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Task 5.2: Demonstrator design, implementation and characterization

Task 5.2: Demonstrator design, implementation and characterization. Objectives: develop and implement demonstrator chips related to the major activities carried on the other work-packages Activities as described in Technical Annex: Test-chip activities:

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Task 5.2: Demonstrator design, implementation and characterization

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  1. Task 5.2: Demonstrator design, implementation and characterization • Objectives: develop and implement demonstrator chips related to the major activities carried on the other work-packages Activities as described in Technical Annex: • Test-chip activities: • Level shifter circuits, basic circuits implemented with regular layout (UPC) • PV aware and lifetime-critical circuits (TUGI) • Substrate noise (NXP) • PV aware monitors/controls for self-timed logic (LETI) • compensation schemes for critical AMS blocks (IFXA) • Simulation & characterization activities: • variability-tolerant low noise / low emission circuits (TMPO) • Calibrate timing analysis flow (NXP) • Robust parallel computing architectures by design of demonstrator like microcontrollers and realize VHDL model (THL) MODERN General Meetings Catania, Nov. 9 & 10, 2010

  2. Task 5.2: Demonstrator design, implementation and characterization • Review MODERN General Meetings Catania, Nov. 9 & 10, 2010

  3. Task 5.2: Demonstrator design, implementation and characterization • Purpose of demonstrators (to be aligned during WP5 meeting) • Test-chip activities: • (UPC)  demonstrate on-chip sensors, level shifters, prove benefits of circuits with regular layout, digital and RF M&C? (T4.1, T4.4, T3.3) • (TUGI)  develop benchmark circuits and validate aging models (T2.5) • (NXP)  verify full-chip substrate analysis (T3.4?) • (LETI)  verify AVFS (T3.3 timing errors, WP4control), full demo chip • (IFXA)  verify M&C concepts  T3.3, provide recovery/aging variations data  T3.3 • Simulation & characterization activities: • (TMPO)  verify variability tolerant low-noise / low-electromagnetic-emission delay-insensitive asynchronous circuits  WP4 • (NXP)  Calibrate timing analysis flow ??? • (THL)  verify fault tolerant multi-core chip  WP4 MODERN General Meetings Catania, Nov. 9 & 10, 2010

  4. Task 5.2: Demonstrator design, implementation and characterization • Innovative aspects of demonstrators (to be clarified during WP5 meeting) • Test-chip activities: • (UPC)  • (TUGI)  • (NXP)  • (LETI)  • (IFXA)  innovative M&C concepts (T3.3), novel aging test and characterization methods • Simulation & characterization activities: • (TMPO)  variability tolerant circuits? • (NXP)  • (THL)  MODERN General Meetings Catania, Nov. 9 & 10, 2010

  5. Task 5.2: Demonstrator design, implementation and characterization  Deliverables Deliverables: • R: Basic concept verification of noise, compensation, test chip architectures (NXP, IFXA)  M12 (03/2010)  approved • R: Test chipsimulationresults, topology, implementationandevaluationstrategy, VHDL models; IP block design andlayoutforthe different technologies CMOS (digital AMS&RF), SOI, etc. andtechnologynodes (TMPO, NXP, IFXA, UPC,THL, LETI, TUGI)  M27 (06/2011) • R: test chip characterization (evaluation to show effectiveness of PVT circuitry, of basic processing circuits implemented with regular layouts,), calibration of PV robust analysis flows (TMPO, UPC, NXP, IFXA, LETI, TUGI)  M36 (03/2012) MODERN General Meetings Catania, Nov. 9 & 10, 2010

  6. MODERN. WP5 Status - UPC MODERN General meeting Catania November 9th, 2010

  7. UPC in relation with T5.2 • Several UPC tasks will produce output susceptible to be a demonstrator chip • T3.3 PV-aware design • Highly tolerant dgital design • monitor & control of RF • T4.1: Variability-aware design • D4.1.2 “Tape-out of prototype on-chip sensors and level shifter circuits for (self-) adaptive design.” • T4.4: Design of regular architectures for high manufacturability and yield • D4.4.2 “Tape-out of a chip based on regular transistor arrays.”

  8. T3.3 – Tolerant redundant circuits: Turtle logic • Described in D3.3.1 (M12) • Initially inspired in probabilistic logic • Signal redundancy in all nodes • Inherently robust against logic discrepancies in complementary signals • In sequential circuits, state transition stopped when there is a discrepancy • Current status: • redundant signal sequential architecture already defined • Application example designed at gate level: multiplier 4x4 • Next steps: • Gate-level simulation and evaluation (D3.3.2) • Physical design to evaluate area, timing, power (D3.3.3)

  9. SUPPLY COMPENSATION SUPPLY COMPENSATION THERMAL COMPENSATION T3.3 - PV monitor and tolerance • Purpose: design and implement a RF front-end tolerant to PVT variations, under the constraint of low-power consumption . • RF front-end with a Low Noise Amplifier, Mixers and auxiliary circuitry for PVT variations detection and compensation (bias circuits, detectors, control circuitry, control loops). • Thermal monitoring will be also considered as innovative detection technique of PVT variations, integrating on chip a differential temperature sensor. • Status: • Preliminary block diagram of the proposed test chip (not indicated possible on-chip sensors for Built In Test (BIT))

  10. T4. 1 - Monitor and adaptation • ABB and AVS demonstration to control leakage or delay • Leakage depends both on VDD and VBS • Delay depends especially on VDD • Current status: • Evaluation of type of sensors • In terms of design complexity and parameter yield to improve • Relation/Potential collaboration with LETI • Sensors based on delay • At schematic/circuit only (different target technology) • Upcoming meeting to define collaboration and excahnge information

  11. T4.4 - VCTA application for variation impact of regularity • Design of Voltage Controlled Delay Line (VCDL) and DLL

  12. T4.4 - Jitter and mismatch • Jitter in DLL dependent on mismatch • Sources for mismatch • Random dopant fluctuations, Interface roughness, etc. • Lithography interactions between neighboring patterns • Regular design expected to present smaller jitter

  13. T4.4 - Experiment proposal • Design regular (VCTA) and irregular layouts of DLL • If size of transistors is large enough, mismatch dominated by neighborhood effects • Design several versions with different transistor sizing • The relative importance of regularity vs random mismatch will be obtained • D4.4.2: Tape-out of chip based on regular transistor arrays (M30)

  14. BACK Summary UPC • Designs that are well on-track • RF monitoring and compensation (T3.3) • VCTA regular impact experiment (T4.4) • Designs that need extra effort • Digital PV-aware (T4.1) • Turtle logic (T3.3) • At this point in time fully confident they can be part of T5.2 • Remarks/Questions • Technology: ST 65nm • Use of CMP reserved budget; which conditions? One chip? submission date limit?

  15. Motivation & TechnologyTask 5.2 - TUG • The overall motivation is to verify physical reliability models including process variability reflecting the performance of MOS transistors over lifetime resulting from WP2. • The goal of Task 5.2. is to determine demonstrator circuits sensitive to the observed degradation effect in order to allow the benchmark of different aging model development approaches. • Technology: The entire work is based on austriamicrosystems AG HVCMOS technology. MODERN General Meetings Catania, Nov. 9 & 10, 2010

  16. Status of Work Task 5.2 - TUG Verification of simple Isub based analytical model in order to support the validation of possible benchmark circuits by including the models into a reliability simulator. Elaborate approaches to incorporate the PV into the models. Close cooperation with TUV which is working on physical PV aware reliability models based on TCAD and measurement results. MODERN General Meetings Catania, Nov. 9 & 10, 2010 16

  17. Principle of Reliability SimulatorTask 5.2 - TUG The principle of the reliability simulation is to represent the device degradation at different points in time (e.g. after 10 years) by updating specific SPICE parameters. The SPICE deck is updated via a dynamic link between the analog simulator and the reliability simulator. MODERN General Meetings Catania, Nov. 9 & 10, 2010 17

  18. Outlook Task 5.2 - TUG Design and fabrication of benchmark structures. Validation of proposed benchmark cases. Outstanding deliverables: D5.2.2 – M27 D5.2.3 – M36 BACK MODERN General Meetings Catania, Nov. 9 & 10, 2010 18

  19. Substrate activities for Modern Task 3.4 Sergei Kapora 29 October 2010

  20. Neptune 314 for substrate noise studies Developed de-embedding scheme to remove contribution of IO coupling 8 digital IPs with different isolation approaches Correlation of de-embedded measurement results with 3rd-party EDA tool for full-chipsubstrate noise analysis

  21. Neptune 5 test chip specs Current floor plan proposal Spectrum of the output of FM buffer with and without digital noise present in the system

  22. BACK Substrate extraction flow in SOI Disturbed output of the bandgap due to noise propagation through the substrate *functionality in red isadded to the standard flow

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