UTE / CEF 93 / GT 5

1. IBIS models and EMC simulation standardization status UTE / CEF 93 / GT 5 Models of electronics integrated circuits for simulation tools in ElectroMagnetic Compatibility

2. DREUX Lionel AEROSPATIALE Suresnes HUET Claude AEROSPATIALE Toulouse MAROT Christian SIEMENS Automotive PAULET Guy THOMSON CSF Members : President : phone : 33 (0)4 93 22 23 90 e.mail : jc-perrin@ti.com PERRIN Jean-Claude TEXAS INSTRUMENT phone : 33 (0)1 46 97 30 08 e.mail : lionel.dreux@siege.aerospatiale.fr phone : 33 (0)5 61 93 58 69 e.mail : claude.huet@avion.aerospatiale.fr phone : 33 (0)5 61 19 82 81 e.mail : marot.christian@tlsm70.tls1.siemens.net phone : 33 (0)1 69 33 01 01 Secretary : phone : 33 (0)1 40 93 62 45 e.mail :da@ute.asso.fr DAMBLIN Armelle UTE

3.  sub group of WG 5  working group on IC's ELECTROMAGNETIC COMPATIBILITY UTE / CEF 93 ( TC 93 ): Design Automation  XAO , standard data exchange , models ... UTE / CEF 93 / GT5 EMC ad-hoc working group

4. NEED  use simulation tools to evaluate EMC behaviour of electronics equipments and systems • during design automation • in qualification process • for certification OBJECTIVE  create a standard for EMC Integrated Circuits models

5. EMC is the abillity of an electronic or integrated circuit to function satisfactorily in an electromagnetic environment without producing intolerable electromagnetic disturbances to anything in that environment  signal integrity auto compatibility on a Printed Circuit Board  emissions radiated fields by PCB conducted noises on lines  immunity to radiated fields to conducted noises on lines

6. First step : state of art on PCB EMC simulation tools  questionnaire (1st semester 96) send by UTE to software purchasers 25 mailing , 7 answers  principal items : types of numerical methods used problems adressed equipements elements included in simulation (boxes, cables, ...) components models supported standard for data exchange ...

7. major conclusions : • domain of application • - signal integrity : all software purchasers • - emissions : most of software purchasers • - immunity : hardly anything software purchasers • integrated circuits models used : • - IBIS : all software purchasers • - SPICE : most of software purchasers • - company specific models

8. Second step : SPICE / IBIS comparison • (1) : If parasitics elements are included in the model • IBIS is well adapted for signal integrity problems but need to be enhanced to handle more general EMC problem

9. models proposed to simulate susceptibility  basic models : IBIS  elements to add - coupling between I/O and power supply - coupling with logic core - coupling between I/O - feedback coupling between I/O  measurement methodologies have to be defined for models validation and control

10. models proposed to simulate emissions  basic models : IBIS  elements to add - equivalent decoupling impedance - impedance of supply lines - internal noise generator - internal loops - coupling between internal logic and I/O  measurement methodologies have to be defined for models validation and control

11. works in progress  improve IBIS models for EMC simulation - it seems to be possible for emission domain - not so easier for susceptibility domain  create a Task Force at IEC level - New Working Item Proposal for sept 98 - participations of international experts  define methodologies for models validation