H Diffusion in Cu: Bonding

1. H Diffusion in Cu: Bonding

2. H Diffusion in Cu: Bonding • Second Fick’s law • Diffusion in a plane sheet H2 H2 H2

3. H Diffusion in Cu: Second Fick’s law • semi-infinite material • 1-D concentration profile H2 x

4. H Diffusion in Cu: Second Fick’s law • Solubility : • Diffusion :

5. H Diffusion in Cu: Bonding plateau 0.000119 wt% 1.2 ppm C0 =0

6. H Diffusion in Cu: Bonding

7. H Diffusion in Cu: Diffusion in a plane sheet • n = 1,2,3,4 • Cs equal and constant at the surfaces H2 H2

8. H Diffusion in Cu: Bonding plateau C0 =0

9. H Diffusion in Cu: Bonding ramp down • 1040 – 800 °C • 4 °C/min • C0(T) = C(T - 4°C) 4°C 60 s

10. H Diffusion in Cu: Bonding ramp down • C(800 °C) = 4.63234E-05 % wt (0.46 ppm)

11. H Diffusion in Cu: thermal treatment after bonding • 10 d, @ 650 °C • C0=C(x) @ 800 °C • Cs= CH2 in the oven (10^-8 mBar)

12. H Diffusion in Cu: thermal treatment after bonding

13. Next steps • search for thermodynamics data @ room temperature • check the ramp down to 20°C • calculate the effective content of H in Cu

14. Solubility of H in Cu Sieverts`s Law H2 Hp Ideal Gas

15. Solubility of H in Cu • Cu is an endothermic material

16. Solubility of H in Cu