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Industry Terminology 工 业 术 语

Industry Terminology 工 业 术 语. EMS (Electronics Manufacturing Services) EMS-- 电子制造服务 Provides assembly services for which you do not own the intellectual property 提供组装服务， 但不拥有自主知识产权的公司、企业. Original Design Manufacturer (ODM) ODM-- 原始设计制造商

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Industry Terminology 工 业 术 语

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  1. Industry Terminology 工 业 术 语 IPC Market Research

  2. EMS (Electronics Manufacturing Services) EMS--电子制造服务 Provides assembly services for which you do not own the intellectual property 提供组装服务， 但不拥有自主知识产权的公司、企业 IPC Market Research

  3. Original Design Manufacturer (ODM) ODM--原始设计制造商 Provides assembly and system builds services for which the company owns the intellectual property. 提供组装和系统构建服务， 且拥有自主知识产权的公司、企业 IPC Market Research

  4. Vertical EMS Company An EMS company which owns their supply chain – PCB manufacturing. Sanmina-SCI 纵向EMS公司-- 拥有自己供应链的EMS公司 如PCB制造。Sanmina-SCI Virtual EMS Company An EMS company which outsources material. Jabil EMS公司 -- 其材料均外购的EMS公司。Jabil IPC Market Research

  5. EMS Size Based on Sales Dollar按销售额EMS公司分为： • Large (Tier I) ---- 大型（1级） • Greater than $3 billion---- 大于30亿美元 • Mid (Tier II) ---- 中型（2级） • $400 million to $3 billion ---- 4亿--30亿美元 • Small (Tier III) ---- 小型（3级） • $100 million to $400 million---- 1亿--4亿美元 • Micro (Tier IV) ---- 微型（4级） • Below $100 million ---- 小于1亿美元 IPC Market Research

  6. EMS Stock Highlights Q3 2006 2006年第3季度EMS股市指数 • Large Index has increased +6.7% from last quarter 大型公司指数比上一季度升高了+6.7% • Mid Index has decreased (19.4%) from last quarter 中型公司指数比上一季度降低了(19.4%) • Small Index has decreased (4.2%) from last quarter 小型公司指数比上一季度降低了(4.2%) • Micro Index has increased +33.7% from last quarter 微型公司指数比上一季度升高了+33.7%

  7. Global EMS Market Status 全球EMS市场状况 IPC Market Research

  8. 2005年全球各区域EMS/ODM市场份额及2010年预测 IPC Market Research

  9. 北美及全球EMS/ODM 市场增长预测 IPC Market Research

  10. ＊Revenue by Country—-国家税收 ＊CAGR----年均复合增长率 IPC Market Research

  11. 全球EMS/ODM 市场预测 *EMS – Served available market EMS—部分现有市场 * OEM – Available total market OEM—全部现有市场 IPC Market Research

  12. Status of EMS Market in North America 北美EMS市场状况 IPC Market Research

  13. 北美EMS/ODM 全部现有市场潜力 IPC Market Research

  14. 北美组装市场历史、预测及发展走势 IPC Market Research

  15. 北美EMS企业数量（估计） IPC Market Research

  16. 人均销售额历史数据（来源：IPC统计项目部） IPC Market Research

  17. 北美所有参与公司收入来源走势 IPC Market Research

  18. 2005 收入百分比（北美所有参与公司） IPC Market Research

  19. 北美所有参与公司所服务工业市场走势（2004-2006）北美所有参与公司所服务工业市场走势（2004-2006） IPC Market Research

  20. 2005 面向主要工业市场的公司销售百分比 IPC Market Research

  21. 2005 客户合作期 ---- 北美所有参与公司 IPC Market Research

  22. 2005 及2006年订单规模占所有定单总值百分比 IPC Market Research

  23. 2004 及2005年订单规模占所有定单总值百分比 IPC Market Research

  24. 北美所有参与公司资产设备占总销售额的百分比北美所有参与公司资产设备占总销售额的百分比 IPC Market Research

  25. 2004-2005北美所有参与公司安装在电路板上的元件类型及百分比2004-2005北美所有参与公司安装在电路板上的元件类型及百分比 IPC Market Research

  26. Status of EMS Market in China 中国EMS市场状况 IPC Market Research

  27. 2005亚洲所有参与公司收入百分比 IPC Market Research

  28. 亚洲所有参与公司所服务工业市场走势（2004-2006）亚洲所有参与公司所服务工业市场走势（2004-2006） IPC Market Research

  29. 2005公司销售占主要工业市场的百分比 （亚洲所有参与公司） IPC Market Research

  30. 2005 客户合作期 -- 亚洲所有参与公司 IPC Market Research

  31. 2004-2005亚洲所有参与公司安装在电路板上的元件类型及百分比2004-2005亚洲所有参与公司安装在电路板上的元件类型及百分比 IPC Market Research

  32. Global Lead Free Implementation 无铅在全球的实施 IPC Market Research

  33. OEM—无铅实施准备状况 全部实现 无铅组装 尚未 准备 完成了无铅 样品生产 选择了焊 料和涂层 选择了焊 料，但未 用于生产 IPC Market Research

  34. EMS--无铅实施准备状况 全部实现 无铅组装 完成了无铅 样品生产 选择了焊 料，但未 用于生产 尚未 准备 选择了焊 料和涂层 IPC Market Research

  35. OEM—无铅实施中的最大成本 IPC Market Research

  36. EMS—无铅实施中的最大成本 IPC Market Research

  37. OEM — 无铅实施中的主要障碍 IPC Market Research

  38. EMS — 无铅实施中的主要障碍 IPC Market Research

  39. OEM—无铅与锡铅之比 IPC Market Research

  40. EMS—无铅与锡铅之比 IPC Market Research

  41. Threats to EMS companiesEMS企业面临的挑战 Lead Free 无铅 IPC Market Research

  42. It is estimated that lead free will increase assembly cost by at least 10% 据估计无铅将使组装成本至少增加10% IPC Market Research

  43. Threats to EMS companiesEMS企业面临的挑战 Lead Free Technology 无铅技术 IPC Market Research

  44. Solectron Recommendation for Lead FreeSolectron公司关于无铅的建议 • Solder paste – Sn3Ag0.5Cu 焊膏 • Wave solder – Sn3Ag0.5Cu 波峰焊用焊料 • Hand solder – 96.5Sn3.5Ag 手工焊用焊料rework wire • BGA rework – 95.5Sn3Ag0.5Cu BGA返工solder paste or paste flux. 焊膏或膏状助焊剂 IPC Market Research

  45. Solectron Recommendation for Lead FreeSolectron公司关于无铅的建议 Today’s situation 目前状况 1. Tin-lead solder paste with tin-lead components: Generally O.K. 锡铅焊膏与锡铅元件：通常不会发生问题 • Tin-lead solder paste with lead-free components: 锡铅焊膏与无铅元件： • Danger with assembly of lead-free CSP/ BGAs: Insufficient collapse/realignment/ opens due to low temperature tin-lead assembly profile 组装无铅CSP/BGA时会有危险----由于锡铅组装曲线温度较低，会导致坍塌不充分/自对准/开路 IPC Market Research

  46. Solectron Recommendation for Lead FreeSolectron公司关于无铅的建议 Tomorrow’s situation 未来状况 • Lead-free solder paste with tin-lead components: 无铅焊膏与锡铅元件： • Danger with tin-lead CSP/BGAs: Voiding/ bridging (CSP/BGA sphere reflows before solder paste) 对锡铅元件比较危险：空洞/桥接 • Are tin-lead and lead-free components and boards rated to higher lead-free soldering temperatures 锡铅元件同无铅元件及板子一样要经受较高的无铅焊接温度 • Lead-free solder paste with lead-free components. 无铅焊膏与无铅元件： • Are lead-free components and boards rated to higher lead-free soldering temperatures 无铅元件及板子要经受较高的无铅焊接温度 IPC Market Research

  47. Solectron Recommendation for Lead FreeSolectron公司关于无铅的建议 Designated production areas for lead-free wave and rework 指定无铅波峰焊和返工生产区域 • Dedicated lead-free wave solder machine 指定无铅波峰焊设备 • Logistics to separate lead-free SnAgCu and SnPb solder bar (including triangular shaped bar for lead-free) 在物流方面要分开放置无铅SAC和锡铅焊料棒 • Rework solders must be compatible with the manufactured solder – need separate designated lead-free rework area in production and methods to deal with field returns. 返工焊料必须与制造所用焊料兼容 — 必须区分生产中所指定的无铅返工区域和处理现场返回的方法 IPC Market Research

  48. Solectron Recommendation for Lead FreeSolectron公司关于无铅的建议 Designated production areas for lead-free wave and rework 指定无铅波峰焊和返工生产区域 • Lead-free component and board labeling will be needed to differentiate between SnPb and lead-free assemblies for assembly, repair and rework (Refer to JEDEC standard, JESD97: Marking, Symbols and Labeling for lead-free assemblies, components and devices and IPC 1066 standard for lead-free labeling) 为了便于组装、返修和返工，在锡铅与无铅组件之间必须区分无铅元件 和板子标签（可参考JEDEC标准-JESD97和IPC标准IPC-1066 ） • Planning of production line is essential for lead-free assembly. 规划无铅组装生产线是无铅组装必需的。 IPC Market Research

  49. Solectron Recommendation for Lead Free-- Site TransitionSolectron公司关于无铅的建议—现场转换 • Site must run qualification test vehicle 现场必须进行资格测试 • a. SMT a. SMT • Process (Training/ Support) 工艺（培训/支持） • Equipment 设备 • b. Wave b. 波峰焊 • Process (Training/ Support) 工艺（培训/支持） • Equipment 设备 • Product Review 产品审核 1. Complexity of Product and End-Of-Life of Product (2006) 产品复杂性和产品的（2006） 2. SMT (Quantity and Type) SMT（数量和类型） 3. Wave (Quantity and Type) 波峰焊（数量和类型） • PCB (Material and Surface Finish) PCB（材料和表面涂层） • Components (Material and Surface Finish) 元件（材料和表面涂层） IPC Market Research

  50. Solectron Recommendation for Lead Free-- Site TransitionSolectron公司关于无铅的建议—现场转换 3. BOM Component Scrubbing (Temperature rating, lead-free specifications) BOM元件整理（温度等级、无铅技术规范） • Global Materials Component Engineering Support (Supplier Development Engineering), 全球材料元件工程支持（供应商开发工程） 2. Consigned/ Turnkey 委托/总承包 4. Prototype Builds (Manufacturing and reliability trials) 原型构建（制造和可靠性试验） 5. Pilot Builds (Manufacturing and reliability trials) 试生产（制造和可靠性试验） 6. Production 批量生产 IPC Market Research

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