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Explore thermodynamic modeling, lattice stability, and phase evolution in materials science research. Investigate alloy design, interface reactions, and phase field simulations using computational methods. Collaborate with experts to advance scientific understanding.
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Byeong-Joo Lee Computational Materials Science & Engineering Lab.Pohang University of Science & Technology Computational Thermodynamics
R&D in Materials Science and Engineering Structure Evolution Materials Property Process Condition Research Type I : experiments first, then thinking Research Type II: think first, then do experiments
Thermodynamic Assessment – Cr-Ni Binary System LfccCr,Ni = 8030 – 12.8801·T + (33080 – 16.0362·T)(1-2XNi) LbccCr,Ni = 17170 – 11.8199·T + (34418 – 11.8577·T)(1-2XNi) LliqCr,Ni = 318 – 7.3318·T + (16941 – 6.3696·T)(1-2XNi) B.-J. Lee, 1992
Thermodynamic Assessment – Fe-Cr-Ni Ternary System B.-J. Lee 1993
Thermodynamic Modeling – Gibbs Energy For a Phase with Formula Unit, (M1,M2,…,Mi,…)a(Va,C,N)c
Thermodynamic Modeling – Gibbs Energy For a Phase with Formula Unit, (M1,M2,…,Mi,…)a(Va,C,N)c
Thermodynamic Database for Steels –TCFe2000 → TCFe2 → TCFe3 Fe-Cr-Ni-Mo-Mn-Si-C-N +Nb-Ti-V-W-Al-Co-Cu-B-O-P-S 8C2 = 28 Binary Systems8C3 = 56 Ternary Systems19C2 = 171 Binary Systems19C3 = 969 Ternary Systems
Solution Model - liquid and fcc Fe-C alloys fcc : (Fe)1(Va,C) 1 Liquid : (Fe,C) Ternary (Fe,Mn)a(Va,C) c
Computational Thermodynamics의 적용 분야 Structural Materials (Steel, Solder, Al-, Ti-, Ni-, Mg-alloys), Semiconducting Materials, Ceramic Materials, Hydrogen Storage Materials, CVD process 등 열역학이 지배하는 모든 물질계 Thermodynamic Calculation – Application to Alloy Design
Thermodynamic Calculation – Application to Alloy/Process Design AB1: 0.1C-5MN-7Al AB2: 0.2C-4Mn-6.6Al AB3: 0.3C-3.5Mn-6Al AB4: 0.4C-3.5Mn-5.8Al AB5: 0.5C-3Mn-4.9Al AB6: 0.3C-4Mn-7.3Al-0.05Ti
Assessment of thermodynamic properties in the Li-Al-H ternary system
Driving force of CVD Deposition ※ Example: Deposition of Silicon SiH4 + 2Cl2 = Si + 4HCl
Interfacial Reaction between Cu and Various Solder • Experimental Observation • ▶ Cu/Sn : Cu6Sn5 • ▶ Cu/Sn-Pb eutectic : Cu6Sn5 • ▶ Cu/Sn-Ag eutectic : Cu6Sn5 • ▶ Cu/Sn-Zn eutectic : CuZn_γ • ▶ Cu/Sn-In eutectic : Cu2(Sn,In) or Cu2In3Sn
Application to Solder/Substrate Interfacial Reactions – Cu/Sn Reaction
Application to Solder/Substrate Interfacial Reactions – Cu/Sn Reaction
Computational Materials Science & Engineering Lab.Pohang University of Science & Technology, Korea Thermodynamics Nano Materials Eunha Kim Inyoung Sa Byeong-Moon Lee and Byeong-Joo Lee
Curvature Effect– Capillary Pressure System condition T = constant Vα = Vβ = V = constant @ equilibrium
Curvature Effect– Capillary Pressure Effect on Melting Point of Nano Particle
Melting points of Nano Particles: B-J Lee, 2009 Pt Ni Au W Mg Pt
Melting points of Nano Wires: B-J Lee, 2009 Ni Pt Au W Mg Pt
Vapor-Liquid Liquid-Solid SiH4 + GeH4 + H2 ① ② Reactions during the VLS Process
Vapor-Liquid Liquid-Solid SiH4 + GeH4 + H2 ① ① ② ② Reactions during the VLS Process 200 torr 400 oC
Size dependence of SiGe nanowire composition CALPHAD (2008)
Interfacial Phenomena – Segregation (Guttmann, Butler/Tanaka) Assume a one atomic layer surface phase and consider equilibrium between bulk and surface where ωi is the molar surface area Assume ωi = ωj = … = ω
Computational Thermodynamics as Materials Genome Computational Thermodynamics + First-Principles Calculation
Application to Metal/Ceramics Interfacial Reactions – Ti/Al2O3 Reaction
Application to Metal/Ceramics Interfacial Reactions – Ti/Al2O3 Reaction
Phase Field Simulation of γ→α transformation in steels Wetting angle : 36o Wetting angle : 120o Fe - 0.5% Mn – 0.1% C, dT/dt = 1 oC/s from SG Kim, Kunsan University
Summary Computational Thermodynamics • Calculation of Multi-component Phase Diagrams • Interfacial Reactions • – Metal/Liquid Solder, Metal/Ceramics • Thin Films Reactions • – Metal/Silicon • Thermodynamics of Nano Materials • – Capillarity Effect