North America Metrics Technical Committee Chapter

1. North America Metrics Technical Committee Chapter Liaison Report September 2014

2. Outline • Leadership • Organization Chart • Meetings Information • Ballot Results • New Activities • Upcoming Ballots • TF Reports • Proposed Meeting Schedule • Staff Contact

3. Leadership • N.A. Metrics TC Chapter Cochairs • David Bouldin (Fab Consulting) • Mark Frankfurth (Cymer) • Wait Time Waste TF • Jackie Ferrell stepped down as the TF co-leader

4. Organization Chart Legend C Chair/Co-Chair L Task Force Leader TF Task Force TA Technical Architect TE Technical Editor North America Metrics TC Chapter C: David Bouldin (Fab Consulting) C: Mark Frankfurth (Cymer) TE: Carolyn Busing TA: Greg Francis (Cymer) Factory Level Productivity Metrics TF L: Ron Billings (Ore. State/FABQ) L: Jim Irwin (Irwin Consulting) Equipment RAMP TF L: Steven Meyer (Intel) L: David Busing (Consultant) EMC TF L: Vladimir Kraz (BestESD) L: Mark Frankfurth (Cymer) ESD/ESC TF L: Arnie Steinman (Electronics Workshop) Wait Time Waste TF L: Lance Rist (Industry Consultant) Equipment COO TF L: David Bouldin (Fab Consulting) L: Daren Dance (WWK) Equipment Training and Documentation TF L: Mark Cohran (Intel) L: Malthi Venkat (Nikon) NOTE: Italics means group is currently inactive.

5. Meeting Information • Last meeting • July 10, 2014 @ SEMICON West 2014 • San Francisco Marriott Marquis Hotel in San Francisco, California • Next meeting • November 5, 2014 @ N.A. Standards Fall 2014 Meetings • SEMI Headquarters in San Jose, California

6. Ballot Results Cycle 4 - 2014

7. New Activities SNARF - Standards New Activity Report Form

8. Current Ballots • None.

9. Subcommittee & TF Reports [1/7] • Electrostatic Discharge Association (ESDA) Report • ESD Industry Activities • ESDA and JEDEC are collaborating to release joint device test standards • They released The Human Body Model (HBM), which is available on the ESDA and JEDEC (www.jedec.org) Web sites • Possible collaboration with JEITA is being investigated • Work on the updated Charged Device Model (CDM) document is almost completed • ESDA Website (www.esda.org) • The following document are available for download on the ESDA Website: • ANSI ESD S20.20 (Static Control Program) • ESDA Glossary of Terms • ESD Technology Roadmap for Device ESD Sensitivity • STM 5.1– Human Body Model • STM 5.2 – Machine Model • STM 5.3.1 – Charged Device Model • ESDA Standards meeting last held April 4-6, 2014 in Tucson, Arizona/USA • Next Standards meetings will be held in September 4-12, 2014 in Tucson, Arizona/USA • Visit the ESDA Web site (www.esda.org) for more information

10. Subcommittee & TF Reports [2/7] • Electromagnetic Compatibility (EMC) TF • EMC activities in the industry • European EMC Directive Recast was published in April 2014 to align with the New Legislative Framework • The ITRS roadmap now includes information on Electromagnetic Interference limit • Upcoming ESD Symposium meeting dates: • ESD Symposium: September 7-12, 2014 in Tucson, Arizona/USA • ESD Symposium on Factory Issues: October 30-31 in Munich, Germany • IEEE EMC Symposium: August 3-8 in Raleigh, North Carolina/USA

11. Subcommittee & TF Reports [3/7] • Electromagnetic Compatibility (EMC) TF (continued) • TF Discussions • There was good representation across the industry participating in the last TF meeting: • semiconductors (ST Micro) • fiber optics (Finisar) • disk drive (Seagate) • electronic assembly (Bose) • education (National University of Taiwan) • equipment manufacturer (Cymer) • industry consultant (BestESD) • The TF received and distributed examples of electromagnetic interference (EMI) occurrences in the manufacturing environment from participants • The TF presented a plan for the first step in drafting a new standard for EMI Control: (Guide for EMI Measurements) • There was definite interested from Asia for such a document • The first document for letter balloting will be after Spring 2014 as there is a bit more work to be done

12. Subcommittee & TF Reports [4/7] • Technical Editors Board • No current update to the Style Manual • Revisions to the SEMI Standards Regulations and Procedure Guide to begin near SEMICON Japan 2014 • Technical Architects Board • There were no new updates • Proposal to sunset the Technical Architects Board still pending • Equipment Training and Documentation TF • The TF discussed future activities regarding implementation of 450 mm guidelines/standards for generic skills task list

13. Subcommittee & TF Reports [5/7] • Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics TF • The TF has no future SNARFs or ballots • They are only focused on developing technical education materials for • SEMI E10 (Equipment Reliability, Availability, and Maintainability (RAM) and Utilization) • SEMI E79 (Definition and Measurement of Equipment Productivity) • The possible technical education materials: • Standards Technical Education Programs • Webinar • Workshop

14. Subcommittee & TF Reports [6/7] • Electrostatic Discharge/Electrostatic Charge (ESD/ESC) TF • The TF is currently planning to revise the following documents: • SEMI E43 - Recommended Practice for Electrostatic Measurements on Objects and Surfaces • Revisions include ESD event monitoring, Faraday FOUP measurements, discharge time effects, generic equipment list • SEMI E78 - Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment • SEMI E129 - Guide to Assess and Control Electrostatic Charge in a Semiconductor Manufacturing Facility • Revisions to E78 and E129 include reticle sensitively, ESD device testing/damage, Charged Board Event (CBE), Electrical Overstress (EOS), Cable Discharge Events (CDE), and discharge current testing • SEMI E163 - Guide for the Handling of Reticles and Other Extremely Electrostatic Sensitive (EES) Items Within Specially Designated Areas • Revisions include Equipotential bonding of Extremely Electrostatic Sensitive (EES) items and adding a test method to define damage to devices that occurs when the package becomes tribocharged and when the device is equipotentially bonded without a discharge occurring

15. Subcommittee & TF Reports [7/7] • Wait Time Waste Time (WTW) TF • The TF discussed Product Time Measurement (PTM) applied to Automated Material Handling Systems (AMHS) • There are three subsystems for AMHS with three interfaces: • MCS to Factory Information and Control Systems • Transport System Controller (TSC) to MCS • Storage System to MCS • The TF will integrate PTM to each AMHS subsystem and interface as future subordinate documents to SEMI E168 (Specification for PTM) • Why AMHS? • AMHS provides a beginning-to-end view of product • Each subsystem of AMHS provides a high level view of product time • We can then “zoom in” as needed • Datasets can be analyzed separately, but also can be merged • Our GEM 300 equipment view is an example of that (E168.1)

16. Next Meeting Schedule The next N.A. Metrics Standards Meetings are tentatively scheduled for November 3 – 5, 2014 at SEMI Headquarters in San Jose, California in conjunction with the N.A. Standards Fall 2014 Meetings. Exact meeting date and details will be announced when finalized and available at http://www.semi.org/node/50511 Monday, November 3* · Wait Time Waste TF (3:00 PM - 6:00 PM) Tuesday, November 4* · Equipment T&D TF (9:00 AM – 12:00 PM Noon) · ESD/ESC TF (1:30 PM – 3:30 PM) · EMC TF (5:00 PM – 7:00 PM) Wednesday, November 5* · Equipment RAMP Metrics TF (9:00 AM – 12:00 PM Noon) · N.A. Metrics TC Chapter (2:00 PM – 5:00 PM) *All times are in Pacific Time. Times and dates are subject to change without notice.

17. Thank You! For more information or to participate in any N.A. Metrics activities, please contact Michael Tran (mtran@semi.org)