CS/COE0447 Computer Organization & Assembly Language

1. CS/COE0447Computer Organization & Assembly Language CHAPTER 1 Part 1

2. Five Computer Components

3. Embedded Computers • Not directly observable • Very widely used in many applications • Examples:

4. Today’s Topics • Layered approach to computer design • Machine code example • Components of ISA • Computer implementations • Inside a PC • IC technology and its trends • Input/output devices • Main memory • Secondary storage • Network • IC process overview

5. Architecture Microarchitecture Logic gates Transistors Layered Approach in Computer Design Computer Architecture or Instruction Set Architecture

6. void swap(int v[], int k) { int temp; temp = v[k]; v[k] = v[k+1]; v[k+1] = temp; } swap: muli $2, $5, 4 add $2, $4, $2 lw $15, 0($2) lw $16, 4($2) sw $16, 0($2) sw $15, 4($2) jr $31 00000000101000010… 00000000000110000… 10001100011000100… 10001100111100100… 10101100111100100… 10101100011000100… 00000011111000000… assembler compiler Machine Code Example

7. Components of ISA • In most cases, a “programmer’s reference manual” (PRM) will disclose the ISA of a processor • To understand an ISA, find in PRM • Data types the processor supports • Supported instructions and their definitions • Registers (general-purpose & special purpose) • Processor modes • Exception mechanism

8. Inside a PC • Integrated Circuits (ICs) • CPU (Central Processing Unit), companion chipset, memory, peripheral I/O chip (e.g., USB, IDE, IEEE1394, …) • Printed Circuit (PC) boards • Substrate for ICs and interconnection • Distribution of clock, power supply • Heat dissipation • Hard disk, CD-RW (DVD-RW), (floppy disk) • Power supply • Converts line AC voltage to regulated DC low voltage levels • GND, +/-12V, +/-5V, … • Chassis • Holds boards, power supply, and provides physical interface for user and other systems • Connectors and cables

9. Integrated Circuits • Primarily crystaline silicon • 1mm~25mm on a side • Feature size: 90nm ~ 130nm • 100 ~ 1000M transistors • 25 ~ 250M “logic gates” • 3 ~ 10 metal “conductive” layers • CMOS (Complementary Metal Oxide Semiconductor) technology • Package spreads chip-level signal paths to board level • Provides heat dissipation • Ceramic or plastic with gold wires • 8 ~ 1000 leads • Various form-factors and shapes

10. Printed Circuit (PC) Boards • Fiberglass or ceramic • 1 ~ 20 conductive layers • 1 ~ 20 inch on a side • IC packages are mounted and soldered on a board

11. Technology Trend (Processor Complexity) 2x transistors/chip every 1.5 years!

12. Memory Capacity Trend (DRAM) 1.4x/year or 2x every 2 years 8000x since 1980!

13. 1.54x/year Processor Performance Trend Intel P4 2000 MHz (Fall 2001)

14. Technology Advances • Memory • DRAM capacity: 2x / 2 years (since ’96) • 64x size improvement in last decade • Processor • Speed (in terms of clock frequency): 2x / 1.5 years (since ’85) • 100x performance improvement in last decade • Disk • Capacity: 2x / 1 year (since ’97) • 250x size improvement in last decade

15. Your PC After Graduation • Processor speed • 6~8GHz • Memory capacity • 4GB~8GB • Disk capacity • 1000GB or 1TB • New units: Mega to Giga, Giga to Tera, (Tera to Peta, Peta to Exa, Exa to Zetta, Zetta to Yotta) • New, faster serial interfaces for various peripherals

16. My First PC (@college) • IBM PC AT • Based on 80286 (80586 is Pentium-1) • Processor speed • 20MHz (?) compared to 5,000MHz • Memory capacity • 1MB compared to 4000MB • Disk capacity • 40MB compared to 1000GB • No CD-ROM! • 14 inch monitor (not flat!), VGA (640x480) • Wheel mouse • 2 buttons

17. Input Devices • Accepts input from human (or from other machine) • Desktop computers • Keyboard • Mouse (touchpad) • Joystick • … • Servers • Terminals on network • Cell phone – Embedded computers • Keypad

18. Input Devices, cont’d • Mouse • Wheel mouse (hard to find nowadays) • Optical mouse • Takes 1,500 “photo shots” of LED reflection to detect any movement • Keyboard or keypad • Not many changes so far • Web camera • Voice recognition • Partly successful • New input device?

19. Output Devices • Passes information to human (or to other machine) • Desktop computers • Display (CRT or LCD) • Sound • … • Servers • Terminals on network • Cell phone – Embedded computers • Screen • Sound • Vibration

20. Output Devices, cont’d • Display • CRT to LCD • LCD size from 10 inch to 24 inch • Resolution from 640x480 to 1600x1200 • Sound • Simple “tick” to theatre-like effects, 5.1 channel, etc.

21. Main memory • PC/servers use “DRAM” (Dynamic RAM) • SDRAM • DDR SDRAM • RDRAM (RAMBUS DRAM) A typical SDRAM “module”

22. SRAM, SDRAM, FLASH all in a same chip! Main memory, cont’d • Embedded computers use DRAM or SRAM (or both) depending on applications • On-chip SRAM (embedded SRAM) • On-chip SDRAM (embedded SDRAM) • SDRAM • Mobile SDRAM (1.8V operation)

23. Storage • Secondary storage (cf. main memory) • Non-volatile • Stores programs, user-saved data, etc. • In PC/server domain, magnetic disk (hard-disk) is usually used • In embedded computers, “flash” memory or “ROM” is usually employed

24. USB Flash card 256MB 5.25-inch floppy disk 1.2MB 3.5-inch floppy disk 1.44MB Storage, cont’d

25. Storage, cont’d

26. Computer Networks • Local Area Network (LAN) • Within limited distance (e.g., in a building) • Mostly based on Ethernet • 10Mbps, 100Mbps, 1Gbps, 10Gbps, … • Wide Area Network • Connecting networks far apart • At home, • Modem: 14.4Kbps, 28.8Kbps, 33.6Kbps, 56Kbps • Cable modem/DSL: several hundred Kbps ~ several Mbps • Higher-speed DSL technologies • Proliferation of wireless LAN (IEEE802.11) • 1 ~ 100Mbps

27. (Simple) IC Process Overview • Silicon ingot (silicon cylinder) • (Blank) Wafers • Various steps to build circuits on wafers • Photomask process • Chemical process • Mechanical process • “Wafer test” to sort out bad parts • Tested “die” • “Packaging” steps • Wire bonding • Material filling • Marking • “Chip test” to sort out bad parts • Products

28. Testing Your Chip • Function • “The chip is working correctly” as intended • Speed • “The chip is running at 4 GHz” as intended • “Speed binning” • Power • “The chip consumes 50 Watt at 4 GHz” as intended • Reliability • “The chip will be operational for 10 years” as written on manual and box

29. Calculating Your Chip Cost • Things to consider: • Mask cost: we need 20 ~ 40 masks used to form different patterns used in different process steps a.k.a. Non-Recurring Engineering (NRE) cost • Wafer cost • Cost put in process steps • Defect parts (we spend money producing defect parts!) • Any other overhead including marketing • Can we calculate cost of each chip now? • What happens if we adopt a new technology that can build smaller transistors?

30. (Simple) IC Process Overview • Silicon ingot (silicon cylinder) • (Blank) Wafers • Various steps to build circuits on wafers • Photomask process • Chemical process • Mechanical process • “Wafer test” to sort out bad parts • Tested “die” • “Packaging” steps • Wire bonding • Material filling • Marking • “Chip test” to sort out bad parts • Products

31. Testing Your Chip • Function • “The chip is working correctly” as intended • Speed • “The chip is running at 4 GHz” as intended • “Speed binning” • Power • “The chip consumes 50 Watt at 4 GHz” as intended • Reliability • “The chip will be operational for 10 years” as written on manual and box

32. Calculating Your Chip Cost • Things to consider: • Mask cost: we need 20 ~ 40 masks used to form different patterns used in different process steps a.k.a. Non-Recurring Engineering (NRE) cost • Wafer cost • Cost put in process steps • Defect parts (we spend money producing chips with defects!) • Any other overhead including marketing • Can we calculate cost of each chip now? • What happens if we adopt a new technology that can build smaller transistors?

33. Packaging mounting wire bonding packaging material filling & marking