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Run IIb Project Overview - Status and Schedule Update

This document provides an overview of the Run IIb project, detailing the project organization, team roles, and updates on silicon detector elements and trigger upgrades. Recent changes and progress are highlighted, along with the technical achievements so far.

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Run IIb Project Overview - Status and Schedule Update

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  1. Run IIb DZero PMG • Status overview, issues (Kotcher) • Schedule, project status (Freeman) • AOB Jon Kotcher Fermilab PMG February 25, 2003

  2. Run IIb Project Organization D0 Run IIb ProjectJ. Kotcher, Project ManagerR. Partridge, Deputy; V. O’Dell, Associate; W. Freeman, Assistant M. Johnson, Technical Coordinator A. Amorn-Vichet, Budget Officer; T. Erickson, Administration WBS 1.1SiliconM. DemarteauG. Ginther WBS 1.2Trigger H. Evans D. Wood WBS 1.3DAQ/OnlineS. FuessP. Slattery WBS 1.4Project Administration WBS 1.5 InstallationR. Smith 1.1.1 Sensors R. Demina, F. Lehner 1.2.1 L1 Cal UpgradeM. Abolins, (H. Evans),P. LeDu 1.5.1 Silicon InstallationMechanical:H. LubattiElectronics: L. Bagby, R. Sidwell 1.3.1 Level 3 SystemsD. Chapin, G. Watts 1.1.2 Readout SystemA. Nomerotski, E. von Toerne 1.3.2 Network & Host Systems J. Fitzmaurice, S. Krzywdzinski 1.2.2 L1 Cal/Track MatchK. Johns 1.1.3, 1.1.5 Mechanics & AssemblyW. Cooper, K. Krempetz 1.5.2 Trigger InstallationD. Edmunds 1.2.3 L1 Track TriggerM. Narain 1.3.3 Control SystemsF. Bartlett, G. Savage,V. Sirotenko 1.1.4 ProductionJ. Fast 1.2.4 L2b UpgradeR. Hirosky 1.1.4 QA, Testing, & Burn-inC. Gerber 1.3.4 DAQ/Online Management(P. Slattery) 1.2.5 Silicon Track Trigger U. Heintz 1.1.6 MonitoringM. Corcoran, S. de Jong 1.2.6 SimulationM. Hildreth, E. Perez • George Ginther is new silicon co-leader • Eckhard von Toerne is new silicon readout co-leader (replaces Bill Reay) • Arisara Amorn-Vichet, new Budget Officer • Kurt Krempetz, K. Hanagaki plenary speakers 1.1.7 Software & Simulation F. Rizatdinova, L Shabalina 1.2.7 Administration(D. Wood) 1.1.8 Administration(M. Demarteau)

  3. WBS 1.1: Basic Silicon Design Choices • Six layer silicon tracker, divided into two radial regions • Inner layers: Layers 0 and 1 • Axial readout only • Mounted on integrated support • Assembled into one unit • Designed for Vbias up to 700 V • Outer layers: Layers 2-5 • Axial and stereo readout • Stave support structure • Designed for Vbias up to 300 V • Employ single sided silicon only, 3 sensor types • 2-chip wide for Layer 0 • 3-chip wide for Layer 1 • 5-chip wide for Layers 2-5 • No element supported from beampipe

  4. Hybrid Silicon Analogue cables Silicon Detector Elements • 168 silicon staves: basic building block of outer layers • Supported in positioning bulkheads at z=0, z=610 mm • Layer 0 Support structure: University of Washington • Layer 0/Layer 1 mated Hybrid Silicon Digital cable

  5. Silicon Layer 0 Support StructureUniversity of Washington • First Layer 0 prototype carbon fiber support structure delivered to Fermilab for tests in January • Integrated grounding – kapton/copper mesh • Performs very well under deflection tests – major technical achievement Hybrid Silicon Mounted L0 structure, ground mesh Mounted L0 structure CMM head Clamps to inner carbon shell Analoguecables Balls for deflection measurements

  6. Prototype Mechanical Stave Prototype mechanical stave being thermally tested at SiDetDec 18 ’02 integration milestone met Al-ceramic hybrid (dummy) 10/10 (upper)20/20 (lower) mechanical modules, concatenated Stereo silicon, axial mounted underneath Input cooling channel

  7. Outer Layer Silicon Module Prototypes • First outer layer electrical-grade (“20/20”) prototypes fabricated • Two types: axial & stereo readout • Each are 12 sensors long, ~100 mm in length • Stereo angle obtained by rotating sensors • Testing underway 20/20 axial module 20/20 axial hybrid 20/20 stereo hybrid SVX4 readout chip Digital cable Silicon sensors

  8. Module Test Results Electrical tests of 20/20 axial module (10 chips) Charge injection Total/ random noise Bonded to single (dual) sensors Pedestal Unbonded chip

  9. Silicon Status

  10. WBS 1.2: Trigger Upgrade H. Evans (Columbia), D. Wood (Northeastern) WBS 1.2.1: Level 1 Calorimeter M.Abolins(MSU), H.Evans(Columbia), P.LeDu (Saclay) WBS 1.2.2: Level 1 Cal-track match K. Johns (Arizona) WBS 1.2.3: Level 1 Tracking M. Narain (Boston) WBS 1.2.4: Level 2 Beta upgrade R. Hirosky (Virginia) WBS 1.2.5: Level 2 STT upgrade U. Heintz (Boston) WBS 1.2.6: Trigger Simulation M. Hildreth (ND), E. Perez (Saclay) WBS 1.2: Trigger Upgrades Level 1 projects underway • Level 1 Calorimeter • Level 1 Cal-track matching • Level 1 Tracking • Trigger simulations Level 2 projects (not discussed here) • L2 Beta upgrade & STT upgrade • Later start in schedule • VTM’s procured for STT (part of larger order)

  11. Saclay ADC+Digital Filter (ADF) ADF timing distribution board Analog splitter (for in-situ tests) ADF Crate/backplane Nevis Trigger algorithm board (TAB) Global Algorithm Board (GAB) Crates for TAB/GAB Test system for ADF-to-GAB cables WBS 1.2.1: Calorimeter Trigger Upgrade • Michigan State • Interfacing to existing system, framework • Infrastructure L1 Cal/Track Match: University of Arizona

  12. Level 1 Trigger Highlights • Prototype design phase concluded for three major boards in Level 1 trigger upgrade: • Level 1 Calorimeter Trigger • ADC-Digital Filter Board (ADF) - Saclay • Trigger Algorithm Board (TAB) – Columbia University • 2/3 of the PCBs required for L1 Cal • Remaining Global Algorithm Boards (GAB) being completed • Level 1 Calorimeter/Track Match • Flavor Board (MTFB) • Layouts begun • Analog splitter installed during January shutdown in Level 1 Cal rack at DZero Assembly Building, Movable Counting House • Picks off in-situ signals from four trigger towers • Data will be taken, analyzed during next few months • Preparation for tests of full L1 Cal prototype chain (ADF, TAB, GAB), beginning this summer

  13. Analog Splitter: Saclay & MSU • Analog splitter: allows in-situ test of digital filtering with real signals • Designed and tested at Saclay • Shipped to MSU Dec 20th: tested there • Installed in DØ L1Cal trigger (Run IIa) during current shutdown • Noise tests in progress • Tests with beam (w/ splitter vs. w/o splitter) to follow

  14. WBS 1.2.2: Cal-Trk Match: Arizona • Uses “L1mu” electronics, apart from specialized “flavor board” • Flavor board (MTFB) prototype design >90% complete • Some procurements anticipated for next month • Approval was essential for keeping this on track Run IIa MTFB (scint flavor)

  15. L1 CTT: Boston Univ. • Firmware design for target algorithm began in Nov • “front end” and “back end” code from Run IIa rewritten – latency reduced • Ongoing work on maps of single fibers

  16. Trigger Simulation Progress • Studies of effects of trigger tower thresholds on L1 Cal global sums (missing ET) • L1 Cal tau algorithm included in trigger simulation • Output of Run IIb L1 Cal interfaced to standard DZero framework simulation package • Simulation of Cal-Track matching progressing • Central Track Trigger (CTT) as-built geometry and beam offsets incorporated into simulation • Beam offsets up to ~1 mm do not effect efficiency of Run IIb equations

  17. Production Readiness Reviews (PRR) • First review: “Purple Card” - sequencer/hybrid interface PC card – held 1/30/03. Committee: • C. Gerber (UIC), J. Green (Fermilab), K. Hanagaki (Fermilab), S. Lager (Stockholm), R. Lipton (Fermilab, Chair), R. Sidwell (KSU) • Report submitted – ready to go • Next review: Outer layer silicon sensors, 3/6/03. Committee: • N. Bacchetta (PISA), B. Gobbi (NWestern), J. Ellison (UCR, Chair), R. Lipton (Fermilab), H. Sadrozinski (UCSC), S. Worm (Rutgers) • $1.5M order with Hamamatsu – procurement ready to move upon receiving nod from Committee. Costed in four lots. • Placement of order was second Run IIb DOE milestone (March 24) • Project target date: Feb 18 • PRR report due March 14, procurement immediately thereafter • Project is learning from such experiences

  18. Labor Cost Extracted from Schedule vs. Actuals (R&D) Actuals in FY02 k$ Scheduled labor in FY02 k$ Dec + Jan (predicted) ~ Dec + Jan (observed)

  19. Current Conclusions on Labor from 1st Quarter • We are using very different flavors of people than the schedule predicted • Rates for given flavor consistent with average rates used as input to project cost • <DesF> actual pay ~ <DesF> as used in schedule • Using more labor than we thought • 10% high in hours and cost • Actual cost within 1% of predicted • Above all very good…but even though we are using more labor, we are not keeping up with aggressive schedule in all cases • Comments to follow…

  20. Costs Loaded Into COBRA COBRA ready to go (see monthly report) Thanks to Rissa, Dale, Colleen, Dean

  21. Adhering to Schedule • Creating, maintaining a schedule and using it to monitoring progress is only initial step • Essential that next step be taken: extract lessons learned from slippages, implement corrective actions where possible. Anticipate project needs well in advance. • Project has begun to turn this corner • Schedule being taken with increasing seriousness, attentiveness by all principals • This is a major step, will continue until we’ve finished

  22. Miscellany, Conclusions • MoU/SoWs being generated project-wide • Overhead-free MoUs for silicon MRI in place for some time • First formal agreement just completed, Run IIb PO being generated (Louisiana Tech) • COBRA loaded, ready to use • Report on equipment costs only • Technical progress continues to be excellent • Beginning to truly manage to aggressive schedule – positive and important step • No change controls on horizon

  23. Feb Mar Apr May Jun Jul Aug Accelerator Advisory Committee Keeping Run II(b) on the Map: Next Six Months • Experiments now directly participating in BD planning. Comes with a price: • Reviews (both sides of table), associated preparation quite extensive • Above demonstrates impact of current climate, + compressed schedule • Heavy emphasis on project management at all levels Monthly PMGs: Long-Range BD, Run IIb PAC DOE (Lehman) Review of Run IIb (CD-3b) DOE Review of Accelerator All information required by DOE for long-term assessment in hand at this point Director’s Review of Run IIb P5 Review of Run IIb Director’s Review of BD Long-Range Plan DOE Review of FNAL Program BD Long-Range Plan for Run II due to DOE Green = Beams Div (BD)Brick = Run IIb Detector ProjectsDates shown are latest est

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