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Project Title: CPS 2 Cyber Physical Systems (CPS-Equipment) enable manufacturing of CPS-Products

Project Title: CPS 2 Cyber Physical Systems (CPS-Equipment) enable manufacturing of CPS-Products Jochen Reisinger, Infineon Technologies Austria AG Villach in Austria , +43 676 8205 2056 Market 1: Manufacturing Equipment e.g. Germany 6000 companies (#1) – 860.000 employees

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Project Title: CPS 2 Cyber Physical Systems (CPS-Equipment) enable manufacturing of CPS-Products

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  1. Project Title: CPS2 Cyber Physical Systems (CPS-Equipment)enable manufacturing of CPS-Products Jochen Reisinger, Infineon Technologies Austria AG Villach in Austria , +43 676 8205 2056 Market 1: Manufacturing Equipment e.g. Germany 6000 companies (#1) – 860.000 employees Leading position of Europe in danger!! Market 2: CPS – OEM, Tier 1, Tier 2 e.g. Semiconductor !! – CPS Software

  2. Multi Domain & Multi Physics R&D • The T-Model = New Concept to link the R&D-Flows • HW&SW development chain from Tier 2 to OEM (Fig 1) • Product Challenge driven Innovation of Manufacturing Equipment R&D (Fig 2) • Full Chain from Requirement Management to Validation – Standardization • Multiple Research Domains & Markets- Fix: Semiconductor (Sensor, Signal processing, Control, Drivers, ..)- Mechanical Engineering – System view depending on OEM partnerships • Focus on ASP1: Methods and processes for safety-relevant embedded systems • And ASP4: Embedded Systems for manufacturing and process automation

  3. Real ECSEL approach: • CPS2 should start within ARTEMIS(System View) • Strong intention to go also for ENIAC(Component View) • There are some ideas to address EPOS(Umbrella) • H2020 Challenges will be taken into account (project links in mind) • Infineon offers Semiconductor Solutions for • Mobility / Automotive • Power / Energy Efficiency • Safety • & related Communication Challenges

  4. Consortium Status: • Well established partnerships from FP7, ARTEMIS, ENIAC and National (DE & AUT) projects • Partners involved: Siemens, Infineon Technologies AG, Infineon Technologies Austria AG, CISC, Joanneum Research, edacentrum • Partners Contacted: STM, NXP, AIT • Missing expertise: - additional OEM (Manufacturing Equipment) – ind, sme- as we are addressing a new collaboration and interaction concept at all => all new ideas are very welcome, FoF, Industry 4.0, IoT, ….

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