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Design for Testability is not a new concept – Vayoinfo

Design for Testability (DFT) is not a new concept. It has been used with electronic appliance design for over 50 years. The reason there is simple: if you want to be able to test an built-in circuit both during the design stage and later in development, you have to design it so that it can be tested. Contact for design for testability, @ http://www.vayoinfo.com/design-for-testability/<br>

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Design for Testability is not a new concept – Vayoinfo

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  1. Design for Ttestability Intelligent DFx analysis intelligent software, pleasant work www.vayoinfo.com

  2. Are you always willing to stay with those issues? No thermal consideration, leads to cold solder, impact solder strength  Quality/reliability defects Silkscreen cross brings build and rework risk Stage Defects Remark >30% PCB design comes with problem. No thermal consideration Annual ring small Silkscreen error Silkscreen incomplete … • • • • Design • Tombstone Bridge Nonwetting >60% defects could be found prior to build Short Open Tombstone Cold solder Void … • • • • • • Void Manufacturi ng Repair rate for consumer product: 5%~37% in initial 3 years Solder joint crack Solder joint peeloff … • • • Via is too close to parts, it leads to poor solder joint, impact solder joint strength Crack risk Post-sales IPC research: 80% defects could be found and resolved at NPI stage.

  3. Change from DFx Past Today Yesterday Vayo customer solved this issue. They may still happen at your side. Above issues puzzles most of us. Ex.: Venture/SurfaceArt/Sierra/Sandisk… Vayo DFx software help you detect defects from the initial beginning.

  4. Company introduction  Founded on Jan of 2005, headquarter in China/Shanghai;  Dedicates to intelligent NPI software to accelerate design to manufacturing;  Fully in-house development, owns copyrights and patents;  Product installed >20 countries and regions worldwide;  Strategy partnership with equipment and EDA provider: Keysight/ViTrox/TRI/Fuji/Panasonic/Altium… >10 years dedication on NPI technology brings up the world-class product.

  5. Why DFx: predict/solve process issue IPC research: 80% defects could be found and resolved at NPI stage.  Predict defect opportunity, increase manufacturing quality and reduce cost With DFx consideration: Increase process difficulty & steps; rapid solder/assembly defects; increase rework rate and work loading; lower work efficiency and increase manufacturing cost

  6. Thanks! intelligent software, pleasant work www.vayoinfo.com

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