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Organic-Inorganic Hybrid Preparation. Advisor: Professor Guey-Sheng Liou Reporter: Chin-Yen Chou( 周勁言 ) 2014.01.03. Outline. Introduction Preparation of organic-inorganic hybrid Sol-gel method Assembly of nanobuilding blocks Applications Conclusions. Introduction.
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Organic-Inorganic Hybrid Preparation Advisor: Professor Guey-ShengLiou Reporter: Chin-Yen Chou(周勁言) 2014.01.03
Outline • Introduction • Preparation of organic-inorganic hybrid • Sol-gel method • Assembly of nanobuilding blocks • Applications • Conclusions
Introduction The definition of Inorganic-organichybrid material inorganic + organic components (homogeneously) distributed on the molecular or nanometer level Sum of the individual properties of both phases Organic-Inorganic hybrid materials Weak bonds e.g. H-bond, Van der Waals bond Interface properties Strong chemical bonds e.g. Covalent bond
Introduction Table 1 Comparison of properties of conventional organic and inorganic components C. Sanchez ,et al, J. Mater. Chem., 2005, 15, 3559–3592
Introduction Homogeneous Heterogeneous Problems: the change of light scattering, mechanical properties, physical properties etc. Control over homogeneity: Precursor selection (functional group) Reaction condition: solvent, pH value, temp. Interactions between the components
Fig.1 Different paths for obtaining hybrid materials. C. Sanchez ,et al, Chem. Mater. 2001, 13, 3061-3083
Outline • Introduction • Preparation of organic-inorganic hybrid • Sol-gel method • Assembly of nanobuilding blocks • Applications • Conclusions
Sol-gel method The principle of sol-gel method • Effect factor: • pH value • The amount of water • The type of metal alkoxide • Solvent type
Sol-gel method Inorganic-Organic Hybrid Polymers The optional variations in experimental: Different elements of metal alkoxides Different of organic monomers, macromolecules or a reactive substituent The reaction type: thermal or photochemical polymerization Fig.2 Sketch of the Different Possibilities of preparing organic-inorganic hybrid polymers. Ulrich Schubert, et al, Chem. Mater. 1995, 7, 2010-2027
Table 2 Examples of network formers and network modifiers C. Sanchez ,et al, J. Mater. Chem., 2005, 15, 3559–3592
Sol-gel method Example: Gel-glass-dispersed liquid crystals (GDLCs) PBCN liquid crystal. R- triethoxisilane (R= methyl, ethyl, propyl, butyl...) Tetraethyl orthosilicate (TEOS) David Levy, et al, J. Mater. Chem., 2005, 15, 3769–3775
(thickness 10 μm, 4 × 2 cm2, Vp–p=90 V) David Levy, et al, J. Mater. Chem., 2005, 15, 3769–3775
Sol-gel method Example: Sol-gel process Hydrolysis/ condensation Thickness: 15±3μm Guey-Sheng Liou, et al, J. Mater. Chem., 2012, 22, 17236–17244
Assembly of nanobuilding blocks Nanobuilding block Organic Connectors Organic-Inorganic interaction Hybrid formation C. Sanchez ,et al, Chem. Mater. 2001, 13, 3061-3083
Assembly of nanobuilding blocks Fig.3 The schematic of nanobuilding blocks polyhedral oligomericsilsesquioxane (POSS) K. Pielichowsk,et al, Adv PolymSci (2006) 201: 225–296
Assembly of nanobuilding blocks Graft or polymerization Joseph J. Schwab,et al, Appl. Organometal. Chem. 12, 707–713 (1998)
Assembly of nanobuilding blocks Example: Table.3 The data of thermal properties of epoxy-POSS hybrid material Table.4 The data of mechanical properties of epoxy-POSS hybrid material Xiaoyan Ma,et al, J. APPL. POLYM. SCI. 130, 2, 810-819 (2013)
Outline • Introduction • Preparation of organic-inorganic hybrid • Sol-gel method • Assembly of nanobuilding blocks • Applications • Conclusions
Applications C. Sanchez ,et al, J. Mater. Chem., 2005, 15, 3559–3592
Outline • Introduction • Preparation of organic-inorganic hybrid • Sol-gel method • Assembly of nanobuilding blocks • Applications • Conclusions
Conclusions Sol-gel method: • Simple reaction • Low cost (processing temperatures, solvent…) • Flexible design (metal alkoxide, reaction condition….) Assembly of nanobuilding blocks: • Much more homogenous distribution of both moieties which facilitates the characterization of the final materials • Flexible design (building block) M.F. Ashby, et al, Acta Materialia 51 (2003) 5801–5821