440 likes | 561 Views
Crystal collimation for LHC. Valery Biryukov IHEP Protvino Vincenzo Guidi Ferrara University and INFN Walter Scandale CERN CERN, Geneva, 24 April 2003. Borrowed from Ray Fliller’s talk at Paris EPAC 2002. Crystal Channeling. Beam line (70 m long) made of 3 crystals , IHEP.
E N D
Crystal collimation for LHC Valery Biryukov IHEP Protvino Vincenzo Guidi Ferrara University and INFN Walter Scandale CERN CERN, Geneva, 24 April 2003
Crystal design as used at IHEP Protvino and RHICCrystal is 3 to 5 mm along the beam
Crystal SQUEEZE Beam Direction 5mm Crystal Courtesy of IHEP, Protvino
Crystal extraction efficiency as measured since Dec 1997.85% is measured even when all stored beam is dumped onto crystal
Deflected (left) and incident (right) beamsas seen downstream of the crystal • Prior to the test, the crystal was exposed in the ring to 50-ms pulses of very intense beam (about 1014 proton hits per pulse). • No damage of crystal was seen in the test, after this extreme exposure.
RHIC Crystal Collimator Setup 8 Upstream PIN diodes 4 Downstream PIN diodes Data fill focus on upstream PIN diodes
Conclusion • Simulations and experiments promise • 10-fold improvement in backgrounds • at TeV accelerators if bent crystal is used as primary scraper. • No problems with high intensity or lifetime.
Extraction parameters • Protons • Energy at 1.3-70 GeV • Intensity 1012 protons in spills of 2 s duration • Efficiency greater than 85% • Equivalent to 1000 T dipole magnetic field Extraction efficiency vs. crystal length at 70 GeV
Structure of the bending crystal • Dimensions 0.5250mm3 • 1/R is the curvature experienced by channelled protons
Bending device • Bending exploits anticlastic effects due to anysotropy of crystalline Si • For the (111) direction the sample takes the shape of a saddle
Preparation of the Si samples I • Starting material is prime-grade, (111) oriented 525-m-thick silicon wafer • In previous runs there came out that a surface layer as thick as 30 m was rich in scratches, dislocations, line defects and anomalies that would reduce channelling efficiency • Such a layer originated in the mechanical cutting for manufacturing the samples • Thus we attempted removal of the layer
Preparation of the Si samples II • Preliminary cleaning to organic and metallic impurities from the surface of the wafers by H2O2, NH4OH, HF, HCl,... • Coverage of the largest surfaces by Apiezon wax • Cutting of the samples by a diamond-blade saw avoiding alignment with major crystalline axes. • Planar etching (HF, HNO3 and CH3COOH, 2:15:5) with a timing set for 30 m thinning. More info in Rev. Sci. Instrum. 73 (2002) 3170-3173
CRYSTAL S3 S4 EM S1 S2 VACUUM PIPE 7 meter Images of the beam deflected through mechanically treated (left) and chemically polished crystals (right)