System of Wafer Dicing and role of Substrate

1. System of Wafer Dicing and role of Substrate

2. The majority of end users will take significant measures to ensure the rigidity of the machine they purchase, but they may overlook the crucial diamond blade mounting requirements. Regardless of the precision engineering of a diamond blade, its performance is only as accurate as the surfaces it comes into contact with. The flanges or spacers’ bearing surfaces must be parallel, clean, and flat. Depending on the desired result, gang-cutting spacers are typically manufactured with either aluminum or titanium carbide. Most single-blade mounting flanges or adapters are made of stainless steel. To improve close contact with the diamond blade, the flanges will have an undercut to reduce the bearing surface area. Before assembly, these surfaces and the surfaces of the diamond blades must be clean and free of loose particles. The mating surfaces will fit perfectly as a result of this.

3. Spacers and flanges shouldn’t cause vibration at spindle speeds. Remove the flange or spacer assembly from the spindle arbor; increase the speed to operating speed, and check to see if there is any vibration. To accurately diagnose the source of resonance in 300mm wafer dicing services, this is a potent way to evaluate whether or not the flange or spacer assembly might be responsible. If there is no vibration, the issue is with the flanges or spacers. The spindle needs to be fixed if the vibration persists.

4. Reasons to Pay Attention to Blade Exposure The blade’s cutting-edge protuberance from the flange or spacer border is a pivotal element in assessing the sawing system’s firmness. An inadequate quantity of exposure to a laser dicing blade can misdirect the vital coolant supply away from where it’s needed most: the interface between material and blade. Uncontrolled exposure to cutting elements may lead to a wider-than-intended kerf, unacceptable chip formation on the edges of cut materials, non-uniformity in cuts, and blade fracturing. It is impossible to determine the optimal dicing blade exposure for any given application with absolute certainty. To ensure the safety of users, some blade manufacturers have published guidelines that specify a blade exposure level to be no greater than ten times its thickness. Because it does not take into account the depth of the cut, the hardness of the dicing material, or the feed rate, this method is extremely misleading. However, to establish a starting point for determining the appropriate cutting blade exposure, some general guidelines are required like wafer coring services.

5. The Thickness of a Diamond Dicing Blade: How Can Wafers Be Processed Effectively? The diamond blade’s thickness when processing a particular dicing material is another concern when using tapes. The size of the radius crafted along the blade’s edge, combined with how much plastic is being moved during this process, directly influences thickness. Diamond blades that are made to cut hard materials, like the resin-bonded kind, have a natural radius at the cutting edge. This outstanding 300mm wafer dicing service offers an effortless way to cut through even the toughest materials. However, its profile is transmitted to the cutting material if it is not positioned far below it. The radius is larger the thicker the blade. The tip of the diamond blade cannot cut below the bottom surface of the substrate, due to tapes that are commonly no more than 3 mils thick.

6. Enhancing the tape’s thickness to six mils or more will only make matters worse by intensifying plastic displacement and diminishing system stability due to its additional plastic features. When cutting deeply into tapes, or applying laser dicing, the plastic will typically melt around the cutting edge. It will prevent efficient cooling and loading of the diamond blade, resulting in excessive blade wear. Until only around one millimeter of the blade is embedded in the tape, its quality and longevity will quickly diminish. Depending on the number and length of cuts in 300mm wafer dicing services, the blade will lose that one mil that was buried in the tape as it continues to cut the substrate. During the remaining cuts, the material will not be cut completely through.

7. Methods for Cutting Thicker Materials with Dicing Blades In most cases, thicker materials must be cut on graphite or glass carriers to ensure that they are consistently cut completely through the work piece. By utilizing this wafer coring services, cutting forces necessary for processing work pieces in critical applications are drastically diminished. The latter necessitates a softer carrier than the currently being processed work piece. Glass is suitable for most applications due to the dressing property that makes it suitable for diamond grinding or laser dicing. If the material is relatively flat, soda lime or simply window glass will suffice to ensure a snug fit with the chuck surface. In addition, for the majority of applications, it is recommended to cut the glass carrier a minimum of five miles. The work piece will have straight, parallel cut edges as a result of this, and there will be sufficient assurance that the substrate will be cut completely through up until the final cut. To maximize the amount of time your diamond blade’s cutting edge is in contact with softer materials and to reduce potential damage on thicker work pieces, experts recommend a 10-15 mils cut into the glass carrier.

8. The choice of wax is the most common issue with wax mounting materials for cutting. The majority of waxes cause “loading,” so choose them with caution. The majority of brown waxes are acceptable, but beeswax and paraffin-containing waxes should be avoided. Wax should be kept to a minimum at all times, and any excess should be removed before wafer coring services.

9. Using an Effective Dicing System: Where Do I Begin? The chances of successfully processing any given material will dramatically increase if the work that needs to be done is determined and the guidelines for building an effective sawing system are provided. Nevertheless, it is critical to understand the potential outcomes that can arise from other process variables such as the diamond blade and system operating parameters in order for a successful operation of the entire system. Source:https://insighthow.com/system-of-wafer-dicing-and-role-of-substrate/