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PACS IBDR. Budgets and Interfaces. Reinhard Katterloher. Instrument Interfaces to S/C. Mechanical interface FPU to OB Mechanical interface WE to SVM Mechanical interface BOLA to CVV Thermal interface FPU to S/C cooling system, FPU requires temperature level 0 and 1
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PACS IBDR Budgets and Interfaces • Reinhard Katterloher System Engineering
Instrument Interfaces to S/C • Mechanical interface FPU to OB • Mechanical interface WE to SVM • Mechanical interface BOLA to CVV • Thermal interface FPU to S/C cooling system, FPU requires temperature level 0 and 1 • Electrical interface WE to S/C • Electrical interface FPU to WE • Optical interface FPU to telescope beam • Optical interface FPU alignment cube to outside CVV alignment tools System Engineering
FPU and Interfaces Schematic System Engineering
FPU – OB interface (view to PACS FPU from below) System Engineering
Thermal Budget and Interface FPU - S/C cryostat • FPU requires two temperature levels- level 0 at nominal 1.7K (max. 1.75K accepted)- level 1 around 4K (max. 5.0K accepted) • Other temperatures inside the FPU are produced autonomously (2.2K blue array/ 0.3K bolometers) • Thermal coupling to level 0 via 4 heat straps • Thermal coupling to level 1 via 3 heat straps • FPU is thermally decoupled from OB by CFRP feet • Thermal loads and final heat fluxes can be calculated using the PACS TMM combined with the cryostat TMM System Engineering
Dissipated Heat Loads (input to TMM) System Engineering
Electrical Budget and interface FPU– WE– S/C • Harness as specified in PACS-MA-SP-001 has- total inside CVV: 1100 wires + 227 shields + 30 tbc overshields- total outside CVV/BOLA: 1148 wires + 233 shields + 30 tbc overshields • Power consumption of WE see separate table • Science data rate in PACS prime mode is 120 kbps average per day System Engineering
Mass and Size of Units System Engineering
Power Consumption on SVM Peak power consumptions and inrush currents are provided in IID-B CR-0011A Power dissipation in BOLA on CVV is 0.2W System Engineering