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Pixel 2000 - notes

Pixel 2000 - notes. Topics covered Sensor Front end electronics Integration: Bump bonding (including roundtable featuring AMS,IZM, VTT) Multichip modules Hybrids Web page: http://www.ge.infn.it/Pix2000/slides.html. Sensor. Interpixel insulation: ATLAS “moderated p-spray”

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Pixel 2000 - notes

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  1. Pixel 2000 - notes • Topics covered • Sensor • Front end electronics • Integration: • Bump bonding (including roundtable featuring AMS,IZM, VTT) • Multichip modules • Hybrids • Web page: http://www.ge.infn.it/Pix2000/slides.html Marina Artuso

  2. Sensor • Interpixel insulation: • ATLAS “moderated p-spray” • CMS “p-stop double open ring” • 250 mm sensors • At Elba meeting CSEM, SINTEF not too enthusiastic, CANBERRA ok 200 mm • CiS produced 1st “moderated p-spray” in 200 mm • IRST (Trento, Italy) has tried to produce “p-spray” and “moderated p-spray” Marina Artuso

  3. Sensor - continued • Discussion with SINTEF • HERA-B sensors: moderated p-spray (3 different B doses for implantation ) • Before irradiation breakdown at about 200 V (guard ring) worsened upon irradiation. Theory: p+ guard ring on the ohmic side create problem (punch through when depletion region reaches guard ring) • P-spray versus p-stop, latter easier, very important for p-spray to achieve quite smooth implantation densities + need to negotiate with MPI (design patented ?). Marina Artuso

  4. ROSE collaboration results • Several talks on oxygenated wafers both at ELBA (2) and at PIXEL2000 (1). Oxygenated wafers very popular. SINTEF in the ROSE collaboration & ok, CSEM had problems with the first iteration of oxygenated wafers for Horisberger, they will try again. Marina Artuso

  5. Bump bonding • Industry representatives: • Annamaria Fiorello – AMS, Italy (In) • Juergen Wolf – IZM, Germany (Solder) • Ikka Suni – VTT, Finland (Solder, including low melting eutectic used for an X ray pixel device with bump size 15 mm on 30 mm pitch • Roland Horisberger reported on PSI experience • Both In and Solder seem adequate technologies Marina Artuso

  6. Hybridization ATLAS specifications for flex hybrid module: - 2 metal layers • * kapton substrate, metal traces on both faces (25 micron thick) • * Copper traces: 7 mm thick, 75 mm minimal distance, • critical issues: • - wire bonds • - stress induced on the bumps (different CTE) and wirebonds Marina Artuso

  7. Hybridization (II) • First results presented on “thin” flex-hybrid: electronics thinned down to 150mm • 3 modules tested at Genova (2 bonded by AMS) • Module 2 is the best with very few dead channels and threshold 3900260 e- and mean noise about 210 e- (however with rather long tail) (see Paulina Netchaeva’s talk). Marina Artuso

  8. Marina Artuso

  9. Marina Artuso

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