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Module Decision - To Do List

Module Decision - To Do List. By pixel meetings associated with February 22-26, 1999 ATLAS week Beyond making and testing flex and MCM-D modules…. assume this will address electrical performance issues including comparison of efficiency threshold uniformity noise decoupling requirements etc

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Module Decision - To Do List

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  1. Module Decision - To Do List • By pixel meetings associated with February 22-26, 1999 ATLAS week • Beyond making and testing flex and MCM-D modules…. assume this will address electrical performance issues including comparison of • efficiency • threshold uniformity • noise • decoupling requirements • etc • Comparison of performance in the gap region between chips with flex and MCM-D options

  2. Module Decision - To Do List • Layout • Compatibility of MCM-D with disk support ring(longer module is problem - how bad) -> David B. • Sensitivity of disk layout taking into account changes in width of MCM-D module -> David B, Karl-Heinz • Monolithic shingled stave layout update since TDR -> Leo • Sensitivity of barrel layout to changes in width of MCM-D module -> Leo • Material • Update TDR needed? Gil, Karl-Heinz and Leo to check • Irradiation • Irradiate flex with components(but not MCC) to 25 Mrad with Cobalt - Gil • What else is realistic for MCM-D? Single chip????

  3. Module Decision - To Do List • Mechanics • Bias connection to MCM-D. Is “from backside” feasible particularly for disks? -> David B., Marco • Implications of backside chip ground connection for both flex and MCM-D? -> David and Marco and Karl-Heinz • Sensors • Any quantitative comparison possible regarding sensitivity to being near edge of wafer? -> sensor group discussion • Assessment of schedule impact on 2nd prototype fabrication of decision by February - sensor group • Wafer warpage measurements for MCM-D, implications for thinner wafers - Peter • Module connections • Worst case comparison of single cable power connections and optical connections to each module with strain relief - at least concept drawings for both flex and MCM-D. Karl-Heinz, Leo, Gil • Is MCM-D compatible with indium bumps(pressure during flip chip). Is there any way to tell? -> Karl-Heinz and Leo • Measure MCC temperature - Genoa • Evaluate temperature cycling effects for both flex and MCM-D. Includes measurements and estimates. Rusty and Karl-Heinz

  4. Module Decision - To Do List • Cost estimate • Do better job on flex cost estimates -> Rusty and Leo • Yield modeling • Propose to develop framework(spreadsheet) of yield model for module construction including all steps(as best we know them) to assess sensitivity to yield assumptions(including wire bonding) - Gil, Jean-Claude, + anyone else that is interested. • 1999 schedule • If chosen in February, what is the realistic prototype plan for • flex - Rusty, Giovanni, ….. • MCM-D - Karl-Heinz • with emphasis on meeting constraints from electronics, detectors…

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