1 / 10

The High Speed Demonstrator and Slice Demonstrator Programme

Learn how to design reliable multi-Gb/s PCBs with a dedicated demonstrator. Explore challenges, methodologies, costs, and implementation strategies.

mschulze
Download Presentation

The High Speed Demonstrator and Slice Demonstrator Programme

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. The High Speed Demonstrator and Slice Demonstrator Programme The Proposed High-Speed Demonstrator Overview Design Methodology Cost Summary Ian Brawn

  2. Background • The problems of data transport and sharing in the L1Calo Phase-2 processor are minimised if we use multi-Gb/s data links • We have assumed we’ll be using speed in this order • Signals in multi-Gb/s range present challenge to PCB design • Reflections, • Rising edge of signals is comparable to physical size of components, vias, etc  distributed rather than lumped system • Crosstalk, • High-frequency attenuation, • Differential skew… • Require carefully controlled Placement of components and routing of tracks Ian Brawn

  3. Multi-Gb/s Experience • In industry it is standard to model and simulate PCBs during the design process to ensure required signal integrity is acheived • In UK we have limited experience of multi-Gb/s design • At RAL, PCB Design Office have built a few boards in Gb/s range using design rules • eg, XFEL FEM 3.25 Gb/s, short links • We have no experience of PCB simulation • Within wider community, CERN have a working group looking at PCB simulation • If we are to successfully use multi-Gb/s links in the L1Calo processor we need to educate ourselves (and the Design Office) • Best to do this on a dedicated demonstrator • Not one that has lots of expensive FPGAs Ian Brawn

  4. Real goal of this programme is not to produce hardware Producing a board that does/doesn't work at multi-Gb/s will tell us little if we don't understand how we got there. Real goal is to equip ourselves with capability of producing working multi-Gb/s PCBs in reliable fashion: Simulation Extraction of electrical model from hardware Feedback of electrical model into simulation Learn from our successes and failures Design Methodology Ian Brawn

  5. FPGA used as a source/sink of multi-Gb/s serial signals 10 Gb/s or 5 Gb/s speeds considered Aim is to allow as many different path types as possible to be tested FPGA–transceiver FPGA–RTM–transceiver FPGA–Crosspoint switch–FPGA, etc Implement paths of a variety of lengths & vias Propose building (at least) two of these modules, to enable backplane transmission a Op. RX m FPGA b Op. TX Op. RX c e n Cross-point Switch Op. RX f d Op. RX Mezzanine Op. RX g h k l Demonstrator Module RTM ATCA backplane Conceptual Design Ian Brawn

  6. Obviously desirable to use the same standard in the final system and demonstrator. Parallel bus architectures, including VME, are not candidates for the L1Calo Phase 2 Trigger crate Of the serial backplanes available, ATCA seems the best candidate Serial, point-to-point communication across backplane High availability, scalability, flexibility Massive I/O capability Telecoms standard Widely used in industry Gaining wide support in our community Infrastructure Ian Brawn

  7. Conducted using ESS 20 GHz scope: 86100C DCA-J Oscilloscope Mainframe Software: Jitter measurements Enhanced impedance and S-parameter Advanced waveform analysis Plug-in Modules: 9 GHz optical /20 GHz electrical sampling module Differential TDR module including 6 GHz TDR probe 20 GHz Dual channel Electrical module Clock recovery module (optical and electrical 50mb/s – 7.1 Gb/s Other enhancements: Enhanced trigger 13 GHz BW Filters for waveform characterisation Adjustable loop bandwidth Testing Ian Brawn

  8. Costing – 10 Gb/s option Ian Brawn

  9. Impementation • 5 Gb/s links can be implemented by a Virtex5 device • 10 Gb/s links require a high-end V6 device (XC6VHX255T) • Preference is to impement 10 Gb/s but it may be necessary to build 5 Gb/s board first • Availability of required Xilinx device is uncertain • We’ve had trouble extracting V6 quotes from Silica(quote used here is from Silica web site) • We could consider ALTERA…. • A two-stage demonstrator programme? • Demonstrator 1: 5 Gb/s, to proceed immediately • Demonstrator 2: 10 Gb/s, GBT, additional functionality for a slice demonstrator programme • Timescale: first demonstrator ready for testing Q4 2011 Ian Brawn

  10. Summary • The proposed L1Calo programme requires that we understand how to manufacture multi-Gb/s PCBs reliably, and it is to our benefit if this knowledge is acquired by as many of the institutes as possible. • In the UK we propose to build a High-Speed demonstrator to educate ourselves (and RAL PCB Design Office) in multi-Gb/s PCB design • Functionaly the module will be simple; it will be a test bench for us to investigate the behaviour of multi-Gb/s signals • This will be the first step in a demonstrator programme that we look forward to defining in the near future. Ian Brawn

More Related