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Three Dimensional Circuit Board Technology

Three Dimensional Circuit Board Technology David Perreault MIT IdeaStream April 8, 2004 Background Printed Circuit Boards (PCBs) form the backbone of most electronic systems $30B/yr market

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Three Dimensional Circuit Board Technology

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  1. Three Dimensional CircuitBoard Technology David Perreault MIT IdeaStream April 8, 2004

  2. Background • Printed Circuit Boards (PCBs) form the backbone of most electronic systems • $30B/yr market • Traditionally provide mechanical support and medium-density electrical interconnections among components • Copper foil is bonded to an insulator (laminate) and etched to form planar interconnect patterns • Multilayer boards are fabricated by stacking up layers • Holes are drilled and plated to interconnect layers • Planar interconnections • Pattern resolution is typically > 0.1 mm • Copper thickness 0.018 mm – 0.18 mm

  3. PCB Functionality • Printed circuit boards have taken on increasing degrees of functionality in modern circuit applications, e.g.: Busbars Heatsinking Magnetic windings Conventional PCBs are not very effective for these functions

  4. Three-Dimensional Circuit Boards • We are exploiting the third dimension to enable improved functionality: 3DPCBs • Component heights are typically ~1 mm+, so heights up to 1 mm are often “free” • Simple vertical patterns enable many important functions to be better realized • Heat sinks • Busbars • Magnetic windings • EMI shielding • Waveguides and resonators

  5. Three-Dimensional Patterning • To build in the third dimension, we employ photosensitive epoxies to form “molds” and “scaffolds” • Photolithography used to pattern 3D structures • Conductors plated onto the structures • Additional photolithography steps may be added for further patterning • Fabrication techniques and materials are largely compatible with existing processes • Photolithography • Electroplating • Etching

  6. (a) (b) (d) (c) MIME Fabrication Method(magnetic winding example) • Copper is electroplated into a 3D Mold • The mold can be removable with additional steps

  7. Scaffold Fabrication Method(heat sink example) • The patterned epoxy forms a 3D scaffold • Copper is deposited, patterned, and electroplated

  8. 1.5 mm Pin width is 1.5 mm 3DCB Winding Scaffold Vertical Structure: Height: 0.65 mm

  9. 1.5 mm diameter 1.2 mm deep wells of 1.5 mm diameter Three-Dimensional Circuit Board Structure (1.2 mm high)

  10. Summary • Printed Circuit Boards (PCBs) form the backbone of most electronic systems • Planar interconnects • Limited functionality • Three-Dimensional Circuit Boards (3DCBs) offer advantages for many common functions • Busbars, windings, heat sinks, EMI shields, waveguides • Fabrication methods are proposed for effective 3DCBs • Methods and materials are compatible with existing PCB processes • Results to date support the viability of 3DCBs

  11. Three-Dimensional Mold (enhanced contrast) 1.5 mm diameter 1.2 mm deep wells of 1.5 mm diameter

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