Network of Excellence ePIXnet: Towards Foundries for Photonic ICs

1. Network of ExcellenceePIXnet:Towards Foundries for Photonic ICs Roel Baets (IMEC – Ghent University) Meint Smit (COBRA - Technical University of Eindhoven)

2. Outline • What is ePIXnet • ePIXnet platforms • InP platform: JePPIX • Silicon photonics platform • Nanostructuring platform • Packaging platform • High speed characterisation platform • Cluster Computing

3. European Network of Excellence on Photonic Integrated Components and Circuits Mission: To provide Europe with a strategic advantage in Photonic Integration by joining forces of Europe’s key players and organising shared access to unique and expensive technological infrastructure 32 Partners + 18 Affiliates (> 60 research groups) • 22Academic • 11 research institutes • 17 industrial Europe’s excellence is on board

4. Photonic Integration (“Optical Chips”) Photonic Integration allows to • Exploit the economics of wafer scale integration • Implement complex functions (systems-on-a-chip) in a compact and cost-effective way • Improve performance • Align photonic components automatically by lithography !!!

5. Why ePIXnet? • Photonic integration depends on technologies with high investment and exploitation costs. • With time an increasing number of research groups will not be able to continue investing in state-of-the-art equipment • But this human capital should not be lost! • There is a need for infrastructure for • Research (non-industrial mostly) • Prototyping (non-industrial or industrial) • Manufacturing (industrial) • With a high degree of common know-how • Hence: need for restructuring

6. ePIXnet phase 1 (2004-2006) 14 loosely connected Joint Research Activities (JRAs) and Facility Access Activities (FAAs) ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet FAA ePIXnet FAA ePIXnet JRA ePIXnet JRA ePIXnet FAA ePIXnet JRA ePIXnet JRA ePIXnet

7. ePIXnet phase 2 (2006-2008) • Very expensive and unique infrastructure • Strong group of users • Offers stable and mature processes • Has an economic viability • Precisely defined functionality • Manageable access Facility Access Activities Integration Technology Platforms

8. PLATFORMS Joint research grouped around 6 technology platforms • Integration Technology Platforms • InP photonic integration platform • Silicon photonics platform (CMOS-compatible) • Supporting Platforms • Nanostructuring technologies for photonic integration • Packaging Platform • High speed characterisation platform • Modelling platform

9. ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet Platform ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet JRA ePIXnet Platform ePIXnet Platform ePIXnet ITP ePIXnet phase 2

10. The new ePIXnet structure • Sensors • InP AWG • Signal Processing • Photonic Crystals infiltration • Surface acoustic waves • Short Pulses • QD Arrays • InP QD • Passive SOI • InP membrane • Hybrid Integration • Nano Imprint Lithography • Focused Ion Beam • Non linear SOI • SOI modulator InP Modelling SOI Packaging Nano High Speed Char.

11. Exchange • Exchange of Researchers & Staff • Researchers get the opportunity to visit other groups and work in other labs • Share experts for courses & guiding PhD students • 82 exchanges during first 2 years

12. Outline • What is ePIXnet • ePIXnet platforms • InP platform: JePPIX • Silicon photonics platform • Nanostructuring platform • Packaging platform • High speed characterisation platform • Cluster Computing

13. JePPIX Mission JePPIX • To provide Europe with a strategic advantage in Photonic Integration • by joining forces of Europe’s key playersin order to create a solid infrastructure for • Research • Access to Photonic IC design and fabrication • Generic integration technology development • Innovation • Compatibility of academic and industrial processes • Launching startups • Launching foundry • Education • Training in photonic IC design and technology

14. Photonic integration 3 basic elements Waveguide Phase control Amplitude control  A Integration philosophy JePPIX Electronic integration 3 basic elements

15. Cascaded WDM laser optical crossconnect multiwavelength laser optical crossconnect tunable multiwavelength laser WDM-TTD switch wavelength converter picosecond pulse laser WDM ring laser Examples of chips JePPIX PWD+ERM PWD+SOA

16. Technical roadmap JePPIX User input to platform • Statement of interest by partners willing to join a run. • Design of a PIC (interaction with COBRA) • Adjustment of design (if required by COBRA). • Characterisation of fabricated chip. • Feedback to COBRA.

17. Technical roadmap JePPIX Platform Output • Verification of delivered designs. • Assembly of all accepted designs + adding test structures and generation of a set of masks. • Order the masks and check of fabricated masks. • Fabrication of the chip. • Sending to each partner its segment of the chip for characterisation. • Measuring test structures and report results to users.

18. Technical roadmap JePPIX What is offered? • Access to University process for Proof of Concept • Access to Industrial process for prototyping and small series • Access to foundry proces

19. Financial roadmap JePPIX • Funding Funding through R&D projects + structural support for shared technological infrastructure IndustrialResearch Projects European Research Projects Startups ePIXnet Joint Research Activities National Research projects Trans-National Research projects InP-based Integration Technology Platform

20. Outline • What is ePIXnet • ePIXnet platforms • InP platform: JePPIX • Silicon photonics platform • Nanostructuring platform • Packaging platform • High speed characterisation platform • Cluster Computing

21. The Silicon Photonics Platform SiliconPhotonics The platform provides a framework to • fabricate Silicon Photonic Circuits • for research (projects) and prototyping • using mature, stable processes • transferable to a commercial CMOS fab • at a reduced cost (sharing mask, processing) Partners: • IMEC (coordinator) • CEA-LETI www.siliconphotonics.eu

22. Submit design Designs are grouped Designs are fabricated Wafers are distributed Facility Access Programme SiliconPhotonics Platform coordination Platform users IMEC LETI Line Line

23. Available Standard Processes SiliconPhotonics IMEC • Passive waveguides and photonic crystals in SOI: • 200mm SOI with a Si thickness of 220nm • Deep UV at 248nm (193nm under development) • Optional top oxide cladding, CMP • Standard grating coupler module for fiber I/O (1550 TE/TM, 1300 TE) • Wafer thinning (750  300µm) and dicing LETI • Passive waveguides in SOI or amorphous SOI • 200mm SOI with a Silicon thickness of 50 to 400nm • 193 nm Deep UV lithography • Hard mask and side wall treatment • Optional top oxide cladding • Epitaxy of SiGe or Ge films onto SOI

24. Processes within next 6 months SiliconPhotonics IMEC • 193nm lithography • Photonic crystal pitches  300nm • Slotted photonic wires • First-order Bragg gratings • HF underetch for photonic crystal membraning • High-efficiency grating couplers (> 70% ?) • Inverted tapers using nitride overcladding LETI • will focus on the less-standard processing within the platform • Most processes available in CMOS are available but some process development may be required to get the desired results. • e.g. Processes for Ge photodetector

25. Photonic Circuits Some PICSOI10 examples SiliconPhotonics Processcomparison Karlsruhe UTwente IMEC Aarhus Inverted tapers New collaboration call- Fabrication of circuits with the 193nm DUV process- Deadline: May 7- Technical info: www.siliconphotonics.eu

26. Long-Term roadmap SiliconPhotonics A fabless model for Silicon Photonics • Technical Approach • Goal: All necessary photonic building blocks with CMOS-compatible technology • Process development is separate from the platform(other projects, in-house development) • Process transfer is done by the platform • Financial Base • Coordination: ePIXnet, continuing EU project • Facility Access is self supporting (cost model in place) • Process development: external projects • Process transfer: • currently external projects • more structural funding required in future (EU project) • FP7: Considering proposal for Support Action

27. Long-Term roadmap SiliconPhotonics A fabless model for Silicon Photonics • Risks and Challenges • Consolidate fragmented European Landscape • Standardizing (technology and design) • Transfer to commercial CMOS foundries • Major players are NOT in Europe • European players are not (yet) interested • BUT: LETI and IMEC have strong ties. • Other Actors and Competitors (on various levels) • EPIC • Foundries (e.g. BAe, Freescale) • Silicon Photonics SMEs • US is advancing fast in the same field, but very focused

28. Outline • What is ePIXnet • ePIXnet platforms • InP platform: JePPIX • Silicon photonics platform • Nanostructuring platform • Packaging platform • High speed characterisation platform • Cluster Computing

29. Photonic Crystal with suspended photonic wire bend The Nanostructuring Platform for Photonic Integration Nano • Provide access to world class fabrication facilities for Nanophotonic Devices • Users submit design then receive charactersiation ready device • Coordinator- William Whelan-Curtin (St Andrews) www.nanophotonics.eu

30. What's unique ?? Nano • Distinction to InP and Silicon Platform: E-beam lithography; not material specific • Distinction to other e-beam providers: • Closed loop (e-beam + etching) • Performance indicator (guaranteed performance of reference structure) • Access to multiple machines at different sites - can choose best machine for a given job • Focus on photonic crystals and wires. • Expansion to include Nanoimprint and FIB in the future

31. Functionality Nano Available Processes • Today • Silicon Photonic Crystals- membrane and SOI • Silicon Photonic Wires • GaAs Photonic Crystals- membrane and substrate • InP Photonic Crystals- substrate • GaAs Lasers • Tomorrow (next 6 months) • InP Photonic Crystals- membrane • Nanostructured GaAs lasers • Oxide backfilled Silicon Photonic Crystals and Wires • Improved device quality in a number of general areas

32. Technical roadmap Nano 5 years time • Flagship devices- Range of world class high profile results • Demonstrate capability for advanced and complex photonic integration- e.g. Active/passive InP and Silicon • Ability to make a number of useful performance quarantees

33. Financial roadmap Nano • Until Autumn 2008 (end of ePIXnet) • Primary users- ePIXnet JRAs • Primary funding- ePIXnet • Some external users • “Introductory offers”! • Post ePIXnet • Increased user base (ex-ePIXnet and others) • Users at least covering running costs • EU/National Grant applications for capital investment, subsidised access…

34. Outline • What is ePIXnet • ePIXnet platforms • InP platform: JePPIX • Silicon photonics platform • Nanostructuring platform • Packaging platform • High speed characterisation platform • Cluster Computing

35. Advanced Photonic Packaging Technologies Packaging Packaging Services: Array coupling Fiber pig-tailing Butterfly, … RF-packages Flip-Chip • Offered to ePIXnet-members & others • Individual low volume batches, shared-cost runs (reduce costs) • Provide range of application specific packages • As flexible as possible (type of application etc) http://claudia.intec.ugent.be/packaging

36. Platform Members Packaging Soldering Flip-chip Assembly HHI, UTwente IZM, TUB Fiber Pig-tailing Platform services: Pig-tailing and assembly TU Berlin (C) IZM UTwente HHI Advanced flip-chip, Solder metallurgy Advanced fiber Coupling/Pack. Pig-Tailing, SiON technology AuSn flip-chip, SOI-motherboard

37. Functionality Packaging • offer packaging solutions for all needs • simple pig-tail • thin film silicon bench • RF system integration, etc. • offer access to packaging technology development • be a catalyst for networking in packaging Platform = Interface between ePIXnet (academic), SMEs (industry) & packaging know-how + technology

38. Long-term roadmap Packaging Technical • well-assorted pckg. technology base • always give access to latest pckg. developments • be The address for pckg. technology promotion Financial • should be affiliated to one of core partners (2008) • small annual fee for participating companies • seek financial support (FED/EU) (2007/08)

39. Outline • What is ePIXnet • ePIXnet platforms • InP platform: JePPIX • Silicon photonics platform • Nanostructuring platform • Packaging platform • High speed characterisation platform • Cluster Computing

40. UMRFOTON High Speed CharacterisationPlatform PERSYST • To provide high speed characterisations of devices • Multi-site platform with 7 partners • CNRS-ENSSAT (PERSYST) • CAM • CEA • COM • HHI • ORC • RWTH • Coordinator : CNRS-ENSSAT • www.persyst.fr

41. Functionality PERSYST • Physical characterisations (some examples) • Pump probe measurements (dynamic response, non linear behaviour,…) • Electro-optical characterisations (determination of the component bandwidth, …) • System characterisations • Back-to-back measurements from 10 to 160 Gb/s (allowing to check the performance) • Transmission experiments from 10 to 160 Gb/s (some components need to be tested in cascade)

42. Long-term roadmap PERSYST • Difficulties: • Presently : 7 different organizations in 5 countries with different economic policies • Redundancies : some partners can deliver same services • Financial aspects: HSCP is a non-profit academic structure: funding needs cannot be 100 % covered on a pay-per-service basis

43. Long-term roadmap PERSYST • Roadmap phase I > > up to  the end of ePIXnet: • To check the efficiency of HSCP through results of characterisation work • To share a common view between partners on the future, and to elaborate a platform model (including all aspects: managerial, financial, etc...) • Roadmap phase II >> after ePIXnet ( > 2 years): • If phase I completed successfully:  towards an european structure for HSCP

44. Outline • What is ePIXnet • ePIXnet platforms • InP platform: JePPIX • Silicon photonics platform • Nanostructuring platform • Packaging platform • High speed characterisation platform • Cluster Computing

45. Grid computing Photonics Cluster Computing • What? • Access to clusters for virtual photonics • Why? • 3D simulations ask for huge computing capacity • Why platform? • Material & maintenance of computer clusters is expensive • The use of clusters at research groups fluctuates between 0% and 100%, Overall use < 30% • Contact • www.epixnet.org • Lieven Vanholme (lieven.vanholme@ugent.be) • Peter Bienstman (peter.bienstman@ugent.be)

46. Grid computing What is offered? • Provide access to 3D modelling software • MEEP • CAMFR • MPB • Cluster Infrastructure of photonic research groups • UGent: 10 CPUs • UPVLC: 20 CPUs • Other ePIXnet partners • Grid Infrastructure of European institutes • BEgrid, UGent part 250 CPU • UPVLC 60 + 50 CPU

47. Grid computing Long-term roadmap • In 5 years • Access on EGEE (20’000 CPU) • BEgrid • A “Photonics VO” (Virtual Organisation) instead of UGent VO • Trusted user is part of VO • Financial • EGEE rule: “Each virtual organization is expected to integrate computational resources into the EGEE infrastructure generally equivalent to its average consumption” • Managerial • Most can be done via EGEE website, • VO responsible should accept trusted users.

48. Outline • What is ePIXnet • ePIXnet platforms • InP platform: JePPIX • Silicon photonics platform • Nanostructuring platform • Packaging platform • High speed characterisation platform • Cluster Computing • Conclusions

49. Conclusions