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VFCAL Report

Detailed report on laser alignment system infrastructure, sensor testing facilities, and current design challenges for sensor diagnostics at MPI Munich. Includes information on laser beams, prototype progress, sensor measurements, rooms, instruments, and future design plans.

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VFCAL Report

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  1. VFCAL Report W. Lohmann, DESY Laser alignment system Infrastructure for sensor diagnostics Sensor test facilities FE design Labs involved: Cracow UST, Cracow INP, Prague (AS), Tel Aviv Univ. DESY (Z.) MPI Munich

  2. Current design (Example LDC, 14 mrad): LumiCal (Luminometer) TPC HCAL BeamCal ECAL Challenges LumiCal: -control of position on ~10 mm level -control of the inner acceptance radius on ~mm level BeamCal: -radiation hard sensors (~10 MGy/year) Both: -compact (smallest possible Moliere radius) -readout after each BX MPI Munich

  3. Laser alignment system Wojciech Wierba et al., INP Cracow Two laser beams (one perpendicular, second with 45˚ angle to the sensor plane) allows to measure XYZ translation in one sensor MPI Munich

  4. Results and Status xy z +- 1 mm +- 5 mm • New lasers with aspherical lenses – better spot. • Setup with two lasers – avoid beam splitting • Compact prototype – in progress (new person involved) • Reference measurement of XYZ translations – Renishaw industrial system (0.1 μm resolution) • Stability tests MPI Munich

  5. Infrastructure for Sensor Tests • How can we characterize a sensor? • I/V measurement with both polarities • C/V measurement (semiconductor (Vdep ?) or insulator?) • spectrum for MIPs (charge collection efficiency) • charge collection, leakage current etc. vs. irradiation dose • … • Always check calibration, data integrity, repeatability • Bookkeeping of data: from files to a data base H. Abramovicz, W. Lange et al., TAU, DESY Measurement of mip spectra MPI Munich

  6. Infrastructure for Sensor Tests • Rooms (Cracow, DESY): • two rooms with filtered air (10k), stabilized temperature • room 1: bonding and assembly • room 2: all measurements without radioactive source • Instruments: • manual prober in a shielded box (light, electrical screening) • manual prober for probe cards (chip testing) • microscopes with a large object distance • manual bonding machine with x-y computer control • glueing tools, oven etc. • computer controlled instruments (I, C, V, V and I sources) Prob Station in TA MPI Munich

  7. Test Beam Equipment exit window of beam line collimator(IColl) Faraday cup (IFC, TFC) sensor box (IDia, TDia, HV) MPI Munich

  8. FE design and studies H. Henschel, M. Idzik et al., Cracow Univ., DESY Readout board for PHY3 chip with - control input/output - level shifters - biasing switches & networks - power connector - 18 FE inputs - Amplifier MPI Munich

  9. Testmeasurements with Phy3 Sequential Readout • definite charge of 0.33pC injected into one channel after the other • readout with (slow) clock, hence considerable decay of captured charge is observed MPI Munich

  10. Future Design • signal from 4 fC (mip) to 6 pC • high occupancy – no multiplexing • DC coupled sensors, Cdet 20 -120 pf + fanout (~1pF/cm) • 300 (150) ns between bunches • limited power dissipation (~10 mW/ch) • Charge sensitive • test and physics mode variable gain • test mode: S/N ~ 10 physics mode: > 11 bit • Tpeak: 50-70 ns MPI Munich

  11. Plans and Summary • First prototype submission in 2-3 months • Testbeam application planned • More studies on general readout architecture necessary • Compatibility with mechanics/cooling • First steps are done: • Test beam equipment partially available and running, completion is ongoing • Laser alignment ‘proof of principle experiment’ under construction • Test facilities for sensors in Zeuthen and Tel Aviv; Zeuthen will be upgraded, Tel Aviv started to collect equipment • FE electronics development started MPI Munich

  12. MPI Munich

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