaint Description

4. Regarding the first complaint (PCAR NO:CAR_RMA12QS10843), after studies and analysis made between Magic and Wurth , the following countermeasures has been taken: Caused Reason: insufficient Ni . Countermeasures taken: 1.Blocked all unsafe batches in stock. 2.Wurth requested that the plating can be done only in their assigned plating company (Hongye) or Hewei, other then these 2 is not permitted. 3.IQC added push off testing (5kgs) during incoming inspection. 4.Wurthdefined plating thickness as: Ni 1.27um min , Sn 4~6um Magic- 8D Report

5. According to Wurth request, Magic provided the clips to the plating company (HongYe) assigned by Wurth to proceed with the plating. On April 9th, Magic has found that some parts plated by HongYe cannot resist 5Kgs of push force and have immediately highlighted this issue to Wurth. On April 10th Mr. Jerry came to MagicTech and have confirmed the below analysis result after checking with our engineers: 1.The plating parts provided from HongYe cannot resist a push force of 5Kgs, the Ni break off situation was pretty similar to the situation of the second complaint. HongYe abnormal plating SIHH1075 Clip APLS0807 Clip

6. 2.Mr. Jerry and our engineers have bent the clip and found that a big area of the Ni layer has pilled off. 3. After checking the FQC report provided from the plating supplier, the plating thickness meets the thickness standard defined by Wurth. HongYe abnormal plating

7. In order to fulfill Wurth demand , Magic has immediately replace our existence plating supplier to HongYe (assigned by Wurth). On April 9th, Magic has found that some parts plated by HongYe cannot resist 5Kgs of push force and have immediately highlighted this issue to Wurth. Magic made the below arrangements regarding the plating pill off issue: 1. For the part APLS Series A- Perform push testing for the parts in stock, 40 pcs each batch after 3 times reflow. B- Provide the inventory list of the clips plated by HongYe to Wurth for further analysis. 2. For the part SIHH1075 As the parts plated by HongYe could not resist push force of 5Kgs, therefore we have change the plating supplier from HongYe to HeWei in order to fulfill Wurth demand. Magic-Improvements

8. On April 11th Wurth has provided a testing report regarding plating thickness to Magic based on different date codes.: 1137 Wurth-Analysis 1133

9. Wurth-Analysis 1140 1142

10. Wurth -Analysis 1150 1145

11. The overview analysis are: 1. On March 3rd we have received a solderability complaint from Wurth for the part :SIHH1075-R25M-R47-R、Lot NO:1137 Magic-Overview Analysis

12. 2. According to the XRF report provided from Wurth (Germany) for the Lot NO: 1137 we have learned that the solderability issue was caused by insufficient Sn on the plating, however, according to the XRF testing that Magic has performed in Wurth Asian Quality Center, the testing report showed that the solderability issue was actually cause by insufficient Ni on the plating and not by insufficient Sn. 1137 8D Magic-Overview Analysis

13. 3. On April 4th Magic received the second complaint from Wurth on the article S08100012/ SIHH1075-R20M-R47-R、Lot NO:1133, pill off between Sn and Ni layer causing so the component break off from the solder joint. Magic-Overview Analysis

14. 4. According to the XRF report provided from Wurth (Germany) for the Lot NO: 1133, we have learned that the solderability issue was caused by insufficient Sn on the plating and no Ni was detected, under this condition, the part can barely resist push force, so it may easily fall apart from the pc board, in addition, Ni is a major element that links the metal along with the Si layer. 1133 Magic-Overview Analysis

15. 5. According to the complaints received from Wurth, the date codes was between 2011/Aug/15th ~ 2011/Sep/12th Magic has buffered the date to 2011/Aug/1st ~ 2011/Sep/30th in order to analyze and verify our incoming record for the clips: Magic-Overview Analysis

16. Magic-Overview Analysis

17. 6. After analyzing the Lot NO:1140 and 1142 which were produced between 2011/Oct/3rd~2011/Oct/17th, we have investigated our incoming record to identify who was the supplier for these lots: According to the investigation, the lot 1140 and 1142 might be supplied from LuEn. Magic-Overview Analysis

18. 7. We have checked the plating thickness of the part recently provided from HeWei and have confirmed that the parts meet the thickness standard requested by Wurth. Magic-Overview Analysis

19. Magic-Overview Analysis

20. According to the report of the previous 2 pages, the clips provided from the plating supplier HeWei perform stable plating quality, therefore we could consider that the finish products using its clips are also good parts and the end customer will not face solderability issue. Magic-Overview Analysis

21. 8. According to the thickness analysis report provided from Wurthfor the Lot NO: 1140 and 1142 we can clearly see that there is sufficient Sn layer, even there is also Ni detected, but the Ni thickness cannot meet the standard request from Wurth which required 1.27um min 2 um avg. Magic-Overview Analysis 1140 1142

22. 9. Below is a comparison on the 2 complaints (lots 1137 and 1133) with the lots 1140 and 1142: Lot NO: 1137 Sn layer(3.36um avg) ,Ni layer too thick (3.67um avg).(solderability issue) Lot NO: 1133 Sn layer(1.971um avg) ,Ni layer (-0.026um avg).(plating layer break off). Lot NO: 1140 Sn layer(8.328um avg) ,Ni layer(0.606um avg). Lot NO: 1142 Sn layer(6.918um avg) ,Ni layer(0.877um avg). From above comparison we conclude that: 1137:Sn layer too thin causing solderability issue. 1133:Sn layer too thin and no Ni detected causing peel off between Sn and Ni. 1140: Sufficient Sn ,Ni layer detected but lower than Wurth thickness standard. 1142: Sufficient Sn ,Ni layer detected but lower than Wurth thickness standard. According to the incoming inspection record, the lots 1140 and 1142 were provided from the plating supplier LuEn and not from the supplier ShunTai which cause the complaints. Magic-Overview Analysis

23. For SIHH Series products Magic is now temporary using the clips from the supplier HeWei in order to fulfill the demands from Wurth. Magic has immediately transfer the plating supplier to the one assigned by Wurth (HongYe) , although the plating thickness meet the standard defined by Wurth, however, a break off issue on the plating has still been found. According the all testing datas provided from Wurth and the records investigations from Magic side, we conclude that the clips used for the production of the Lots NO:1140 and 1142 were supplied from LuEn, which has sufficient Sn layer and still can be detected over 0.5um of Ni layer, furthermore, after performing the push off testing based on the same Ni thickness parts, we have confirmed that it can resist a push off force far away over 5Kgs (), therefore, we assume that if these 2 lots can be released to the end customer. Please find below attached push off testing report. Magic-Overview Analysis