1 / 9

Advanced Electronics Prototypes Development for Reliable Performance

This project involves producing prototypes for advanced electronics components, such as MASER and PHOENIX, with specific improvements needed for reliability and functionality. The prototypes are in various stages of production and testing, with adjustments being made for proper programming and assembly. Recommendations for corrections and enhancements have been identified for components, footprints, and connectors. Additionally, funding is being sought for further development and testing phases.

aremaley
Download Presentation

Advanced Electronics Prototypes Development for Reliable Performance

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. 6 prototypesproduced: • 2 protos in MASER (One in Valencia, Onesent to Nikhef) • 4 protos in PHOENIX • Proposal to have: • 2 Genova (One to Demokritos??) • 1 Bologna • 1 Nikhef • Alreadyunder test • FPGA programedproperly! • Flash programedafterchange of memory to oneSpansion of 256 Mbits (The Micro 1Gb wasnotsupportedby Xilinx)

  2. Footprint  U11 too narrow. Component soldered by hand and with some glue (Footprint to be corrected for the first preserie). • Footprint SW3 too wide. Grounds soldered with a wire (Footprint to be corrected for the first preserie) • Footprint U12 too wide. Soldered by hand (Footprint to be corrected for the first preserie) • Pad of transistors (SOT23) not seen (Footprint to be widen for the first preserie). The same for the 0402 components (No so clearly observer there) • Add label “+” and “-” near the power connector J2 • Flash N25Q1024 (1 Gb) is not programmable with the existing  Impact version. Change for S25FL256 (256 Mb) was done for the prototypes. Other programmable flash 1 Gb to put in the new footprint?

  3. Use proper tooling to assemble GBX connectors (see http://pi1222.physik.uni-erlangen.de/Electronics/19) • Tooling for power connector, Molex partno 62202-2580: http://www.molex.com/molex/products/datasheet.jsp?part=active/0622022580_APPLICATION_TOOLIN.xml • Tooling for backplane connector, Molex PartNo 62202-2510: http://www.molex.com/molex/products/datasheet.jsp?part=active/0622022510_APPLICATION_TOOLIN.xml • The Nano beacon connector (J22) should be moved since there is a mechanical conflicts with the Octopus Large board (http://pi1222.physik.uni-erlangen.de/Electronics/21). Note also that “J22” is missing on the silkscreen. • !!!Attention!!! The Power connector (J2) has a pin swap as compared to the CLBv1!

  4. Reliability: Presentresults of thederatingexcel file Checkwithsthephanehowtoprocceedwiththereliabilityanalysis • Ifspare time: • VisittheNikhefsetupforthe WR test onthe CLBv2 • Social dinnerthe 29 th • PleasecontactEls de Wolf orMyself

  5. The 25 160 T -2 for preserie-1 have already arrived! Applying for funding for the prototypes at the IFIC -> In two weeks time resolution

  6. CLBv2 PRR 4 and 5 March in Bologna?

More Related