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IPC/JEDEC INDUSTRY MAPPING

IPC/JEDEC INDUSTRY MAPPING. Agenda Item 6.2. 4th JIC meeting Regensburg, Germany June 17, 2003. Minimum IPC Standards Tool Kit. IPC STANDARDS MAP. IPC STANDARDS MAP (cont.). ASSEMBLY. J-STD-001 Soldering Electrical and Electronic Assemblies IPC-HDBK-001

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IPC/JEDEC INDUSTRY MAPPING

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  1. IPC/JEDEC INDUSTRY MAPPING Agenda Item 6.2 4th JIC meeting Regensburg, Germany June 17, 2003

  2. Minimum IPC Standards Tool Kit

  3. IPC STANDARDS MAP

  4. IPC STANDARDS MAP (cont.)

  5. ASSEMBLY • J-STD-001 Soldering Electrical and Electronic Assemblies • IPC-HDBK-001 Handbook & Guide to Supplement J-STD-001 • IPC-9261 In-Process DPMO and Estimated Yield for PWAs • IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies

  6. IPC-DRM-40 Through-Hole Solder Joint Evaluation Desk Reference Manual IPC-A-610 Acceptability of Electronic Assemblies IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) IPC-DRM-SMT Surface Mount Solder Joint Evaluation Desk Reference Manual ACCEPTANCE

  7. IPC-WP-001 Soldering Capability White Paper Report J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003 Solderability Tests for Printed Boards IPC-WP-005 PWB Surface Finishes IPC-TR-461 Solderability Evaluation of Thick & Thin Fused Coatings IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-Term Storage SOLDERABILITY

  8. IPC-TR-464 Accelerated Aging for Solderability Evaluations IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase 11A IPC-TR-466 Wetting Balance Standard Weight Comparison Test SOLDERABILITY (cont.)

  9. IPC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology IPC-WP-003 Chip Mounting Technology J-STD-012 Implementation of Flip Chip and Chip Scale Technology J-STD-013 Implementation of Ball Grid Array & Other High Density Technology J-STD-026 Semiconductor Design Standard for Flip Chip Applications J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation IPC-MC-790 Guidelines for Multichip Module Technology Utilization ADVANCED

  10. IPC-WHMA-A-620 Requirements & Acceptance for Cable & Wire Harness Assemblies WIRE HARNESS

  11. IPC-0040 Optoelectronic Assembly and Packaging Technology OPTOELECTRONICS

  12. SMC-WP-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires IPC-DRM-18 Component Identification Desk Reference Manual IPC-DW-426 Specification for Assembly of Discrete Wiring IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC-TA-722 Technology Assessment Handbook on Soldering IPC-TA-723 Technology Assessment Handbook on Surface Mounting IPC-CM-770 Component Mounting Guidelines for Printed Boards ASSEMBLY SUPPORT

  13. IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments IPC-S-816 SMT Process Guideline & Checklist IPC-AJ-820 Assembly & Joining Handbook IPC-TP-1115 Selection and Implementation Strategy for A Low-Residue No-Clean Process IPC-1720 Assembly Qualification Profile ASSEMBLY SUPPORT(cont.)

  14. IPC-7095 Design and Assembly Process Implementation for BGA's IPC-7525 Stencil Design Guidelines IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes IPC-7711 Rework of Electronic Assemblies IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments IPC-9851 Equipment Interface Specification ASSEMBLY SUPPORT(cont.)

  15. J-STD-004 Requirements for Soldering Fluxes J-STD-005 Requirements for Soldering Pastes J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders IPC-TP-1043 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 IPC-TP-1044 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2 ASSEMBLY MATERIALS FLUX/SOLDER

  16. IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives IPC-CA-821 General Requirements for Thermally Conductive Adhesives IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films ASSEMBLY MATERIALS (cont.) ADHESIVES

  17. IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies IPC-HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings IPC-SM-840 Qualification and Performance of Permanent Solder Mask ASSEMBLY MATERIALS (cont.) COAT/MASK

  18. PCB / ACCEPTANCE • IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards • IPC-QE-605 Printed Board Quality Evaluation Handbook • IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards • IPC-MC-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards • IPC-1710 OEM Standard for Printed Board Manufacturers'Qualification Profile (MQP)

  19. IPC-6011 Generic Performance Specification for Printed Boards IPC-6012 Qualification and Performance Specification for Rigid Printed Boards IPC-6013 Qualification & Performance Specification for Flexible Printed Boards IPC-6015 Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards IPC-6018 Microwave End Product Board Inspection and Test PCB / ACCEPTANCE (cont.)

  20. IPC/JPCA-6202 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA-6801 Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards IPC-A-600 Acceptability of Printed Boards PCB / ACCEPTANCE (cont.)

  21. COMPONENTS • J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices • J-STD-032 Performance Standard for Ball Grid Array Balls • J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices • J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

  22. COMPONENTS (cont.) • IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components • IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components • IPC-9503 Moisture Sensitivity Classification for Non-IC Components • IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

  23. CLEANING/ CLEANLINESS • IPC-SC-60 Post Solder Solvent Cleaning Handbook • IPC-SA-61 Post Solder Semi-Aqueous Cleaning Handbook • IPC-AC-62 Aqueous Post Solder Cleaning Handbook • IPC-CH-65 Guidelines for Cleaning of Printed Boards & Assemblies • IPC-TR-468 Factors Affecting Insulation Resistance Performance of Printed Boards • IPC-TR-476 Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

  24. CLEANING/ CLEANLINESS (cont.) • IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results • IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study • IPC-TR-582 Cleaning & Cleanliness Test Program for: Phase 3-Low Solids Fluxes & Pastes Processed in Ambient Air • IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing • IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines • IPC-9201 Surface Insulation Resistance Handbook

  25. LAMINATE FLEX • IPC-FC-234 PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits • IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry • IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films • IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry • IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

  26. RIGID IPC-4101 Specifications for Base Materials for Rigid and Multilayer Printed Boards IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications IPC-1730 Laminator Qualification Profile HDI IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials IPC-SM-840 Qualification and Performance of Permanent Solder Mask LAMINATE (cont.)

  27. LAMINATE (cont.) FOIL • IPC-CF-148 Resin Coated Metal for Printed Boards • IPC-CF-152 Composite Metallic Materials Specification for Printed Wiring Boards • IPC-1731 Strategic Raw Materials Supplier Qualification Profile • IPC-4562 Metal Foil for Printed Wiring Applications

  28. FABRICATION • IPC-DR-570 General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards • IPC-DR-572 Drilling Guidelines for Printed Boards • IPC-OI-645 Standard for Visual Optical Inspection Aids • IPC-TA-724 Technology Assessment Series on Clean Rooms • IPC-PE-740 Troubleshooting for Printed Board Manufacture and Assembly

  29. REINFORCEMENT • IPC-4412 Specification for Finished Fabric Woven from "E" Glass for Printed Boards • IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards • IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards • IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards • IPC-1731 Strategic Raw Materials Supplier Qualification Profile

  30. REINFORCEMENT (cont.) • IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards • IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications • IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass Mat • IPC-4411 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement

  31. ASSEMBLY • IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies • IPC-D-326 Information Requirements for Manufacturing Electronic Assemblies • IPC-C-406 Design & Application Guidelines for Surface Mount Applications Connectors • IPC-C-408 Design & Application Guidelines for the Use of Solderless Surface Mount Connectors • IPC-SM-782 Surface Mount Design & Land Pattern Standard

  32. INTERFACES • IPC-D-310 Guidelines for Phototool Generation and Measurement Techniques • IPC-A-311 Process Controls for Phototool Generation and Use • IPC-D-350 Printed Board Description in Digital Form • IPC-D-351 Printed Board Drawings in Digital Form • IPC-D-356 Bare Substrate Electrical Test Data Format • IPC-D-390 Automated Design Guidelines

  33. INTERFACES • IPC-2511 Generic Requirements for Implementation of Product Mfg. Description Data & Transfer Methodology • IPC-2531 Standard Recipe File Format Specification • IPC-2541 Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX) • IPC-2571 Generic Requirements for Electronics Mfg. Supply Chain Communication - Product Data eXchange (PDX)

  34. PCB • SMC-WP-004 Design for Success • IPC-2252 Design Guide for RF/Microwave Circuit Boards • IPC-D-317 Design Guidelines for Electronic Packaging Utilizing High Speed Techniques • IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits • IPC-1902 Grid Systems for Printed Circuits • IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design

  35. IPC-2221 Generic Standard on Printed Board Design IPC-2222 Sectional Standard on Rigid Organic Printed Boards IPC-2223 Sectional Design Standard for Flexible Printed Boards IPC-2224 Sectional Standard of Design of PWB for PC Cards IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies IPC-2315 Design Guide for High Density Interconnects & Microvias IPC-2615 Printed Board Dimensions and Tolerances PCB (cont.)

  36. JEDEC: IEC PAS ACTIVITY • EIA/JESD22-B102C • 47/1446/PAS IEC 62173 Ed. 1: • Solderability test method • JESD22-B106-B • 47/1447/PAS: IEC 60749-15, Ed. 1: • Resistance to soldering temperature for through-hole mounted devices • EIA/JESD-22-B107-A • 47/1448/PAS: IEC 62175, Ed. 1: • Marking Permanency • 47/1629/MCR: Published as part of IEC 60749-9, Ed. 1 • EIA/JESD22-B116 • 47/1449/PAS: IEC 62176, Ed. 1: • Wire bond shear test method • 47/1482A/RVD Withdrawal of 47/1449/PAS

  37. JEDEC: IEC PAS ACTIVITY • JESD22-A110B-B • 47/1450/PAS: IEC 62177, Ed. 1: • Highly-accelerated temperature and humidity stress test (HAST) • 47/1627/MCR Published as part of IEC 60749-4, Ed. 1 • JESD22-A104-A • 47/1451/PAS: IEC 62178, Ed. 1: • Temperature cycling • EIA/JESD22-A114-A • 47/1452/PAS: IEC 62179, Ed. 1: • Electrostatic discharge (ESD) sensitivity testing human body model (HBM) • EIA/JESD22-A115-A • 47/1453/PAS: IEC 62180, Ed. 1: • Electrostatic discharge (ESD) sensitivity testing machine model (MM)

  38. JEDEC: IEC PAS ACTIVITY • JESD78 • 47/1454/PAS: IEC 62181, Ed. 1: • IC latch-up test • JESD22-A113-B • 47/1455/PAS: IEC 62182, Ed. 1: • Preconditioning of nonhermetic surface mount devices prior to reliability testing • JESD22-A107-A • 47/1456/PAS: IEC 62183, Ed. 1: • Salt atmosphere • 47/1633/MCR: Published as part of IEC 60749-13, Ed. 1 • JESD22-B105-B • 47/1457/PAS: IEC 62184, Ed. 1: • Lead integrity

  39. JEDEC: IEC PAS ACTIVITY • JESD22-A106-A • 47/1458/PAS: IEC 62185, Ed. 1: • Thermal shock • 47/1631/MCR: Published as part of IEC 60749-11, Ed. 1 • JESD22-B104-A • 47/1459/PAS: IEC 62186, Ed. 1: • Mechanical shock • 47/1630/MCR: Published as part of IEC 60749-10. Ed. 1 • JESD22-B103-A • 47/1460/PAS: IEC 62187, Ed. 1: • A vibration, variable frequency • 47/1632/MCR: Published as part of IEC 60749-12, Ed. 1 • JESD22-A101-B • 47/1461/PAS: IEC 62161, Ed.1: • Test method A101-B – Steady state temperature humidity bias life test • 47/1680/MCR: Published as IEC 60749-5, Ed. 1

  40. JEDEC: IEC PAS ACTIVITY • JESD22-C101 • 47/1462/PAS: IEC 60749-28, Ed. 1: • Test method C101 – Electrostatic Discharge (ESD) Sensitivity Testing – Charged device model (CDM) • JESD22-B101 • 47/1463/PAS: IEC 62163, Ed. 1: • Test method B101 – External Visual • 47/1626/MCR: Published as part of IEC 60749-3, Ed. 1 • JEP118 • 47/1464/PAS: IEC 62164, Ed. 1: • Guidelines for GaAs MMIC and FET life testing • JEP110 • 47/1465/PAS: IEC 62165, Ed. 1: • Guidelines for the measurement of thermal resistance of GaAs FETs • EIA/JESD46-A • 47/1466/PAS: IEC 62166, Ed. 1: • Guidelines for user notification of product/process changes by semiconductor suppliers

  41. JEDEC: IEC PAS ACTIVITY • EIA/JESD48 • 47/1467/PAS: IEC 62167, Ed. 1: • Product discontinuance • JEP 113-B • 47/1468/PAS: IEC 62168, Ed. 1: • Symbols and labels for moisture-sensitive devices • IPC/JEDEC J-STD-033 • 47/1469/PAS: IEC 62169, Ed. 1: • Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices • EIA/JESD59 • 47/1470/PAS: IEC 62170, Ed. 1: • Bond wire modeling standard • JEP114 • 47/1471/PAS: IEC 62171, Ed. 1: • Guidelines for particle impact noise detection (PIND) testing, operator training and certification • 47/1681/MCR: Published as 60749-16, Ed. 1

  42. JEDEC: IEC PAS ACTIVITY • JESD22-A102-B • 47/1472/PAS: IEC 62172, Ed. 1: • Accelerated moisture resistance – Unbiased autoclave • JESD22-A108-A • 47/1474/PAS: IEC 62189, Ed. 1: • Bias Life • J-STD-020A (IPC/JEDEC) • 47/1475/PAS: IEC 62190, Ed. 1: • Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices • 47/1592/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 (2001-10) and IEC 60749, Ed. 2.2 (2001-12). • J-STD-035 • 47/1476/PAS: IEC 62191, Ed. 1: • Acoustic microscopy for nonhermetic encapsulated electronic components • 47/1593/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)

  43. JEDEC: IEC PAS ACTIVITY • JEP119 • 47/1506/PAS: IEC 62201, Ed. 1: • A procedure for executing sweat • EIA/JEP122 • 47/1507/PAS: IEC 62202, Ed. 1: • Failure mechanisms and models for silicon semiconductor devices • EIA/JEP128 • 47/1508/PAS: IEC 62203, Ed. 1: • Guide for standard probe pad sizes and layouts for wafer-level electrical testing • EIA/JESD33-A • 47/1509/PAS: IEC 62204, Ed. 1: • Measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line • JESD-A103-A • 47/1513/PAS: IEC 60749-6 Ed. 1: • High temperature storage life • 47/1628/MCR: Published as part of IEC 60749-6, Ed. 1

  44. JEDEC: IEC PAS ACTIVITY • EIA/JESD22-A105-B • 47/1514/PAS: IEC 62206, Ed. 1: • Test Method A105-B – Power and temperature cycling • JESD22-A109 • 47/1515/PAS: IEC 62207, Ed. 1: • Test Method A109 – Hermeticity • 47/1594/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 (2001-10) and by IEC 60749, Ed. 2.2 (2001-12) • JESD22-A120 • 47/1595/PAS: IEC 62307 • Test Method for the Measurement of Moisture Diffusivity and Water Solubility in organic Materials Used in Integrated Circuits • JESD22-A118 • 47/1635/PAS: IEC PAS 62336: • Accelerated Moisture Resistance – Unbiased HAST

  45. IPC: IEC PAS ACTIVITY • IPC-EIA/J-STD-012 • IEC/PAS 62084 • Flip chip and chip scale technology implementation • IPC-EIA/J-STD-013 • IEC/PAS 62085 • Implementation of ball grid array and other high density technology • IPC-2511 • IEC/PAS 62119 • Generic requirements for implementation of product manufacturing description data and transfer methodology • IPC-6202 • IEC/PAS 62123 Ed. 1.0 • Performance guide Manual for single- and double-sided flexible printed wiring boards • IPC-4130 • IEC/PAS 62212 • Specification and characterization methods for nonwoven "E" glass mat

  46. IPC: IEC PAS ACTIVITY • IPC-4411 • IEC/PAS 62213 • Specification and characterization methods for nonwoven para-aramid reinforcement • IPC-6011 • IEC/PAS 62214 • Generic performance specification for printed boards • IPC-1710 • IEC/PAS 62158 Ed. 1.0 • Manufacturers qualification profile (MQP) • IPC-1720 • IEC/PAS 62159 Ed. 1.0 • Assembly qualification profile (AQP)

  47. IPC: IEC PAS ACTIVITY • IPC-1730 • IEC/PAS 62160 Ed. 1.0 • Laminator qualification profile • IPC-6013 (with amendment) • IEC/PAS 62249 /ED, 1,9 • Qualification and performance specification for flexible printed boards • IPC-6012 (with amendment) • IEC/PAS 62250 • Qualification and performance specification for rigid printed boards

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