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B-staging of toughened epoxy composites by Fred Arnold and Steve Thoman. Elgin Bravo February 09, 2001. Overview of B-stage process for LLP. Reduce package size by wirebonding close to the edge of the die. Backcoat wafers with a B-stage epoxy.
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B-staging of toughened epoxy compositesbyFred Arnold and Steve Thoman Elgin Bravo February 09, 2001
Overview of B-stage process for LLP • Reduce package size by wirebonding close to the edge of the die. • Backcoat wafers with a B-stage epoxy. • Delamination of die from DAP due to high humidity and temperature. • Understand structure and properties of epoxy.
About the authors • Fred Arnold and Steve Thoman affiliated with Naval Air Warfare Center • Polymers and Composite branch. • 28th International SAMPE conference Seattle WA, 1996
Objectives • Characterize cure behavior and glass transition temperature of Hercules 8552 sulfone toughened B-stagable epoxy.
Definition of B-staging • To cure an epoxy to a pre-determined degree of chemical conversion. • Stage o Chemical conversion • Green 0 • B-stage <0.29 • C-stage <0.90
Equipment • Dynamic Mechanical Analyzer (DMA) • glass transition • secondary transitions • gelation • vitrification • Differential Scanning Calorimeter (DSC) equipped w/ modulated DSC cell (MDSC) • specific heat capacity • heats of transition • temperature of phase change
Experimental • Sample size: • 3-5 mg for resin • 25-35 mg for B-staged • Heating rate • 3oC/min • Modulation frequency • 0.5oC
Tg of green epoxy at 23oC T(t) = To + Bt dQ/dt = CpB + f(t,T)
Results • MDSC produces more accurate results • Reversing component eliminates effect of residual heat release near Tg • Optimum B-stage temperature obtained to ensure mechanical strength at RT
Research comparison • Understand Tg using DSC • Degree of chemical rxn for B & C stage • Die delamination • MDSC not available