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PME (PWI MGF Electronics Box) Under the responsibility of JAXA coordinated with PWI & MGF

PME (PWI MGF Electronics Box) Under the responsibility of JAXA coordinated with PWI & MGF. <I-ICD> (Latest version which JAXA has.) -------------------------------------------------------------------------------------------------------- PME ICD-0MM004 Ver.5.2 (2008/07) JAXA [MHI]

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PME (PWI MGF Electronics Box) Under the responsibility of JAXA coordinated with PWI & MGF

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  1. PME (PWI MGF Electronics Box) Under the responsibility of JAXA coordinated with PWI & MGF <I-ICD> (Latest version which JAXA has.) -------------------------------------------------------------------------------------------------------- PME ICD-0MM004 Ver.5.2 (2008/07) JAXA [MHI] -------------------------------------------------------------------------------------------------------- MGF-I-E ICD-0MM004-1 Ver.5 (2008/07) SHI MGF-O-E ICD-0MM004-2 Ver.3.3 (2008/06) IWF MAST-WPT-E ICD-0MM004-3 Ver.5 (2008/07) NIPPI SORBET ICD-0MM004-4 Ver.E (2008/05) ObsParis AM2P ICD-0MM004-5 Ver.5 (2008/05) LPCE/CNRS MEFISTO-E ICD-0MM004-6 Ver.4 (2007/10) KTH [partial update: on 2008/08] IPD ICD-0MM004-7 Ver.2 (2007/12) MHI EWO ICD-0MM004-8 Ver.3 (2008/03) MHI =========================================================== WPT-Pre ICD-0MM011 Ver.3.0 (2008/07) MHI WPT-S ICD-0MM012 Ver.4.0 (2008/07) NIPPI MEFISTO-S ICD-0MM013 Ver.7 (2008/10) KTH MAST-MGF ICD-0MM016 Ver.2 (2007/10) NIPPI MAST-SC ICD-0MM017 Ver.2 (2007/10) NIPPI -------------------------------------------------------------------------------------------------------- 1

  2. PME (PWI MGF Electronics Box) Mass & Power – No changes from the last Design Meeting (Sep 2008) Mass PME-COM 2,460g (Chassis, Frame, IPD, Harness) PWI-E 1,980g (EWO,SORBET,MEFISTO-E, AM2P-E) MGF-O-E 170g MGF-I-E 388g MAST/WPT-E 490g ----------------------------------------------------------------------------------------------- Total 5,488g Nominal Max (Extension mode) -------------------------------------------------------------------------------------------------- EWO 7.43W 7.43W (incl. WPT-Pre/SC-Pre) SORBET 1.7W 1.7W MEFISTO 1.48W 1.48W 12W AM2P 0.79W 0.79W MGF-O-E 1.65W 1.77W MGF-I-E 2.78W 3.69W MAST/WPT-E N/A in nominal N/A in nomina 21.6W ------------------------------------------------------------------------------------------------- Total 15.83W 16.86W Power 2

  3. PME (PWI MGF Electronics Box) Plan of the PME integration/interface tests in 2009 (tentative) • The fundamental function checks of EWO, WPT-Pre, and IPD and their I/F checks • inside the MHI. • Function and I/F checks of the LF-SC/DB-SC with the SC-Pre. will be conducted • in Kanazawa Univ. • But the schedule is not fixed at this moment. • The extension tests of the WPT-S and MEFISTO-S are conducted • during the system EM integration test • (not conducted in Kyoto univ.). • PME unit level EMC tests will be performed in June 2009. • PME unit level environment tests will move to September, 2009. • [Shock test : the shock level definition by System STM Test before that.]

  4. PME (PWI MGF Electronics Box) EM Schedule for PME (July–Dec 2008)

  5. PME (PWI MGF Electronics Box) EM Schedule for PME (Jan–Jun, 2009)

  6. PME (PWI MGF Electronics Box) PME Unit Level check (April 2009) Site: EM shield chamber room of RISH, Kyoto Configuration: PME + MDP simulator without the PSU Installation of each board into the PME chassis and brief function check April 1-3: EWO/IPD April 6: SORBET April 7: MEFISTO April 8: AM2P April 9: SC/WPT-pre April 10: MGF-I/MGF-O TBC: MAST/WPT-E PME function tests April 13-17 Function tests: All PME teams PWI (& MGF) meeting : during or after EGU at Hungary or Austria C&DH interface test #2 TBC days (June 1-19, 2009) for PME [incl. WPT-S/MEFISTO-S/MAST extension test?] 3 days (June 22-24, 2009) for ALL One-month delay???

  7. PME (PWI MGF Electronics Box) Environment test (Baseline: Proposal) ??PSU?? July-Aug.: Thermal Function/Performance Test (details - TBC) by each

  8. PWI / WPT-S (1) Progress from the last design meeting (September 2008) * IICD: - Lower Side Prism Interface: in investigation * ITMM: Updated to Ver.4.0(080909) in early September 2008 * Mechanical: - Strength of the sphere holder: in investigation * Thermal: - Sun Shade for Lower Side Prism will be changed MLI Connection from the Hard Plate - Design the MLI Shape and Fixed to the Sun Shade of WPT-S - Calculating by Sun Shade modify model * TTM Design: - Interface of Lower Side Prism is in investigation * Sphere conductive coating: Will be Selected By TTM test (Aerodag or TiAlN) BepiColombo/MMO: PWI / WPT-SReport for MMO Design Meeting #11 [Jan 2009] 8

  9. PWI / WPT-S (2) Problems / differences from the nominal plan N/A (3) Schedule for MTM, TTM and EM tests ・TTM IICD Update：(Hard Shade or MLI Shade) in End January 2009 ・TTM Design and Manufacturing：in End March 2009 ・TTM 10-Solar thermal balance test：in early April 2009 ・TTM ITMM：in mid April 2009 ・TTM Delivery：in early May 2009 (4) EMC test result / plan (*1) e.g. EM, BBM, equivalent model (*2) DCB = DC and low-frequency Magnetic field / CE = Conductive Emission / RE = Radiation Emission (*3) ISAS, Kyoto Univ. (RE and CE), Kanazawa Univ. (RE04), or other 9

  10. PWI / WPT-S (5) Major A/I status ・ Negotiate the Sun hade for Lwr Side Prism to system. To be discussed today ・ Harness routing for WPT-pre and MAST/WPT-E should be arranged. (Almost closed) (6) Major request to System / other subsystems & payloads N/A (7) Others ・ Current Resources from IICD Rev.4 [no change from Sep 2008] Mass : Nominal 695gr (Max 695gr, Min 625.5gr) / 1 WPT-S Power : Nominal 7.5W (Max 8W, Min 7.5W) / 2 WPT-S 10

  11. PWI / WPT-S OLD NEW 11

  12. PWI / MEFISTO-S & -E BepiColombo/MMO: PWI / MEFISTO-S & -EReport for MMO Design Meeting #11 [Jan 2009] 1. Progress from the last design meeting (Sep 2008) • Since the previous design meeting two interface tests of MEFISTO-E, one in September and one in November, have been performed successfully. Unfortunately, the SORBET test scheduled for December had to be postponed. • MEFISTO-S development is proceeding as planned. 12

  13. PWI / MEFISTO-S & -E 2. Differences from the nominal plan <MEFISTO-E> • A double sweep can be performed inside a spin period.Two sweeps can be uploaded to a FPGA RAM area. • The time command is ignored by MEFISTO. • A command counter in the house keeping can be used for MEFISTO alive check. • The middle frequency overall gain is changed to 6dB. • Two different frequency responses for the middle frequency MEFISTO output can be selected by a relay command. • The output impedance to Sorbet is lowered to 50ohm. • The new EM board can hold an AX1000 or an Actel Flash. <MEFISTO-S Control> • By a single command fourteen ROM preloaded sweeps can be selected and executed. • 5A and A5 have to be sent to the motor control register before a motor  command can be executed. 13

  14. PWI / MEFISTO-S & -E 3. Schedule for MTM, TTM and EM tests • MEFISTO / SORBET interface test. TBS. • The final EM circuit board assembly will start in mid-January. A complete and fully tested board will be ready for delivery in mid-March. • Prototype preamplifier boards will be ready for testing in the end of January. 4. EMC test result / plan • A limited EMC test (CE) will be performed on the AX EM board. 5. Major A/I status • No vibration or thermal vacuum tests are foreseen on EM board level. • The board level EGSE is fully tested and ready for use. • The FM EGSE is under development in Oslo and will be ready for use in the end of April. 14

  15. PWI / MEFISTO-S & -E 6. Major request to System / other subsystems & payloads • Functionality shifted from MDP to MEFISTO may require power increase in MEFISTO (RTAX 250 to 1000) • A safe non volatile storage area (512 Bytes) for the two MEFISTO up loaded sweep tables is needed in the MDP (TBC). 7. Others • Radiation tests on AD590 and OPA602 (preamplifier located at the top  of the wire) using Co60 were performed as a student laboratory work in  November. • The OPA602 showed minor changes (0. 1%) of original performance at  180kRad and the AD590 had a linear degradation of maximum -1.4C/10kRad  up to 70kRad for the temperature range 0 to 60C. • AM2P can not analyze frequencies below 700Hz and as MEFISTO in orbit  calibration starts from 2Hz we need support, preferably from EWO, to  15

  16. PWI / SC BepiColombo/MMO: PWI / Search Coil MagnetometersReport for MMO Design Meeting #11 [Jan 2009] • Progress from the last design meeting (Sep 2008) • LF-SC • LF-SC in-house crosstalk was examined at Kanazawa (Nov. 10, 2008). • Crosstalk between Bx and By channels had been unacceptably large. • Some of PCB patterns were identified to be vulnerable against noise interference. • A new SC preamplifier “EM2” is designed (to be manufactured by Feb. 2009). • Some part of the preamplifier circuit will be modified for better performance. • PCB patterning will be improved so as to avoid the in-house crosstalk. • DB-SC • 3D+ preamplifier has been fully manufactured, delivered and tested alone and together with LF-SC preamplifier at Kanazawa. PWI/SCM 16

  17. PWI / SC • SCM EM Integration Test • DB/LF-SC EM integration test was performed at Kanazawa (Nov. 11-15, 2008). • Electrical and mechanical I/F (DB-SC, LF-SC, and MAST) was confirmed. • Electrical performance was confirmed to be almost compliant with specification. Some problems were spotted, including the non-negligible crosstalk from Bz(LF) to Bx/By. • Tri-axial sensor configuration on the MAST top plate, covered with MLI (Boots) was tested. No serious influence was found on the sensor performance. • Electrical performance will be more accurately calibrated at Chambon la Foret, France (Mar. 2009). • DB(LF)-SC and EWO-B I/F test was performed at Kyoto (Nov. 17, 2008). • Electrical performance was confirmed to be almost compliant with specification. • Crosstalk from DB-SC (Bz-LF) to LF-SC (Bx/By) was examined at Kyoto (Nov. 18, 2008). • Such a crosstalk was found to originate from the coupling between the PCB signal patterns on the preamplifier. PCB patterning and structure will be improved on the “EM2” preamplifier under development (by Feb. 2009). • DB-SC (HF) and SORBET I/F test was performed at Meudon la Foret. • Power consumption, dynamic, transfer function, calibration function, and noise (Dec. 04, 2008). PWI/SCM 17

  18. PWI / SC (2) Problems / Differences from the nominal plan • LF-SC EM sensors - Previous candidate for the core adhesive has failed to pass the outgas qualification test at Tsukuba. Another candidate has been prepared and will be tested soon, again at Tsukuba (January? 2009). • LF-SC EM preamplifier - Problems spotted during SCM EM tests should be solved with “EM2” (Mar. 2009). - Crosstalk among Bx, By and Bz. - Better electrical performance. • DB-SC preamplifier Transfer function resonance on LF output is under examination. • Others - Whiskers on Pb-free JFET. - How to evaluate vertical antenna effect? (SC with sensitivity to E-field) - FM procurement of 10uF capacitors. PWI/SCM 18

  19. PWI / SC (3) Schedule for EM tests • EM delivery completed: EM LF-SC sensors and preamplifier (August, 2008) EM DB-SC sensor (July, 2008), preamplifier (October, 2008) • EM test (2008) August 27-29: LF-SC component test (Kanazawa) September 04: LF-SC and EWO-B I/F test (Kyoto) October 20-29: DB-SC component test (CETP) November 10: LF-SC crosstalk test (Kanazawa) 11-15: DB/LF-SC EM integration test (Kanazawa) 17: DB(LF)-SC and EWO-B I/F test (Kyoto) 18: DB/LF-SC crosstalk test (Kyoto) December 04: DB-SC and SORBET I/F test (Meudon) • EM development and test schedule (2009) January-February: LF-SC-Pre “EM2” development & manufacture March: LF-SC “EM2” delivery & component test (Kanazawa) DB/LF-SC Full calibration test (Chambon la Foret) April: PWI EM integration test (Kyoto) May(TBC): Thermal test (ISAS), Vibration test (NIPPI) PWI/SCM 19

  20. PWI / SC (5) Major A/I status • Re-evaluation of grounding concept of MLI and harness shield : - Configuration: MAST Boots + MLI -> MMO body, Harness shield -> COM2 - Will be examined again at the full calibration test (Chambon la Foret, March 2009). • Maximum allowable level of magnetic field strength at each frequency : - Computation has been done. Now confirming the result. • Thermal design of SC-Pre with temperature tolerance (+95degC) : - Will be evaluated at the EM thermal cycling test (May? 2009). [LF-SC] • Adjustment of LF-SC calibration levels : - Preliminary adjustment has been done. - Will be confirmed at the full calibration test (Chambon la Foret, March 2009). • Outgas measurement for LF-SC sensor materials (core adhesive) : - Previous adhesive candidate failed. Another candidate will be tested soon (January? 2009). [DB-SC] • Measurement of DB-SC core Curie temperature : - New magnetic material has been fabricated and delivered. Curie temperature of composition n°8 is higher to 200°C (cf. graph) • DB-SC mechanical design update : Environmental tests will arbitrate (date TBD). PWI/SCM 20

  21. PWI / SC (4) EMC test result / plan (*1) e.g. EM, BBM, equivalent model (*2) DCB = DC and low-frequency Magnetic field / CE = Conductive Emission / RE = Radiation Emission (*3) ISAS, Kyoto Univ. (RE and CE), Kanazawa Univ. (RE04), or other (6) Major request to System / other subsystems & payloads • We would like to confirm the magnetic field noise levels produced by the vibration test facilities at ISAS/ESTEC, as too high voltages induced at each search coil sensor output could be harmful for its preamplifiers. • We would like to confirm the temperature range at both sensors and preamplifier level. • We would like vibration load specification at sensors level. (7) Others none PWI/SCM 21

  22. PWI / EWO BepiColombo/MMO: PWI / EWOReport for MMO Design Meeting #11 [Jan 2009] • Progress from the last design meeting (Sep 2008) • Analogue I/F tests with other PWI components (at Kyoto University) • EWO-MEFISTO-AM2P (Sept. 22 – 26, 2008) • Frequency response (MEFISTO-S-MEFISTO-E-EWO) • Noise level measurement (MEFISTO-S-MEFISTO-E-EWO) • Bias sweep control by the EWO-FPGA • LVDS I/F check between the AM2P and EWO-FPGA • Check of the interface of the AM2P synthesizer as the calibration source of the EWO • AM2P-S – MEFISTO-E – EWO I/F test • Mechanical fitness check of the MEFISTO-E and AM2P-E boards to the PME chassis • EWO-SORBET (Oct. 14-16, 2008) • SORBET-EWO signal level and noise level check • WPT-Pre-EWO-SORBET signal level and noise level check • Mechanical fitness check of the SORBET board to the PME chassis • EWO-SCM(Nov. 17-Nov. 18, 2008) • Frequency response(SCM-EWO) • Check of the crosstalk (SCM-EWO) • Check of the noise level (SCM-EWO) PWI/EWO 22

  23. PWI / EWO • Progress from the last design meeting (Sep 2008) • Digital I/F tests with other PME components • EWO-MDP I/F tests (Nov. 11-No. 14, 2008) • Commands and HK status checks • Data handling check based on the SpW interface • EWO-FPGA tests (Nov. 26-Nov. 28, 2008) • EWO-GSE check • Check of the digital waveform data of the EWO using the packet data • Check of the noise level of the EWO using the packet data • Check of the digital filter function implemented in the EWO-FPGA • Check of the bias sweep control • EWO-FPGA-AM2P I/F tests(Dec. 1-Dec. 3, 2008) • Check of the timing of control and data acquisition between EWO-FPGA and AM2P • Digital data collection of the AM2P synthesizer output through the EWO • Digital data collection of the AM2P synthesizer in the onboard calibration sequence • EWO-EFD-MGF-I synchronization test (Dec. 15, 2008) PWI/EWO 23

  24. PWI / EWO (2) Problems / Differences from the nominal plan • EWO-EFD • Re-adjustment of the bias circuit gain is necessary. • EWO-OFA/WFC • Crosstalk level of the EX1-EX2 channels should be improved. • Digital waveforms of the OFA/WFC(B) are distorted due to the effect of the analogue switch timing. • EWO-MEFISTO • The gain setting of EWO-OFA/WFC should be reconsidered based on the characteristics of the MEFISTO-S frequency response. • EWO-AM2P • Some modifications are needed in the logic between the EWO and AM2P in order to define the precise start timing of the AM2P synthesizer in the observed waveforms. • The onboard calibration sequence using the AM2P synthesizer should be re-considered in order to optimize the onboard data processing. • EWO-FPGA • The digital filters of the EWO-EFD and EWO(B) has not functioned properly. • Several logic errors found in the unit level have been found. PWI/EWO 24

  25. PWI / EWO (3) Schedule for EM tests • EM delivery completed: The final EM of the EWO will be delivered in the end of March, 2009. • EM development and test schedule (2009) April: PME EM integration test (Kyoto) May: C & DH I/F test #2 June: Environment tests in the PME level (5) Major A/I status • The OFA/WFC gain allocation is needed to be fixed. • The onboard calibration sequence should be designed considering the onboard data processing. The above A/I will be discussed in the PWI meeting on January 7th . • The radiation tests of the FET of the WPT-Pre will be performed as soon as possible consulting the delivery schedule of the FET used for the FM. PWI/EWO 25

  26. (4) EMC test result / plan PWI / EWO (*1) e.g. EM, BBM, equivalent model (*2) DCB = DC and low-frequency Magnetic field / CE = Conductive Emission / RE = Radiation Emission (*3) ISAS, Kyoto Univ. (RE and CE), Kanazawa Univ. (RE04), or other (6) Major request to System / other subsystems & payloads None (7) Others None PWI/EWO 26

  27. (1) Progress from the last design meeting (Sept. 2009) EM developments Unit tests SORBET has been tested and functionally validated Thermal testing to be done in the range -25 degC to +75 degC Interfaces verification tests EWO and WPT preamps: Done at RISH in Oct. 2008 MDP: Done at ISAS in Nov. 2008 and Jan. 2008 HF-SC: Done at LESIA in Dec. 2008 MEFISTO: To be done EM updates Daughter board will be updated for integration in PME chassis – April 2009 New EM version planned for environmental testing – June 2009 ASIC developments ASIC design TNR_ASIC fully validated HFR_ASIC need to be optimized – New version for 2Q/2009 ASIC qualification Specification (based on the ESCC-9000) for packaging and qualification 2 subcontractors contacted PWI / SORBET BepiColombo/MMO: PWI / SORBETReport for MMO Design Meeting #11 [Jan 2009] 27

  28. (1) Progress from the last design meeting (Sept. 2009) FPGA developments Improvement and optimization of the FPGA design Normalization of the VHDL code Improvement of the design reliability and the speed margin Reduction of the occupation area (from 95% to 85%) SpaceWire IP updated with its latest version (v1_01e11) Flight configuration, including the LEON3-FT IP, is on-going FPGA without socket(AX1000-1CQ352M) – April 2009 EGSE H/W module is under design – April 2009 Functionalities and interfaces definition Study of EMC/EMI cleanliness Design is in progress S/W tools Main functions almost finished (users interface, stimuli and data management) PWI / SORBET PWI/SORBET 28

  29. (2) Problems / Differences from the nominal plan None (3) Schedule for MTM, TTM and EM tests PME integration in April 2009 Daughter board and FPGA updates Environmental testing in June 2009 Mother board and HFR ASIC updates (4) Major A/I status EM updates 2nd EM version – Schematic and PCB FPGA in its flight configuration Modification of the HFR ASIC EGSE H/W design ASIC qualification (5) Major request to System / other subsystems & payloads None (6) Others None PWI / SORBET PWI/SORBET 29

  30. PWI / AM2P BepiColombo/MMO: PME / AM²P Report for MMO Design Meeting #11 [January 2009] (1) Progress from the last design meeting (Sep 2008) - AM2P-E EM tests with EWO and MEFISTO have been performed, no major problems, minor modifications on AM2P-E are needed; - AM2P-S EM electrical and mechanical check by MEFISTO team: OK; - Data analysis software basis has been tested with EWO/MDP simulator output file. - Mechanical frame manufacturing initiated (drawing study, lab mechanical department availability); - Radiation analysis for radiation tests on components made by TRAD. (2) Problems / differences from the nominal plan - TID/radiation tests on 3 references delayed due to the unavailability of the radiation test facilities. 30

  31. PWI / AM2P (3) Schedule for MTM, TTM and EM tests Jan. 2009: Update of FPGA code; Analog I/F tests with MEFISTO (January or February); Mechanical frame manufacturing; Software developer recruitment (arrival: beginning of 2009). Mars 2009: 2nd EM manufacturing, assembly and test with new FPGA April 2009: PME-EM tests in Kyoto with EM V2.0 and home-made mechanical frame. (4) EMC test result / plan No EMC test on AM2P-E. 31

  32. PWI / AM2P (5) Major A/I status - EM Analog interfaces with EWO and MEFISTO: status OK. - EM digital I/F with EWO need to be modified. Minor anomalies have been discovered. AM2P-E FPGA needs to be updated. (6) Major request to System / other subsystems & payloads None. (7) Others *new* To MEFISTO and WPT: AM2P embedded software can make calibration signal analysis from 682 Hz up to 144 kHz. 32

  33. BepiColombo/MMO: PWI/SoftwareReport for MMO Design Meeting #11 [Jan. 2009] (1) Progress from the last design meeting (Sep 2008) Design of the PWI software Base concept of the payload main-task and sub-task was defined. Baseline of flow-chart for main-task and sub-task is under construction. Detailed design for payload main-task is going on. I/F between main-task and sub-task is now under negotiation with each sub-task group. (2) Problems / differences from the nominal plan None PWI / Software [in MDP] PWI / Software [MDP] 33

  34. (3) Schedule for MTM, TTM and EM tests N/A (4) EMC test result / plan N/A PWI / Software [in MDP] (5) Major A/I status • Estimation of CPU load and work area resource for each function. (6) Major request to System / other subsystems & payloads None (7) Others None PWI / Software [MDP] 34

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