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Beyond CMOS CTSG IRC Meeting

DRAFT. Beyond CMOS CTSG IRC Meeting. December 15, 2009. Objectives Beyond CMOS CTSG IRC FxF Meeting Dec.15, 2009. Follow up discussion of shared treatment of Alternate Channel Materials – Transfer to PIDS Mention new Emerging Research Architectural planning underway for the 2011 ERD Chapter

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Beyond CMOS CTSG IRC Meeting

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  1. DRAFT Beyond CMOS CTSG IRC Meeting December 15, 2009

  2. Objectives Beyond CMOS CTSG IRC FxF Meeting Dec.15, 2009 • Follow up discussion of shared treatment of Alternate Channel Materials – Transfer to PIDS • Mention new Emerging Research Architectural planning underway for the 2011 ERD Chapter • Discuss ERD/ERM Workshops planned for 2010. • Memory Technology Assessment • Emerging Research Architectures • Emerging Research Devices – Hi Perf Computing • Emerging Research Devices – More than Moore

  3. Production Ramp-up Model &Technology Cycle Timing Proposal [Example: III-V MOSFET Channel Replacement Materials] 100M Production Research Development 200K 10M 20K 1M 2K Transfer to PIDS/FEP (96-72mo Leadtime) Alpha Tool Beta Tool Product Tool 100K Volume (Wafers/Month) 200 10K 1st 2Cos. Reach Product First Tech. Conf. Device Papers Up to ~12yrs Prior to Product 20 1K 2 0 24 -96 -72 -24 -48 Months III/V Hi-m gate Example: 2011 2013 2015 2017 2019 2021 Source: 2009 ITRS – ERD/ERM/PIDS/FEP Proposal for Rev 3 Hutchby First Tech. Conf. Circuits Papers Up to ~ 5yrs Prior to Product

  4. First Tech. Conf. Device Papers Up to ~12yrs Prior to Product III/V Hi-m gate Example: 2011 2013 2015 2017 2019 2021 Production Ramp-up Model &Technology Cycle Timing Proposal [Example: III-V MOSFET Channel Replacement Materials] Rev 4 Hutchby 100M Development Production Research 200K 10M 20K 1M 2K Transfer to PIDS/FEP (96-72mo Leadtime) Beta Tool Alpha Tool Product Tool 100K Volume (Wafers/Month) 200 10K 1st 2Cos. Reach Product 20 First Tech. Conf. Circuits Papers Up to ~ 5yrs Prior to Product 1K 2 0 24 -96 -72 -24 -48 Months Source: 2009 ITRS – ERD/ERM/PIDS/FEP Proposal for

  5. Major Challenges of III-V MOSFETs • High K Gate Dielectric • Passivation of High-K / III-V Semiconductor Interface • Integration of Ge and III-V Compound Semiconductor on Silicon • P-Channel III-V MOSFET or N-Channel Ge MOSFET

  6. Issues Related to III-V MOSFETs • Impact of parasitics on I-V Characteristics • Effect of source resistance • Ballistic model for III-V FETs: role of Density-of-States • Ballistic FET I-V characteristics: InGaAs & Si • Quasi-Ballistic I-V characteristics: InGaAs & Si • Impact of parasitics on switching behavior • Estimation of switching behavior • Switching behavior of quasi-ballistic FETs: InGaAs & Si • Performance projection with scaling • Dimensional scaling • Supply voltage scaling • Drain leakage current

  7. ERM ChallengesGe & III-V • Growth of low defect III-Vs on silicon • Co-integration of Ge & III-Vs • Ge dopant activation at higher temperatures • III-V doping of Ge • Growth of a high quality high κ dielectric on Ge & III-Vs • Passivation of the interface

  8. ERD & ERM Alternate Channel Assessments • Ge p-FET • III-V n-FET • Ge p-FET & III-V n-FETs (Separate Assessment?) • Nanowire FETs • Graphene FETs • Carbon Nanotube FETs

  9. III-V Ge Alternate Channel Partition Proposal ERM Materials, Interfaces & Process Issues & Challenges Critical Assessment of Materials & Integration Capabilities ERD Integrated Device Performance Assessment & Challenges (For different structures surface, buried channel, etc.) Critical Assessment of Device Performance FEP Potential Solution: SiGe P-FET with Si N-FET III-V & Ge Potential Solution Track III-V & Ge Issues PIDS III-V & Ge Potential Solution SiGe P-FET with Si N-FET Collaborate with ERD on device Readiness

  10. ERD Recommendation ERD recommends to PIDS and FEP that we transfer the III-V and Ge Alternate Channel Materials Technology Element to PIDS and FEP in 2011

  11. 2009 Emerging Architectures • Benchmarking • Memory • Morphic • Thermodynamic

  12. Proposed ERD/ERM Workshops

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