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CMOS Manufacturing Process

CMOS Manufacturing Process. CMOS Process. Circuit Under Design. This two-inverter circuit (of Figure 3.25 in the text) will be. manufactured in a twin-well process. Circuit Layout. Process Flow. These slides only present only a couple of snapshots of the .

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CMOS Manufacturing Process

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  1. CMOSManufacturingProcess

  2. CMOS Process

  3. Circuit Under Design This two-inverter circuit (of Figure 3.25 in the text) will be manufactured in a twin-well process.

  4. Circuit Layout

  5. Process Flow These slides only present only a couple of snapshots of the manufacturing process for the circuits presented in the textbook. For a complete overview of all 62 steps, please refer to: http://tanqueray.eecs.berkeley.edu/~ehab/inv.html. Credits for these pictures go to Ehab Hakeem, Prof. Andrew Neureuther and the Simpl program.

  6. Starting wafer: n-type with doping level = 10 13 3 /cm Start Material A A’ * Cross-sections will be shown along vertical line A-A’

  7. N-well Construction (1) Oxidize wafer (2) Deposit silicon nitride (3) Deposit photoresist

  8. N-well Construction (4) Expose resist using n-well mask

  9. N-well Construction (5) Develop resist (6) Etch nitride and (7) Grow thick oxide

  10. N-well Construction (8) Implant n-dopants (phosphorus) m (up to 1.5 m deep)

  11. P-well Construction Repeat previous steps

  12. Grow Gate Oxide 0.055 mm thin

  13. Grow Thick Field Oxide 0.9 mm thick Uses Active Area mask Is followed by threshold-adjusting implants

  14. Polysilicon layer

  15. Source-Drain Implants

  16. Source-Drain Implants

  17. Contact-Hole Definition (1) Deposit inter-level dielectric (SiO2) — 0.75 mm (2) Define contact opening using contact mask

  18. Aluminum-1 Layer Aluminum evaporated (0.8 mm thick) followed by other metal layers and glass

  19. Advanced Metalization

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