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Research on the Electromagnetic Interface of Wireless Systems

Research on the Electromagnetic Interface of Wireless Systems . 18 th November, 2004. CWSA Wireless Workshop William J. Chappell , Electrical and Computer Engineering Dept, Purdue University, West Lafayette, IN. Applied Electromagnetics at Purdue.

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Research on the Electromagnetic Interface of Wireless Systems

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  1. Research on the Electromagnetic Interface of Wireless Systems 18th November, 2004 CWSA Wireless Workshop William J. Chappell, Electrical and Computer Engineering Dept, Purdue University, West Lafayette, IN

  2. Applied Electromagnetics at Purdue • Our Concept for Future High Frequency Circuits • Current State of the Art for Commercial High Frequency Receivers • Active Research Topics in Applied Electromagnetics • DARPA TEAMS – Vertical Packaging of Mixed Signal Systems • DARPA Metamaterials – Composite Materials • 21st Century – High Frequency Advanced Substrates • NSF – RF Diversity for Sensor Networks • Dupont/Invista – Electrotextiles for High Frequency Antennas • Nexaura Systems– Z-axis Epoxy for High Density Interconnects • Conclusions on Status of the Field of Applied Electromagnetics

  3. Goals for our Research • Goal is to Establish Purdue as a Major Player in the Fields of Advanced Packaging and High Frequency System Integration Our “Concept Car” Vision of Future Microwave Systems Both heterogeneous materials and multidimensional electromagnetic designs must be understood

  4. Comparison with Commercial State of the Art Commercial Example of a High Frequency Circuit MaCom 24 GHz Pulsed Rear Looking Radar

  5. Comparison with Commercial State of the Art Commercial Example of a High Frequency Circuit MaCom 24 GHz Pulsed Rear Looking Radar

  6. DARPA TEAMS Vertically Integrated Mixed Signal Circuits

  7. DARPA TEAMS Vertically Integrated Mixed Signal Circuits } } Q~20 IC – Active Substrate } Q~200 Si InterPoser High Density, Low to Medium Q Components, Interconnects, and Distribution High-Q Components Layer High–Q Elements Embedded in A Low Loss Substrate Q~1,000 High-Q Layer – Larger, Ceramic Elements – Fewer Interconnects, More Volume Unlike Transistors - Passive Components are Not Better When They are Smaller

  8. Truly Three-dimensional Packaging Through Multilayer Polymer Processing Monopole # 354-401 “Sliced” CAD model (50 µm/layer) • Vertically integrated monopole with a cavity resonator • Layer-by-layer monolithic processing, high aspect ratio • Fast & maskless, >20 different 2D layouts, >400 layers are possible # 334-353 EmbeddedCavity # 325-333 Coax feed # 319-324 # 285-318 # 248-284 # 201-247 # 001-200 (Layer #)

  9. Monopole Embedded Cavity Layer 354-401 (a) Layer 334-353 Coax Feed Layer 325-333 Layer 319-324 Layer 285-318 (b) Layer 248-284 Layer 201-247 Layer 1-200 (c) Truly Three-dimensional Packaging Through Multilayer Polymer Processing Example Two-pole Filter Monolithic Three–Dimensional Package with Integrated Helix Antenna and Filtering

  10. Vertically Integrated Filter Using SL1 BW = 2%, IL = 0.27dB @ K Band • Q>2,000 • Footprint < λ2 • Vertical Integration Capability

  11. Field Plot of Vertical Filter Three dimensional solutions allow for previously unobtainable designs Full Wave Simulations Using Ansoft HFSS

  12. Integrated Vertical Packaging for RFICs RFIC

  13. DARPA Metamaterials Composite Materials for Electromagnetic Properties Not Found in Nature Periodic/ Artificial Substrates for High Frequency

  14. Frequency Kx = 0 Ky = 0 Kx = /t Ky = 0 Kx = /t Ky = /t Kx = 0 Ky = 0 Basic Principles of Periodic Materials Periodicity Creates Effective Medium Constructive and deconstructive reflections within periodic material

  15. Composite Materials for High-Frequency FiltersImproving material properties through embedded periodicity i. Bandgap Typical Dispersion Diagram of Composite Materials i. Bandgap Macro-Periodicity Periodic inclusions on the order of a /4 to create bandgap Frequency ii. Mesoscale Periodicity Periodic rods in host dielectric creates multiple reflections iii. Microscale Periodicity ii. Mesoscale Periodicity Periodicity on the order of a /10 to create effective medium inside of a cavity Kx = /t Ky = 0 Kx = /t Ky = /t Kx = 0 Ky = 0 Kx = 0 Ky = 0 Propagation vector For what reason? Low insertion loss, narrow-band preselect filters implying high-Q materials and resonators Internal patterning in ceramic layers creates synthesized dielectric iii. Microscale Periodicity Periodicity on the order of /100to create effective medium and anisotropic materials Example Filter I.L. 0.3 dB, BW 2.2% Porosity creates ability to have graded dielectrics within a single substrate

  16. ALC ALC 1 1 Up Converter Up Converter Device Device DRO 1 DRO 2 ... DRO n Ref. Ref. Driver Driver BFN BFN BFN Diplexer Diplexer 48 IF/A 48 Down Converter Down Converter T/R Electronics T/R Electronics IF/B Device Device Array Array Driver Driver Antenna Antenna Assembly Assembly Control/A Controller Controller Control/B Power Power Power Converter Converter Antenna Antenna Interface Interface Unit Unit MADL (K-Band Satellite Communication) Block Diagram Filters need to be inserted here

  17. MADL Antenna Description Antenna Interface Unit (AIU) Antenna Array Assembly (AAA) Flight Lead WB SATCOM Flight Lead LOS • Phased Array Antenna • Operating frequency: K–Band Size: ~3 inches diameter, ~2" deep • Intended to be installed in multiple locations on aircraft to provide a wide field of view

  18. Typical System is in LTCC without Preselect Filter • Filter with Q greater than 700 is needed • Filters need to be added to the MCM as layers within an LTCC package. 4-Element BGA MCM

  19. Bandgap Filter Results • Extruded High-K Material in a Polymer Host • r = 90, Allows Wider Bandgap • Electrically Smaller Filter than Alumina • I.L. = -1.1 dB for a 1 % filter • QUNLOADED ~ 1,100 0.88 mm E-field H-field “Wide Bandgap Composite EBG Substrates” AP Transactions - Special Session on Metamaterials - Accepted for Publication in 2003.

  20. New Indiana 21st Century Project Advanced Packaging for High Frequency Receivers – Commercialization of Next Generation of Satellite Radio Delphi, Dupont, CTS, Nexaura Systems, and Omega Wireless

  21. IC IC High-K passives PA Vertical Packaging for Satellite Radio Current Commercial Realizations of Automotive Receivers • Active Components • Numerous Picked and Spaced Circuits • Discrete Components • Individual L and C components • Package Components • Strictly a Carrier Intermediary Advanced Packaging Designs Ultimate Goal – Zero External Passives • Active Components • Separate IC’s IC • Active Component • 1 or 2 IC Circuits • Package Components • Hybrid Integrated High-K passive component bank • Buried Integrated Discrete Components Top Down • Package Components • Completely Buried Passive Components Sideview Exploded View of Layered Circuit Bluetooth Example

  22. Nexaura Z-axis Epoxy • Unpatterned interconnects through magnetically aligned • columns • Conducts current in • only one direction Epoxy No patterning Top Substrate Ideal Bottom Substrate Meas. Transmission (dB) Reflection (dB)

  23. NSF - Wireless Sensor Networks Diversity Enabled Sensor Motes • Semi-Directional Antennas for Selection Diversity in Sensor Network Nodes • Miniaturized Antennas Enabled Through Incorporation of High Dielectric Constant Materials • Testbed is Being Established with Wireless Sensor Boards • Each mote senses temperature, magnetic field, acoustics, light, and acceleration Cross-Layer Interaction Fault Tolerant Middleware Efficient Networking Advanced Polymer and Ceramic Processing Diversity Enabled Packaged Node Sensor Mote

  24. Comparison of Diversity Schemes Diversity Enabled Sensor Motes 802.11 Switched Polarization Diversity Full Diversity Schemes

  25. Diversity Schemes Diversity Enabled Sensor Motes SP4T Sensor Mote Switched Angle Diversity • Only hardware upgrade is a SP4T switch and multiple antenna • Uses The RSSI indicator to compare channels • One of the major problems is that motes are designed to work in free space. • Range is cut in half when it is set on the ground. Antenna impedance is altered

  26. Electrotextiles for High Frequency Antennas Sponsored By Invista/ Dupont Example Diversity Embedded Dipole Diversity Enabled by Multiple Antennas • Radiation from clothing enabled by textile conductors • Larger canvas for antenna designer Inner Surface Shields Outer Surface Radiates Inner Shield Blocks Energy

  27. Interaction with Wireless Center • Developed an Electromagnetics Teaching Laboratory • Experimental based curriculum for both graduate and undergraduate • Development of packaging and system integration capabilities • LTCC and traditional packaging prototyping • Interface wireless circuits with the Birck Nanotechnology Center and microelectronics facilities

  28. Conclusions • We are at a new age in high frequency circuits • The 80’s and the 90’s are well known as the decades of numerical solvers for three-dimensional electromagnetic problems • The question is no longer how do we analyze complex high frequency structures, but rather: • Why? • What are the applications that utilize these advances? • How do we design utilizing these advances? At Purdue, we are trying to answer these questions with the correct combination of theory, fabrication, design, and measurement.

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