Material and Dead Region

1. Material and Dead Region Material Estimates Plans on how to proceed

2. Radiation Length • Current radiation length of a stave • Cores (including tapes): 0.72% • 2 Planar Modules: 1.08% • Total: 1.8% • For CMOS assume no additional material in carrier • Drop-in Stereo and Z-Encoded (100 micron thick sensors): • 1 Drop-in Module: 0.31% • Total: 1.03% • Embedded (100 micron thick sensors + hybrid width reduced by ASIC size): • 1 Embedded Module: 0.25% • Total: 0.97% It is possible that core can be reduced with CMOS sensors Most of material improvement made with going to single modules with 2d information

3. Dead Area • One question is efficiency of CMOS • Can start with inactive areas which are not in overlaps • Space between reticles • Inactive edges of reticles next to edge • I have no idea what these can be • Estimates given where roughly ~80-120 mm at edge of reticles and ~80-120 mm between reticles • NEED TO FIRM UP THIS ESTIMATE • From our presentation at the CMOS TF meeting, Tim Jones came up with the following sketch of reticle From Tim Jones

4. Dead Area • Similarly for module Dead Areas From Tim Jones

5. Basic Calculations Planar sensors in a similar calculation would be ~1.2% inactive