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ER Bundle “final” design

ER Bundle “final” design. D. Giugni / INFN Milano. Assumption. I am going to present what I would call “final design” of the ER bundles... w ith some caveats: The transmission properties of the data line are not covered here. We cannot say that it is fully qualify.

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ER Bundle “final” design

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  1. ER Bundle “final” design D. Giugni / INFN Milano 2011-07-14 nSQP's meeting

  2. Assumption • I am going to present what I would call “final design” of the ER bundles... with some caveats: • The transmission properties of the data line are not covered here. We cannot say that it is fully qualify. A “system” test with all the parts (E-board, ER Bundle, Optoboard) has not been done yet. • I assume hereafter that it is or, it will be, ok. Therefore the design is “final” if the system test will show good results. • If it is true, then the design is really final: • Wires, boards, connectors • Mechanics: connector shells, strain releases, assembly procedures • Shielding (*) and grounding. • (*) There are still two options for the shielding braids: tin copper and carbon. It does not affect the design nor the fabrication procedure 2011-07-14 nSQP's meeting

  3. Details from PP0 to Opto-box 2011-07-14 nSQP's meeting

  4. Details at PP0 2011-07-14 nSQP's meeting

  5. Details at PP1 KEVLAR Braid KEVLAR Braid + Drain wire Tin Cu/ C fiber + AWG 28 Tin Cu drain PP1 End Plate Silicon feed through MYLAR Foil Heat shrinkable tubing NOMEX Braid MWS Wires  “Outside” to Optobox “Inside” to PP0  2011-07-14 nSQP's meeting

  6. Details of the Connector Shell (5um Ti/Ni coating) Drain Wire Heat Shrinkable tubing Brass Ferule Brass Hollow Plate KEVLAR Braid Cu/ C Braid MWS Wires 2011-07-14 nSQP's meeting

  7. Connector Board assembly Silder Heat Shrinkable tubing Ferule Drain Wire Tin Cu Braid KEVLAR Braid Connector Shell (not Coated here) Hollow Brass Plate 2011-07-14 nSQP's meeting

  8. Connector Shell Sputtering • Sputtering seems to be ok. • Tested 2um Ti coating • Good adhesion • Next layer can be ~3um Cu or Ni Ni preferred (by me) Total coautingth. ~5um • Fast an almost inexpensive 2um Ti spattered Uncoated SLA shell 2011-07-14 nSQP's meeting

  9. D-bundle production plan • Re-spin the Cable and D/B Connector board. Some already in hands. Need to load with connectors and capacitors • Re-spin the production of the new shells (both D&B type) • Spattering available. • All braids (NOMEX, KEVLAR, Cu and Carbon fiber) in hands • Silicon casting available at CERN and ready to go. Can assemble 14 D-ER Bundles with all the final parts... however we are in a vacation period. • 10 bundles with Ti Cu braid • 4 Bundles with CF braid. 2011-07-14 nSQP's meeting

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