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Implementation of a phased array antenna for the 2.45 GHz ISM band. Presented By: Alejandro Fuentes 260725 Ricardo Pérez 260769. Undergrad thesis. National university of Colombia GMUN - CMUN group 2008. Conrad project and our project logos. http://gmun.unal.edu.co/cmun.
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Implementation of a phased array antenna for the 2.45 GHz ISM band Presented By: Alejandro Fuentes 260725 Ricardo Pérez 260769 Undergrad thesis National university of Colombia GMUN - CMUN group 2008 Conrad project and our project logos. http://gmun.unal.edu.co/cmun
HIGH FRECUENCY CIRCUIT MATERIALS PROPERTIES UNAL 2008 Page 2
Materials properties Definitions Dielectric constant • Ratio of permittivity of a substance to permittivity of free space. • Ratio of capacitance between a system using a dielectric insulator versus using a vacuum. Dissipation factor (loss tangent) • Loss in insulator. • Ratio of energy loss in dielectric to energy stored in it per cycle. Source: [1] UNAL 2008 Page 3
Materials properties Considerations • εr changes wavelength and characteristic impedance. • High tolerance in εr cause unwanted reflections. • Dissipation factor must be low to avoid heat and adding extra items. Source: [1] UNAL 2008 Page 4
Materials properties Definitions Insulation resistance • Ability to resist the flow of current through the material. • Surface and volume resistivity. Dielectric strength • Voltage gradient an insulating material can resist before dielectric breakdown occurs. Dielectric breakdown : failure of insulating material to resist current flow. UNAL 2008 Page 5
Materials properties Considerations • Resistivity affects electrical performance of signal. • High values of resistivity ensure there is no leakage through dielectric. • Ensure the potential applied never reaches the dielectric strength value. • Thickness, frequency and environment affect dielectric strength. UNAL 2008 Page 6
Materials properties Definitions Moisture absorption • The amount of moisture, in percentage, that a material will absorb under specified conditions. Peel strength • Measure of the strength of an adhesive bond. UNAL 2008 Page 7
Materials properties Considerations • Moisture raise εr, this means that modifies wavelength and characteristic impedance. • Oxidation and thermal enviroment reduce bond strength. • Substrate must withstand respectives chemical processes. UNAL 2008 Page 8
High Frequency laminates table (Rogers corporation) Source: [1] UNAL 2008 Page 9
References • Literature about high frequency laminates. http://www.rogerscorp.com/acm/literature.aspx UNAL 2008 Page 10