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EuroSimE, 18-20.04.2011, Linz, Austria

Trends of Micro- and Nanoelectronics in the European R&D Programme Vesselin Dontchev Nanoelectronics Components and Systems Information Society & Media Directorate-General European Commission. Disclaimer : Views expressed in this presentation are not necessarily stating

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EuroSimE, 18-20.04.2011, Linz, Austria

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  1. Trends of Micro- and Nanoelectronics in the European R&D ProgrammeVesselin DontchevNanoelectronics Components and SystemsInformation Society & Media Directorate-GeneralEuropean Commission Disclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission EuroSimE, 18-20.04.2011, Linz, Austria

  2. Presentation outline • Europe 2020 – a new strategy for the EU • Current EC funding of EU Research (ICT in particular) • Nanoelectronics- Examples of research projects dealing with simulation • Today’s opportunities: ICT WP 2011-12 • Information on the future programme (2014+) • Summary EuroSimE, 18-20.04.2011, Linz, Austria

  3. • Smart Growth: knowledge and innovation economy • Sustainable growth: greener and competitive economy • Inclusive growth: high employment, knowledge people and social and territorial cohesion A new strategy - EUROPE 2020 EUROPE 2020: A EU strategy for smart, sustainable and inclusive growth 5 EU Targets – translated into national ones 7 Flagship initiatives – EU & national action EuroSimE, 18-20.04.2011, Linz, Austria

  4. Europe 2020: 5 EU Headline Targets (translated in national and regional ones) By 2020: • 75 % (now 69) employment rate (% of population aged 20-64 years) • 3% (now 1,8 % only) investment in R&D(% of EU’s GDP) • “20/20/20” 20% cut in greenhouse gas emissions (compared to 1990) 20% increase in use of renewable energy 20% cut in energy consumption through improved efficiency • < 10% (now 15) early school leavers & min. 40% (now 31) hold tertiary degree • 20 million less people (now 80) should be at risk of poverty EuroSimE, 18-20.04.2011, Linz, Austria

  5. Presentation outline • Europe 2020 – a new strategy for the EU • Current EC funding of EU Research (ICT in particular) • Nanoelectronics - Examples of research projects dealing with simulation • Today’s opportunities: ICT WP 2011-12 • Informationon the future programme (2014+) • Summary EuroSimE, 18-20.04.2011, Linz, Austria

  6. The EU’s research and innovation landscape Ageing (More Years Better Lives) Climate Knowledge (Clik-EU) Seas and Oceans Antimicrobial resistance Urban Europe Water challenges National and Regional Funds Joint Programming Eureka! EUROSTARS JTI Artemis, Eniac Clean Sky, IMI, FCH Art. 169 AAL Bonus EMRP FP7 ERANET COOPERATION PPP EC Funds PPP (recovery packages) Energy Efficient Buildings Future of Factories Green cars Future Internet ICT-FET (Flag Ships) ERANET+ IDEAS - ERC SMEs and SME Associations Capacities (INFRASTRUCTURES) PEOPLE Fundamental Applied Development Innovation CIP competitiveness & innovation programme Deployment

  7. FP7: total of 50 B€ (2007-13) 5 major specific programmes: FP7: Council/Parliament Co-decision EuroSimE, 18-20.04.2011, Linz, Austria

  8. FP7 Cooperation Specific Programme 10 key thematic areas: +700M€ for eInfrastructures from the Capacities programme EuroSimE, 18-20.04.2011, Linz, Austria

  9. Challenges in the ICT programme 2011-2012(What is the money spent on?) ICT for socio-economic challenges 5. ICT for Health, Ageing, Inclusion & Gov. 6. ICT for Lower-Carbon Economy 7. ICT for Manufac. & Enterprise 8. ICT for Learning & Cultural Resources ~10% ~11% ~12% ~6% ~4% ~9% +AAL incl FI PPP PPP 2 PPPs 1. Network and Service Infrastructures ~11% ~26% 2. Cognitive Systems and Robotics ~6% Future & Emerging Technologies (FET) Basic ICT technologies & infrastructures 3. Components and Systems +JTIs ~17% 4. Digital Content and Languages ~7% International cooperation, Horizontal actions ••• 9

  10. Financial support • FP7: master & shape research & development • CIP: ensure wider uptake & better use of research • + Regional and Structural Funds,… FP7-CIP/ICT Budget Profile: 2nd half of FP7 – significant increase of funding ! EuroSimE, 18-20.04.2011, Linz, Austria

  11. In 2011, the FP7 ICT Programme is in its 5th year of implementation 7 main calls have been launched and evaluated Total number of projects ~1200 Launch of two JTIs and AAL initiative 4 Calls launched for ENIAC with 130 M€ (EC contribution)4th call is ongoing WP 2011-12 done, WP 2013 (1.76B€) is in preparation ICT in FP7: Where do we stand? EuroSimE, 18-20.04.2011, Linz, Austria

  12. ICT in the FP supports collaborative R&D projects industry - academia from at least 3 MS or AS Project size between 3M€ and 20 M€ of funding 4 to 20 partners per project Supports ~17 000 researchers and engineers/year During 2007-10 ~ 5000 distinct organisations, ~14000 participations ~ 1250projects running (FP6 + FP7) ICT in FP7 EuroSimE, 18-20.04.2011, Linz, Austria

  13. Presentation outline • Europe 2020 – a new strategy for the EU • Current EC funding of EU Research (ICT in particular) • Nanoelectronics - Examples of research projects dealing with simulation • Today’s opportunities: ICT WP 2011-12 • Informationon the future programme (2014+) • Summary EuroSimE, 18-20.04.2011, Linz, Austria

  14. Atomics Advanced Front-End Technology Modeling for Ultimate Integrated Circuits FP6 IST programme Consortium MOTIVATIONTCAD can save 30% development time and costs (ITRS 2008) OBJECTIVESDevelopment of TCAD models suitable for a) materials (strained and unstrained SiGe alloys, strained Si, SOI, etc); b) processes (activation and diffusion of dopants, formation of extended defects, including low-temperature and millisecond annealing, point-defect engineering) employed at the 32 nm technology node and beyond. ExampleDependence of dopant solubility on strain (Ahn et al. PRB 2009) • The models are • implemented in simulation software Sentaurus (Synopsys) • validated with respect to industrial needs (STM) Budget Total Cost: 4.4M€ EC : 2.5 M€ http://www.iisb.fraunhofer.de/en/arb_geb/atomics.htm EuroSimE, 18-20.04.2011, Linz, Austria

  15. Atemox Advanced Technology Modeling for Extra-Functionality Devices Objectives- extend the capabilities of TCAD to the prediction of - leakage currents in CMOS structures - the alternative doping processes considered for a reduction of leakage currents. Consortium • Key Issues • Full set of missing models for simulating leakage currents in CMOS derivatives → providing extra functionality to the basic NE technology with sizes  22 nm CMOS transistors. • Implementation and integration of the models into the Sentaurus TCAD platform of Synopsys. • Evaluation of the integrated models by STMicroelectronics. Expected impact • Predictive simulations of CMOS derivatives in industrial environments at an early stage of development. • Significant reduction of development time and costs. • Extending the EU knowledge and skills in NE • Competitiveness of EU industry in CMOS derivatives Budget Total Cost: 4.1M€ EC Contribution: 2.85 M€ http://www.atemox.eu/ EuroSimE, 18-20.04.2011, Linz, Austria

  16. Presentation outline • Europe 2020 – a new strategy for the EU • Current EC funding of EU Research (ICT in particular) • Nanoelectronics - Examples of research projects dealing with simulation • Today’s opportunities: ICT WP 2011-12 • Informationon the future programme (2014+) • Summary EuroSimE, 18-20.04.2011, Linz, Austria

  17. ICT Work Programme 2011-2012Challenge 3: Alternative Paths to Components and Systems Objectives: 3.1. Nanoelectronics 3.2 Smart components and smart systems 3.3 Embedded systems 3.4 Computing Systems 3.5 Photonics 3.6 Organic Electronicsand Photonics

  18. Objective 3.1: Very Advanced Nano-electronics Components Target outcomes: Beyond CMOS technology Circuit - technology solutions Nano-manufacturing and Joint Equipment Assessment Coordination and Support Actions ICT Work Programme 2011-12 Call 8 60M€ EuroSimE, 18-20.04.2011, Linz, Austria

  19. ICT Work Programme 2011-12 Future & Emerging Technologies – FETSupporting high-risk transformative research in ICT Two complementary funding schemes • FET Proactive • Top-down approach • Set of novel pre-defined themes • FET Open • Bottom-up approach • Open to any research idea Nano-electronics related topics with EU funding ~ 30M€/year: Molecular-scale systems, Tera-scale computing, Quantum-ICT, Bio-Chemistry-based ICT and Towards zero power ICT EuroSimE, 18-20.04.2011, Linz, Austria

  20. European vision of the More Moore and More than Moore domains Analog/RF Passives HV Power SensorsActuators Biochips Interacting with people and environment Non-digital content SoC & System-in-Package (SiP) 130nm 90nm Moore’s Law: Miniaturization 65nm Combining SoC and SiP: Higher Value Systems Information Processing Digital content System-on-Chip (SoC) Baseline CMOS: CPU, Memory, Logic 45nm 32nm 22nm Extended CMOS Nanoelectronics”Small, smaller, smarter” - Advanced components in advanced systems enabling pervasive applications - More than Moore: Diversification Beyond CMOS Beyond & Extended CMOS technologies need to meet the criteria of systemability,integratabilityandmanufacturability

  21. Objective 3.1: Advanced Nanoelectronics Technology S y s t e m a b i l i t y • To ensure interactionbetweensystem competencesand device technology to better incorporate the device in a system to perform a given function. • To address energy efficiency needs (e.g. for mobile applications). • Nanoelectronics devices as system enablers should provide solutions for global challenges • To prepare for “beyond” traditional shrinking (ITRS roadmap) 35 nmGate Length EuroSimE, 18-20.04.2011, Linz, Austria

  22. ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms. Objective 3.1: Advanced Nanoelectronics Technology I n t e g r a t a b i l i t y • Future developments in Beyond CMOS and More than Moore as an extended-CMOS vision. No disconnection from the advanced silicon CMOS in order to keep the impact of its results on the applications and markets. • Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures. • Integrateabilityof novel technology with CMOS and their reliability become key factors. EuroSimE, 18-20.04.2011, Linz, Austria

  23. European equipment and material companies i) Access to nano-manufacturing and to advanced technologies  positive feedback ii)Joint assessment and demonstration platform Evidence of reproducible equipment parameters Stimulate the access to world wideequipment market(especially important for SMEs) Metrology Using X-Ray Techniques Jordan Valley, CEA-LETI, STMicroelectronics Crolles II, NXP Crolles R&D Ruthenium Atomic Vapor Deposition Competitiveness in Nanoelectronic Device Generations AIXTRON, Fraunhofer IISB, Infineon Munich Semiconductor Equipment for Wafer Bonding with Plasma Activation EV Group, CEA-LETI, Soitec 3D Integration of Bulk Si Wafers EV Group, CEA-LETI, STMicroelectronics Crolles II Low Energy and Dose Implant Test SEMILAB, Fraunhofer IISB, ST Microelectronics Crolles II, NXP Crolles R&D Objective 3.1: Manufacturing and Equipment assessment • M a n u f a c t u r a b i l i t y • Concept to be taken into account at early stages of research • From prototype to a reliable manufacturing of devices with predefined reproducible parameters. EuroSimE, 18-20.04.2011, Linz, Austria

  24. Objective 3.1 Modelling and simulation • 1. Phenomena and Effects • * Quantum and atomic scale ; * Electro-thermo-mechanical • * Transport (drift, diffusion ); * System integration at the nanoscale • 2. New materials • * Graphene; Gemanene; * CNT; • * Nanowires; * Complex magneto-electric lattices. • 3. Devices • * New switches (+molecular) and interconnects; * Emerging memories; • * Ferromagnetic logics; * Spin devices; • * Nano-photonics devices and interconnects; * Carbon based; • * MEMs, NEMs • 4. Models for cross technology and cross IP level simulation • 5. Multi-physics and multi-scale models, which can predict devices and circuits up to non-equilibrium systems. Modeling & Simulation – increasing importance (save costs !) models measurements (challenging due to the miniaturization)

  25. Dates Open: 26 July 2011 Close: 17 January 2012 (at 17:00 Brussels local time) Funding schemes: Beyond CMOS technology: STREPs Circuit-technology solutions: STREPs and at least 1 IP Nano-manufacturing and joint equipment assessment: STREPs and at least 1 IP Support measures: CSAs Indicative budget distribution - 60 M€: IP/STREP 55 M€ CSA 5 M€ Objective 3.1 Information about call 8

  26. ICT Proposers’ Day 201119 - 20 May, BudapestNetworking for European ICT R&D Aim of the event: to prepare for Calls 8 and 9 (together >1 B€) by networking and partnerships building by first-hand information from >100 EC officials Structure: thematic sessions with presentations of proposal ideas information stands & meeting points Registration: free of charge, open from January 2011 http://ec.europa.eu/ictproposersday EuroSimE, 18-20.04.2011, Linz, Austria

  27. Presentation outline • Europe 2020 – a new strategy for the EU? • Current EC funding of EU Research (ICT in particular) • Nanoelectronics - Examples of research projects dealing with simulation • Today’s opportunities: WP 2011-12 • Information on the future Common Strategic Framework (CSF) for R&I funding (2014+) • Summary EuroSimE, 18-20.04.2011, Linz, Austria

  28. What is next? 2010 2011 2012 2013 2014 ICT WP 2011-12 FP7 ICT WP 2013 Preparatory work FP8 + CIPII CSF (Common Strategic Framework) • 9 Feb Green Paper • Feb-May Consultation based on Green Paper • 10/6 Consultation ‘wrap-up’ event in Brussels • June Proposal for next MAFF • Dec Legislative proposal(s) for CSF Light and fast EIPs Strengthen, focus & simplify KETs Externalisation MAFF 2014+

  29. Common Strategic Framework (CSF) for EU R & I funding ( 2014+ ) Three key messages More clarity of goals and strategy, - Higher impact on competitiveness / society, - More EU added value Simplification Procedures but also of programmes/instruments →To attract wider constituency, smaller entities Work across silos research-innovation-policy priorities between themes and disciplines EU-MSs, public-private • Limited set of funding schemes - common across all activities • Unique Rules for Participation • Simplifiedcost-reimbursement approach with enhanced use of lump sums and flat rates. EuroSimE, 18-20.04.2011, Linz, Austria

  30. 3 sets of challenges, 4 types of activities, (funding schemes)” Common Strategic Framework for EU R&I funding (2014+) Some first and preliminary thinking (from ICT theme) A challenge oriented R&I framework A shift in the drive: From means/instruments to goals Draft Roadmap based partn. (Focus) Infrastr., skills (attract) Piloting (test, duffuse) Open, light (be flexible) Societal challenges e.g. Living labs Pilots Industrial leadership e.g. Clean rooms, Innovation clusters Pilots Excellence in science E-Infrastruct . EuroSimE, 18-20.04.2011, Linz, Austria

  31. Summary • EUROPE 2020 • - renewed emphasis on R&D&I as a basis for smart, sustainable and inclusive growth. • MAFF 2014+, CSF • 2011-2012 is key for the preparation: New opportunities for improvements and for holistic integrated views to face grand challenges (EU and global) • Nanoelectronics has a major input to these processes • Modeling & Simulation – increasing importance • Participate in Call 8 !!! « Time is ready. Let us profit from these exciting times and take action ---- together -----” EuroSimE, 18-20.04.2011, Linz, Austria

  32. !!!! Take part in the consultation processes !!!! !!!! 2011 is a year of change, you can influence the future !!!! http://ec.europa.eu/yourvoice/consultations/index_en.htm THANK YOU Vesselin.Dontchev@ec.europa.eu • Information Society and Media: • http://ec.europa.eu/information_society • http://cordis.europa.eu/fp7/ict/nanoelectronics/mission_en.html • European research on the web: • http://cordis.europa.eu • http://www.eniac.eu EuroSimE, 18-20.04.2011, Linz, Austria

  33. EuroSimE, 18-20.04.2011, Linz, Austria

  34. Work Programme 2011-12General concepts Transversal Research Projects Multi-disciplinary cooperation • System-technology interaction • Nanofabrication • Energy efficiency • Next switch • Universal memory • 3D integration • Novel architectures - Advanced component technology + advanced system design - Beyond CMOS , Extended CMOS For systems 2020 and beyond Systemability, integratability, manufacturability

  35. Objective 3.1: Very Advanced Nano-electronics Components • Target outcomes • Beyond CMOS technology • New switches and interconnects with energy efficiency gain; • Emerging memories; • Nano-photonics devices and interconnects; • Carbon based electronic devices • Circuit-technology solutions • Architectures including energy efficiency, spin devices ferromagnetic logics, Si with molecular switches • Circuit design, methodology and tools addressing e.g. D-A-C • Technology addressing 3D integration, MtM, photon-electron integration, power dissipation, etc. • Modelling and simulation • Nano-manufacturing and Joint Equipment Assessment • Manufacturing approaches to Beyond CMOS and MtM and their integration with nanoCMOS including 3D • Metrology/inspection analysis concepts; assembly and packaging • Joint assessment of equipment/metrology, process solutions • Coordination and Support Actions • Access to training CAD tools, advanced technologies, design kits, education blocks, prototyping • Roadmap, benchmark and strategy papers • Stimulation of young people towards electronics careers, training, education • International cooperation – Japan, USA, Taiwan, Korea • Support coordination and standartisation actions, preparatory work for 450 mm

  36. ICT Work Programme 2013 continuity with 2011-12 WP effective bridge to the next CSF for R&I. Budget: 1.53B€ Timing - three main phases: Options and orientations: Sept.- Dec. 2011 Drafting: Jan. - March/April 2012 Decision: April/May-July 2012

  37. 3 sets of challenges Societal Challenges Health and wellbeing; Safe food and sustainable agriculture; Secure, clean and efficient energy; Green transport; less congestion; Efficient use of resources & materials; Inclusive and safe society Creating Industrial Leadership & Competitive Frameworks Leadership in enabling technologies & FET; Access to risk finance; Integrating research, education and innovation; High potential SMEs Excellence in the Research Base Frontier research (ERC & FET), Skills and career development (Marie Curie); Research infrastructures incl. eInfrastructures Common Strategic Framework for EU R&I funding (2014+) A challenge oriented R&I framework A shift in the drive: From means/instruments to goals

  38. Four simplified funding schemes addressing: Roadmap-based partnerships (focus !) Open, light and fast scheme (be agile, flexible! ) R&I infrastructures, innovation clusters, skills (attract!) Pilot actions in real-life settings (test and diffuse!) Common Strategic Framework for EU R&I funding (2014+)

  39. Limited set of funding schemes - common across all activities Unique Rules for Participation of the CSF that will provide a set of common principles applicable to all actions Radically simplified cost-reimbursement approach with enhanced use of lump sums and flat rates Common Strategic Framework for EU R&I funding (2014+) Simplification

  40. Timeline February Green Paper 4.02.2011 European Council devoted to research & innovation Feb-May Consultation based on Green Paper 10.06.2011 Consultation ‘wrap-up’ event in Brussels June Proposal for next MАFF December Legislative Proposal(s) for CSF and impact assessment EuroSimE, 18-20.04.2011, Linz, Austria

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