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Mechanics from the Demonstrator to the Prototype

Mechanics from the Demonstrator to the Prototype. T.Tischler , S. Amar-Youcef, M. Deveaux, D. Doering, J. Heuser, I. Fröhlich, J. Michel, C. Müntz, C.Schrader, S. Seddiki, J. Stroth, C. Trageser and B. Wiedemann. MVD Demonstrator. Liquid cooled Cu heat sink. 2x MIMOSA-20 Sensors.

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Mechanics from the Demonstrator to the Prototype

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  1. Mechanics from the • Demonstrator to the Prototype T.Tischler, S. Amar-Youcef, M. Deveaux, D. Doering, J. Heuser, I. Fröhlich, J. Michel, C. Müntz, C.Schrader, S. Seddiki, J. Stroth, C. Trageser and B. Wiedemann

  2. MVD Demonstrator Liquid cooled Cu heat sink 2x MIMOSA-20 Sensors ZIF connector Flex-rigid R/O Demo-Aux board Flexprint Cable TPG/RVC/TPG sandwich

  3. MVD Demonstrator: Mechanical support Structure of the support: schematic view: TPG (Thermal Pyrolytic Graphite) ultra high heat conduction ( 1500 W/mK in two dimensions = 4x value of copper ) RVC (Reticulated Vitreous Carbon foam) ultra light and stiff material TPG Glue RVC Glue TPG • 1 layer TPG used to hold and cool 2 MIMOSA-20 Sensors • RVC is used as a spacer to increase the stiffness of the support • due to the graphite like structure of the TPG it seems not to be the material with which the MVD should be build

  4. MVD Prototype • Next step on the way to the final MVD • Replace TPG and RVC with CVD Diamond • ultra high heat conduction - 2000 W/mK • ? Cooling of several sensors with 1 layer of CVD Diamond feasible ? • ? Thermal interface from CVD to Copper crucial and needs special tests and improvements (experience from the Demonstrator project) ? • ? Stiffness to hold several MIMOSA-26 sensors ?

  5. MVD Prototype First ideas for mechanics and the sensor arrangement of the Prototype • Prototype module • double sided • one side with three sensors • one side with two sensors • to cover the inactive area • of the backside

  6. MVD Prototype The first station consists out of four modules which will be arranged alternating to each other to cover the whole acceptance.

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